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    • 1. 发明申请
    • Active Planar Autofocus
    • 主动平面自动对焦
    • US20120008137A1
    • 2012-01-12
    • US12833093
    • 2010-07-09
    • Scott A. YoungDaniel L. CavanYale ZhangAviv Balan
    • Scott A. YoungDaniel L. CavanYale ZhangAviv Balan
    • G01N21/84
    • G01N21/956G01N21/9501
    • A system for inspecting a constant layer depth relative to a particular device layer. The system has an image sensor with a fixed focal plane. A focus sensor senses the surface topography of the substrate and outputs a focus data stream. A stage moves the substrate in an XY plane, and a motor moves the substrate in a Z dimension. A controller operates the system in one of a setup mode and an inspection mode. In the setup mode the controller controls XY movement of the substrate so as to scan a first portion of the substrate. The controller receives the focus data stream, concurrently receives XY data, and stores correlated XYZ data for the substrate. In the inspection mode the controller controls XY movement of the substrate so as to scan a second portion of the substrate. The controller receives the focus data stream, concurrently receives XY data, and subtracts the stored Z data from the focus data stream to produce a virtual data stream. The controller feeds the virtual data stream plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance, regardless of the surface topography of the substrate.
    • 用于检查相对于特定器件层的恒定层深度的系统。 该系统具有一个具有固定焦平面的图像传感器。 聚焦传感器感测基板的表面形貌并输出焦点数据流。 台架在XY平面上移动基板,马达使基板移动Z轴。 控制器以设置模式和检查模式之一操作系统。 在设置模式下,控制器控制衬底的XY运动,以扫描衬底的第一部分。 控制器接收聚焦数据流,同时接收XY数据,并存储基板的相关XYZ数据。 在检查模式中,控制器控制衬底的XY运动,以扫描衬底的第二部分。 控制器接收聚焦数据流,同时接收XY数据,并从聚焦数据流中减去存储的Z数据,以产生虚拟数据流。 控制器将虚拟数据流和偏移量馈送到电动机,以在检查期间上下移动衬底,从而将焦平面保持在期望的Z距离,而不管衬底的表面形貌如何。
    • 2. 发明授权
    • Inspection system for array of microcircuit dies having redundant
circuit patterns
    • 具有冗余电路图案的微电路芯片阵列检测系统
    • US4806774A
    • 1989-02-21
    • US60090
    • 1987-06-08
    • Lawrence H. LinDaniel L. CavanRobert B. Howe
    • Lawrence H. LinDaniel L. CavanRobert B. Howe
    • G01B11/24G01N21/88G01N21/956H01L21/66G02B27/42
    • G01N21/95623
    • An inspection system (10, 100) employs a Fourier transform lens (34, 120) and an inverse Fourier transform lens (54, 142) positioned along an optic axis (48, 144) to produce from an illuminated area of a patterned specimen wafer (12) a spatial frequency spectrum whose frequency components can be selectively filtered to produce an image pattern of defects in the illuminated area of the wafer. Depending on the optical component configuration of the inspection system, the filtering can be accomplished by a spatial filter of either the transmissive (50) or reflective (102) type. The lenses collect light diffracted by a wafer die (14) aligned with the optic axis and light diffracted by other wafer dies proximately located to such die. The inspection system is useful for inspecting only dies having many redundant circuit patterns. The filtered image strikes the surface of a two-dimensional photodetector array (58) which detects the presence of light corresponding to defects in only the illuminated on-axis wafer die. Inspection of all possible defects in the portions of the wafer surface having many redundant circuit patterns is accomplished by mounting the wafer onto a two-dimensional translation stage and moving the stage (40) so that the illuminated area continuously scans across the wafer surface from die to die until the desired portions of the wafer surface have been illuminated. The use of a time delay integration technique permits continuous stage movement and inspection of the wafer surface in a raster scan fashion.
    • 3. 发明授权
    • Rotatable and translatable mounting mechanism for a specimen pattern in
optical processing apparatus
    • 光学加工设备中样品图案的可旋转和可平移安装机构
    • US4659172A
    • 1987-04-21
    • US736230
    • 1985-05-20
    • Daniel L. Cavan
    • Daniel L. Cavan
    • G03H1/00G01N21/956G06K9/74G11B7/09G03H1/02G03H1/22
    • G06K9/74G01N21/95623
    • A translatable and rotatable mechanism is employed in optical processing apparatus for exposing a specimen pattern and inspecting light pattern or image developed from it. The mounting mechanism includes a plate that is rotatably mounted on a linear positioning table assembly. The plate includes a substrate arm and a camera arm that extend in opposite directions from the axis of rotation of the plate. The specimen pattern, such as a photomask, is positioned on the free end of the substrate arm, and a video camera is positioned on the free end of the camera arm. Whenever the plate is rotated to an exposure orientation, the photomask diffracts light rays emanating from a laser. The diffracted light rays interfere with a reference beam to form a hologram. Whenever the plate is rotated 180.degree. to an inspection orientation, a reconstructed imate of the photomask appears at the location where the photomask was positioned during exposure. The video camera is positioned directly beneath the reconstructed image and scans it by the translational movement of the positioning table. A microscope is mounted to a stationary support and is positioned over the photomask. The video camera and the microscope observe corresponding regions of the image and the photomask, respectively, in synchronism for all translational movements of the plate.
    • 在光学处理设备中采用可平移和可旋转的机构,用于暴露样本图案并检查从其开发的光图案或图像。 安装机构包括可旋转地安装在线性定位台组件上的板。 板包括从板的旋转轴线相反的方向延伸的基板臂和相机臂。 诸如光掩模的标本图案位于基板臂的自由端上,并且摄像机位于相机臂的自由端上。 每当板旋转到曝光方向时,光掩模衍射从激光发出的光线。 衍射光线与参考光束相干以形成全息图。 每当板旋转180°到检查方向时,光掩模的重建图案出现在曝光期间光掩模位置的位置。 摄像机位于重建图像正下方,并通过定位台的平移运动进行扫描。 显微镜安装在固定支架上并位于光掩模上方。 视频摄像机和显微镜分别观察图像和光掩模的相应区域,同时对于板的所有平移运动。
    • 4. 发明授权
    • Active planar autofocus
    • 主动平面自动对焦
    • US08643835B2
    • 2014-02-04
    • US12833093
    • 2010-07-09
    • Scott A. YoungDaniel L. CavanYale ZhangAviv Balan
    • Scott A. YoungDaniel L. CavanYale ZhangAviv Balan
    • G01N21/00G01B11/14G06K9/00
    • G01N21/956G01N21/9501
    • A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.
    • 一种用于使用具有固定焦平面的传感器检查相对于层的深度的系统。 聚焦传感器感测基板的表面并输出焦点数据。 在设置模式下,控制器扫描基板的第一部分,接收聚焦数据和XY数据,并存储基板的相关XYZ数据。 在检查模式下,控制器扫描基板的第二部分,接收焦点数据和XY数据,并从焦点数据中减去存储的Z数据,以产生虚拟数据。 控制器将虚拟数据加上偏移量供给电机,以在检查期间上下移动基板,从而将焦平面保持在所需的Z距离。
    • 5. 发明授权
    • Method and apparatus for identifying defects in a substrate surface by using dithering to reconstruct under-sampled images
    • 用于通过使用抖动来重建欠采样图像来识别衬底表面中的缺陷的方法和装置
    • US07227984B2
    • 2007-06-05
    • US10379236
    • 2003-03-03
    • Daniel L. Cavan
    • Daniel L. Cavan
    • G06K9/00G06K9/32G01N21/00
    • G06T3/4069G06T2207/30148
    • A surface inspection apparatus in accordance with the principles of the invention includes an optical system having a plurality of time delay integration (TDI) sensors. The plurality of TDI sensors are arranged to generate a plurality of images of an object so that the images are offset a sub-pixel distance from each other. A scanning element enables the TDI sensors to scan the object so successive images of the object can be generated. Image processing circuitry is used to process the plurality of successive images together to produce a reconstructed image of the object having increased pixel density. The embodiments of the invention also include methods for generating reconstructed images from a plurality of TDI images obtained from at least two offset TDI sensors.
    • 根据本发明的原理的表面检查装置包括具有多个时间延迟积分(TDI)传感器的光学系统。 多个TDI传感器被布置成生成对象的多个图像,使得图像彼此偏移子像素距离。 扫描元件使TDI传感器能够扫描对象,从而可以生成对象的连续图像。 图像处理电路用于一起处理多个连续图像以产生具有增加的像素密度的对象的重建图像。 本发明的实施例还包括从从至少两个偏移TDI传感器获得的多个TDI图像中生成重建图像的方法。
    • 6. 发明授权
    • Method and apparatus for detecting defect information in a holographic
image pattern
    • 用于检测全息图像图案中的缺陷信息的方法和装置
    • US4811409A
    • 1989-03-07
    • US838319
    • 1986-03-10
    • Daniel L. Cavan
    • Daniel L. Cavan
    • G01N21/956G06K9/00
    • G01N21/956
    • A method and an apparatus detect in a light pattern the presence of defects (10') in a photomask (10) to which the light pattern corresponds. An inspection area (36) that includes the light pattern is partitioned into stripe regions (72). The width (70) of a stripe region corresponds to the maximum extent of the image window (54) of a charge-coupled camera device (42) that is employed to scan continuously each stripe region at a nominally constant speed. Each stripe region is divided into a first array (90) of pixel elements (92) arranged in rows (94) and columns (96). The camera device comprises plural light detecting elements (84) that are arranged in a second array (82) of rows (86) and columns (88). The camera continuously traverses the columns of the first array in a direction along the length of the stripe region and acquires in row-by-row fashion quantities of charge which correspond to the intensities of the light present in the pixel elements with which the light detecting elements are aligned. The charge quantity measured for each pixel element in a row is shifted serially along a corresponding column of the second array in synchronism with, but in a direction opposite to, the motion of the camera device. The total charge quantity for each pixel element appears in the last row of light detecting elements. Each total charge quantity is converted to digital form by an analog-to-digital converter (222) and is then transferred to a threshold detector (224) which determines whether the quantity of light indicates the presence of a defect in the photomask.
    • 一种方法和装置以光图案检测光图案对应的光掩模(10)中的缺陷(10')的存在。 包括光图案的检查区域(36)被分割成条纹区域(72)。 条带区域的宽度(70)对应于电荷耦合相机装置(42)的图像窗口(54)的最大范围,其用于以标称恒定速度连续扫描每个条带区域。 每个条带区域被划分为排列成行(94)和列(96)的像素元件(92)的第一阵列(90)。 相机装置包括布置在行(86)和列(88)的第二阵列(82)中的多个光检测元件(84)。 照相机沿着条带区域的长度方向连续地横过第一阵列的列,并且逐行地获取与存在于光检测的像素元件中的光的强度相对应的电荷量 元素对齐。 对于每个像素元件测量的电荷量与相机装置的运动同步但沿着与相机装置的运动相反的方向,沿着第二阵列的对应列逐行地偏移。 每个像素元件的总电荷量出现在最后一行光检​​测元件中。 每个总电荷量由模拟 - 数字转换器(222)转换成数字形式,然后被传送到阈值检测器(224),阈值检测器(224)确定光量是否指示光掩模中是否存在缺陷。
    • 7. 发明授权
    • Specimen distance measuring system
    • 标本测距系统
    • US4788431A
    • 1988-11-29
    • US36731
    • 1987-04-10
    • William A. EckesLee VeneklasenGlen E. HowardDonald J. McCarthyAllen M. CarrollDaniel L. Cavan
    • William A. EckesLee VeneklasenGlen E. HowardDonald J. McCarthyAllen M. CarrollDaniel L. Cavan
    • G01B15/00G01Q20/04G01Q30/02H01J37/20H01J37/244H01J37/304H01L21/027
    • H01J37/244H01J37/20H01J37/304H01J2237/2441H01J2237/2446H01J2237/24475H01J2237/24578
    • A specimen distance measuring system uses a plate (36) to obstruct the flux of backscattered electrons produced by an electron beam (18), and to cast a shadow across a measurement detector (32) which is sensitive to the position of the shadow. The shadow plate (36) and measurement detector (32) are aligned at an angle of approximately 45 degrees with a substrate (14) in order to allow calibration of the distance measuring system by scanning the electron beam (18). The measuring system is particularly useful as a height sensor (10) in an electron beam lithography apparatus (12) for sensing the height of a substrate (14). The distance measuring system may also include a reference detector (34) which is positioned in order to receive backscattered electron flux without obstruction from the shadow plate (36). The use of such a reference detector (32) is advantageous in allowing compensation of the signals obtained by the measurement detector, in order to allow the height sensor to operate independently of variations in electron beam current, and variations in substrate backscatter coefficient. The reference and measurement detectors (34,32) may be aligned in a vertical or horizontal plane to be either parallel to or perpendicular to the bombardment electron beam (18). Active feedback may be provided from the height sensor (10) to a vertical stage actuator for adjusting the height of the substrate (14).
    • 样本距离测量系统使用板(36)来阻挡由电子束(18)产生的背向散射电子的通量,并且跨越对阴影位置敏感的测量检测器(32)投射阴影。 阴影板(36)和测量检测器(32)以大约45度的角度与衬底(14)对准,以便允许通过扫描电子束(18)校准距离测量系统。 该测量系统特别适用于用于感测衬底(14)的高度的电子束光刻设备(12)中的高度传感器(10)。 距离测量系统还可以包括参考检测器(34),其被定位以便接收反向散射的电子通量而不受到遮挡板(36)的阻碍。 使用这种参考检测器(32)有利于允许补偿由测量检测器获得的信号,以便允许高度传感器独立于电子束电流的变化以及衬底反向散射系数的变化而工作。 参考和测量检测器(34,32)可以在垂直或水平平面中对准以与轰击电子束(18)平行或垂直于轰击电子束(18)。 主动反馈可以从高度传感器(10)提供到用于调节基板(14)的高度的垂直级致动器。
    • 8. 再颁专利
    • Inspection system for array of microcircuit dies having redundant
circuit patterns
    • USRE33956E
    • 1992-06-09
    • US613208
    • 1990-11-14
    • Lawrence H. LinDaniel L. CavanRobert B. Howe
    • Lawrence H. LinDaniel L. CavanRobert B. Howe
    • G01N21/956
    • G01N21/95623
    • An inspection system (10, 100) employs a Fourier transform lens (34, 120) and an inverse Fourier transform lens (54, 142) positioned along an optic axis (48, 144) to produce from an illuminated area of a patterned specimen wafer (12) a spatial frequency spectrum whose frequency components can be selectively filtered to produce an image pattern of defects in the illuminated area of the wafer. Depending on the optical component configuration of the inspection system, the filtering can be accomplished by a spatial filter of either the transmissive (50) or reflective (102) type. The lenses collect light diffracted by a wafer die (14) aligned with the optic axis and light diffracted by other wafer dies proximately located to such die. The inspection system is useful for inspecting only dies having many redundant circuit patterns. The filtered image strikes the surface of a two-dimensional photodetector array (58) which detects the presence of light corresponding to defects in only the illuminated on-axis wafer die. Inspection of all possible defects in the portions of the wafer surface having many redundant circuit patterns is accomplished by mounting the wafer onto a two-dimensional translation stage and moving the stage (40) so that the illuminated area continuously scans across the wafer surface from die to die until the desired portions of the wafer surface have been illuminated. The use of a time delay integration technique permits continuous stage movement and inspection of the wafer surface in a raster scan fashion.