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1. 发明授权

US06838009B2 Rework method for finishing metallurgy on chip carriers 失效
标题翻译：在芯片载体上完成冶金的返工方法
公开(公告)号：US06838009B2
公开(公告)日：2005-01-04
申请号：US10016009
申请日：2001-10-30
申请人： Charles L. Arvin , Daniel G. Berger , Hsichang Liu , Krystyna W. Semkow
发明人： Charles L. Arvin , Daniel G. Berger , Hsichang Liu , Krystyna W. Semkow
IPC分类号： C23F1/44 , H01L21/48 , H05K3/06 , H05K3/22 , H05K3/24 , H01B13/00 , H01L21/00
CPC分类号： C23F1/44 , H01L21/4853 , H05K3/067 , H05K3/225 , H05K3/244 , H05K2203/025 , H05K2203/0361
摘要： A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper/nickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel layer and then the component is treated to remove etch and corrosion products. Media blasting is then used to restore the pads to their original condition as on prime parts. The pads are then replated using conventional nickel and gold plating solutions to form the reworked component.
摘要翻译：提供了一种用于对电子部件的焊盘上的整理冶金进行返工的方法和装置。垫是铜或铜/镍，并且在其上具有一层镍层和金的上覆层。金层首先被除去，然后是镍层，然后处理该组分以除去蚀刻和腐蚀产物。然后使用介质爆破将焊盘恢复到原始状态，如主要部件。然后使用常规的镍和镀金溶液重新填充焊盘以形成返工部件。

2. 发明授权

US06529021B1 Self-scrub buckling beam probe 失效
标题翻译：自清洗屈曲光束探头
公开(公告)号：US06529021B1
公开(公告)日：2003-03-04
申请号：US09558428
申请日：2000-04-25
申请人： Yuet-Ying Yu , Daniel G Berger , Camille Proietti Bowne , Scott Langenthal , Charles H Perry , Terence Spoor , Thomas Weiss
发明人： Yuet-Ying Yu , Daniel G Berger , Camille Proietti Bowne , Scott Langenthal , Charles H Perry , Terence Spoor , Thomas Weiss
IPC分类号： G01R1067
CPC分类号： G01R1/07357 , G01R1/07314
摘要： A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test. The exit angle of the wire tip is controlled by the relative displacement of the offset die relative to the bottom die, such that the exit angle of the tip of the wire at the bottom die changes when the probe wire is under compression. By applying a reciprocating motion to the tip of the wire contacting the surface of the device under test, a scrubbing motion is achieved that lowers the resistance between the pad of the device under test. In this manner, the tip of the wire cleans the surface of the pads and prevents contaminants from adhering to the tip of the wire.
摘要翻译：描述了用于接触位于被测器件上的焊盘阵列的自擦洗屈曲光束接触器。接触器由三个绝缘模具组成：一个顶部，一个偏移部分和一个下模具，通过可变厚度的绝缘垫片相互分离。每个模具都有孔。屈曲梁具有基本上垂直于模具定位的柔性线阵列，每个柔性线与顶部，偏移和下模中的每一个中的相应孔交叉，以允许每根线分别接触被测器件的焊盘。通过相对于偏移模具的中心移动下模的孔的中心，线的尖端相对于由被测器件的焊盘形成的平面以一定角度从下模出射。线尖的出射角由偏移模具相对于底模的相对位移控制，使得当探针线处于压缩状态时，底模处的线的尖端的出射角改变。通过向接触被测器件表面的电线的尖端施加往复运动，实现了降低被测器件的焊盘之间的电阻的擦洗运动。以这种方式，电线的尖端清洁焊盘的表面，并防止污染物粘附到电线的尖端。

3. 发明授权

US5310625A Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester 失效
标题翻译：使用交联聚酰胺酯的碱处理形成聚酰亚胺的负色调图像的方法
公开(公告)号：US5310625A
公开(公告)日：1994-05-10
申请号：US101261
申请日：1993-08-03
申请人： Marie Angelopoulos , Daniel G. Berger , Jeffrey W. Labadie , Eric D. Perfecto , Martha I. Sanchez , Sally A. Swanson , Willi Volksen
发明人： Marie Angelopoulos , Daniel G. Berger , Jeffrey W. Labadie , Eric D. Perfecto , Martha I. Sanchez , Sally A. Swanson , Willi Volksen
IPC分类号： G03F7/027 , C08F283/04 , C08G73/10 , G03F7/028 , G03F7/038 , G03F7/38 , G03F7/40 , H01L21/027 , G03C5/56
CPC分类号： C08G73/1025 , C08F283/04 , G03F7/0387 , G03F7/40
摘要： The present invention relates to an improved process for forming negative tone images of photosensitive polyimides on a substrate having improved wall angles.
摘要翻译：本发明涉及一种用于在具有改进的壁角的基板上形成感光性聚酰亚胺的负色调图像的改进方法。

4. 发明授权

US07329439B2 UV-curable solvent free compositions and use thereof in ceramic chip defect repair 有权
标题翻译： UV固化无溶剂组合物及其在陶瓷芯片缺陷修复中的应用
公开(公告)号：US07329439B2
公开(公告)日：2008-02-12
申请号：US10953752
申请日：2004-09-29
申请人： Krishna G. Sachdev , Daniel G. Berger , Kelly M. Chioujones , Brian W. Quinlan
发明人： Krishna G. Sachdev , Daniel G. Berger , Kelly M. Chioujones , Brian W. Quinlan
IPC分类号： C08J3/28 , C09D3/34 , C08K3/34 , C08K13/02
CPC分类号： H05K3/287 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H05K1/0306 , H05K3/0023 , H05K3/225 , H05K3/386 , H05K2201/0209 , H05K2201/0212 , H01L2924/00
摘要： Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer/oligomer with reactive end groups, a monofunctional and/or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated/methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc. A nano-filler may also be used as the inorganic filler alone or in combination with another inorganic filler such as talc. A method is also provided for repairing defects on ceramic substrates using the composition of the invention or other curable polymeric compositions.
摘要翻译：提供衍生自反应性有机单体，低聚物和低分子聚合物体系的混溶混合物以及有机和无机填料如聚四氟乙烯和滑石的无溶剂紫外线固化聚合物材料，以形成用于制造和修复的聚合物 - 填料复合组合物电子元件和微电子组装工艺。组合物含有具有反应性端基的预成型热塑性或弹性聚合物/低聚物，单官能和/或双官能丙烯酸酯单体，多官能（多于两个反应性基团）丙烯酸酯化/甲基丙烯酸酯化的单体，光引发剂和作为有机填料的氟碳聚合物粉末其优选为PTFE和无机填料如滑石。纳米填料也可以单独使用，也可以与其它无机填料如滑石一起使用。还提供了使用本发明的组合物或其它可固化的聚合物组合物修复陶瓷基底上的缺陷的方法。

5. 发明授权

US07255153B2 High performance integrated MLC cooling device for high power density ICS and method for manufacturing 有权
标题翻译：高性能集成MLC冷却装置，用于高功率密度ICS和制造方法
公开(公告)号：US07255153B2
公开(公告)日：2007-08-14
申请号：US10908758
申请日：2005-05-25
申请人： Daniel G. Berger , Raschid J. Bezama , Lester W. Herron , Bruno Michel , Govindarajan Natarajan
发明人： Daniel G. Berger , Raschid J. Bezama , Lester W. Herron , Bruno Michel , Govindarajan Natarajan
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10S165/908 , H01L2924/00
摘要： A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.
摘要翻译：一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或冷却。歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。

6. 发明授权

US5300403A Line width control in a radiation sensitive polyimide 失效
标题翻译：辐射敏感聚酰亚胺中的线宽控制
公开(公告)号：US5300403A
公开(公告)日：1994-04-05
申请号：US900975
申请日：1992-06-18
申请人： Marie Angelopolus , Daniel G. Berger , Eric D. Perfecto , Peter J. Wilkens
发明人： Marie Angelopolus , Daniel G. Berger , Eric D. Perfecto , Peter J. Wilkens
IPC分类号： G03F7/038 , G03F7/40 , H01L21/027 , G03C5/00
CPC分类号： G03F7/40
摘要： Standard processing techniques for creating a patterned polyimide film from a radiation sensitive polyimide film forming composition are modified to include a post-develop, flood exposure/hardening step which crosslinks precursors of the polyimide film prior to curing. The flood exposure/hardening step prevents pull-back of the wall profile which occurs during the shrinkage of radiation sensitive polyimide film forming composition which occurs during thermal curing.
摘要翻译：用于从辐射敏感的聚酰亚胺膜形成组合物形成图案化聚酰亚胺膜的标准加工技术被修改为包括在固化之前交联聚酰亚胺膜的前体的后显影，泛光曝光/硬化步骤。淹水/硬化步骤防止在热固化期间发生的辐射敏感性聚酰亚胺膜形成组合物的收缩期间发生的壁轮廓的拉回。

7. 发明授权

US5209817A Selective plating method for forming integral via and wiring layers 失效
标题翻译：形成集成通孔和布线层的选择电镀方法
公开(公告)号：US5209817A
公开(公告)日：1993-05-11
申请号：US748445
申请日：1991-08-22
申请人： Umar M. Ahmad , Daniel G. Berger , Ananda Kumar , Susan J. LaMaire , Keshav B. Prasad , Sudipta K. Ray , Kwong H. Wong
发明人： Umar M. Ahmad , Daniel G. Berger , Ananda Kumar , Susan J. LaMaire , Keshav B. Prasad , Sudipta K. Ray , Kwong H. Wong
IPC分类号： H01L23/498 , H01L23/522 , H05K1/03 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/46
CPC分类号： H05K3/4644 , H01L23/49827 , H01L23/5226 , H05K3/4605 , H05K3/465 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/0154 , H05K2201/0187 , H05K2203/0597 , H05K2203/072 , H05K3/0023 , H05K3/061 , H05K3/108 , H05K3/184 , H05K3/388 , H05K3/4661
摘要： In a multi-level wiring structure wires and vias are formed by an isotropic deposition of a conductive material, such as copper, on a dielectric base, such as a polyimide. In a preferred embodiment of the invention copper is electroplated to a thin seed conducting layer deposited on the surface of the dielectric base in which via openings have been formed. Openings in a resist formed on the surface of the dielectric base over the seed layer forms a pattern defining the wiring and via conductor features. Electroplated copper fills the via openings and wire pattern openings in the resist isotropically so that the upper surfaces of the wiring and vias are co-planar when the plating step is complete. In adding subsequent wiring levels, the resist is removed and the via conductor and wiring pattern covered with another dielectric layer which both encapsulates the conductors of the previous layer and serves as the base for the next level which is formed in the same manner as the previous level.
摘要翻译：在多层布线结构中，通过诸如铜之类的导电材料的各向同性的沉积，形成导线和通孔，在诸如聚酰亚胺的电介质基底上。在本发明的一个优选实施例中，将铜电镀到沉积在已经形成通孔开口的电介质基底的表面上的薄种子传导层。在种子层上形成在电介质基底表面上的抗蚀剂中的开口形成限定布线和通孔导体特征的图案。电镀铜在各向同性地填充抗蚀剂中的通孔开口和线图案开口，使得当电镀步骤完成时，布线和通孔的上表面是共面的。在添加其后的布线层次时，去除抗蚀剂，并且通孔导体和布线图案被另一个介电层覆盖，该介质层既封装了前一层的导体并用作下一层的基底，其形成方式与前述水平。

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