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1. 发明授权

US08211330B2 Latent curing agent for epoxy resin and method for manufacturing the same 有权
标题翻译：环氧树脂的潜在固化剂及其制造方法
公开(公告)号：US08211330B2
公开(公告)日：2012-07-03
申请号：US12078165
申请日：2008-03-27
申请人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
发明人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
IPC分类号： C09K3/00 , C08L63/00 , C08G59/18 , C08G59/68
CPC分类号： C08G18/6484
摘要： A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct. After the slurry was cooled, the polyfunctional isocyanate compound is added thereto to crosslink the ethyl cellulose film.
摘要翻译：提供一种潜在的环氧树脂固化剂，其可以在不需要使用痛苦的试错误选择方法的两亲性聚合物化合物的情况下制造，显示出优异的耐溶剂性和低温快速固化能力，并且含有咪唑类化合物作为主要零件。在含有咪唑类化合物作为主要成分的潜在环氧树脂固化剂中，环氧类化合物和咪唑类化合物的加合物颗粒用乙基纤维素膜包覆，其表面与多官能团异氰酸酯化合物。环氧类化合物，咪唑类化合物和乙基纤维素在搅拌和加热下溶解在预定的饱和烃类溶剂中。然后，将环氧类化合物和咪唑类化合物进行加合反应，得到加合物的淤浆。在浆料冷却后，加入多官能异氰酸酯化合物以使乙基纤维素膜交联。

2. 发明申请

US20080161589A1 Latent Curing Agent 有权
标题翻译：潜在固化剂
公开(公告)号：US20080161589A1
公开(公告)日：2008-07-03
申请号：US11884527
申请日：2006-06-02
申请人： Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
发明人： Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
IPC分类号： C07F5/06
CPC分类号： C07F7/21
摘要： An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily.The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.
摘要翻译：提供一种能够在短时间内在相对较低温度的条件下固化热固性环氧树脂的铝螯合物系潜在性固化剂。此外，提供了一种用于制造潜在性固化剂的方法，其中可以相对容易地控制铝螯合物类潜在性固化剂的固化条件。铝螯合物系潜在性固化剂是通过使铝螯合剂与倍半硅氧烷型氧杂环丁烷衍生物在水不溶性或难溶于水的纤维素醚存在下反应制备的，由此赋予延迟性能。该潜在性固化剂含有由水不溶性或难溶于水的纤维素醚构成的涂层。优选地，用异氰酸酯化合物处理表面。

3. 发明授权

US08147720B2 Latent curing agent 有权
标题翻译：潜在固化剂
公开(公告)号：US08147720B2
公开(公告)日：2012-04-03
申请号：US12223869
申请日：2007-12-27
申请人： Katsuhiko Komuro , Masahiko Ito , Daisuke Masuko
发明人： Katsuhiko Komuro , Masahiko Ito , Daisuke Masuko
IPC分类号： H01B1/00
CPC分类号： C08L71/00 , C07F7/21 , C08G59/70 , C08G2650/56 , C08J3/241 , H05K3/323
摘要： An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.
摘要翻译：提供了一种铝螯合物潜固化剂，其可在短时间内以相对较低的温度固化热固性环氧树脂。还提供了一种可以相对容易地控制其固化条件的这种基于铝螯合物的潜在性固化剂的制造方法。通过在脂环族环氧化合物的存在下使倍半硅氧烷型氧杂环丁烷衍生物与铝螯合剂反应，使铝螯合物系潜在性固化剂成为潜在的。

4. 发明授权

US09155207B2 Method for producing an anisotropic conductive film 有权
标题翻译：各向异性导电膜的制造方法
公开(公告)号：US09155207B2
公开(公告)日：2015-10-06
申请号：US13606994
申请日：2012-09-07
申请人： Masahiko Ito , Daisuke Masuko
发明人： Masahiko Ito , Daisuke Masuko
IPC分类号： H01R9/00 , H05K3/32 , H05K3/10
CPC分类号： H05K3/323 , H05K3/102 , H05K2203/105 , H05K2203/1344 , H05K2203/1355 , H05K2203/1366 , Y10T428/25
摘要： An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
摘要翻译：含有树脂膜的各向异性导电膜; 以及相对于树脂膜的厚度方向与树脂膜相邻或相对于树脂膜的一个平面排列成单层的导电性粒子，其中树脂膜的一个面与导电性粒子的中心之间的距离基于10点平均值为9μm以下。

5. 发明授权

US08128837B2 Latent curing agent for epoxy resin and method for manufacturing the same 有权
标题翻译：环氧树脂的潜在固化剂及其制造方法
公开(公告)号：US08128837B2
公开(公告)日：2012-03-06
申请号：US12078156
申请日：2008-03-27
申请人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
发明人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
IPC分类号： C09K3/00 , C08L63/00 , C08G59/18 , C08G59/68
CPC分类号： C08G18/6484 , C08G18/7664 , C08G18/7671 , H05K3/323
摘要： A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.
摘要翻译：提供一种潜在的环氧树脂固化剂，其具有优异的耐溶剂性和低温快速固化能力，并且含有咪唑类化合物作为主要成分。在含有咪唑类化合物作为主要成分的潜在环氧树脂固化剂中，通过环氧类化合物与微粒状咪唑类化合物的加成反应而形成的加合物粒子被乙基纤维素膜包覆。此外，加合物颗粒的表面可以与多官能异氰酸酯化合物交联。在预定的饱和烃类溶剂中将环氧类化合物，微粒状咪唑类化合物和乙基纤维素的混合物在搅拌下加热。然后，将环氧类化合物和微粒状咪唑类化合物进行加合反应，得到加合物的淤浆。在浆液冷却后，过氧化潜在的环氧树脂固化剂。

6. 发明申请

US20120328794A1 Anisotropic Conductive Film, Method for Producing the Same, and Joined Structure Using the Same 有权
标题翻译：各向异性导电膜，其制造方法和使用其的结合结构
公开(公告)号：US20120328794A1
公开(公告)日：2012-12-27
申请号：US13606994
申请日：2012-09-07
申请人： Masahiko ITO , Daisuke Masuko
发明人： Masahiko ITO , Daisuke Masuko
IPC分类号： H01R43/00
CPC分类号： H05K3/323 , H05K3/102 , H05K2203/105 , H05K2203/1344 , H05K2203/1355 , H05K2203/1366 , Y10T428/25
摘要： An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
摘要翻译：含有树脂膜的各向异性导电膜; 以及相对于树脂膜的厚度方向与树脂膜相邻或相对于树脂膜的一个平面排列成单层的导电性粒子，其中树脂膜的一个面与导电性粒子的中心之间的距离基于10点平均值为9μm以下。

7. 发明申请

US20080249258A1 Latent curing agent for epoxy resin and method for manufacturing the same 有权
标题翻译：环氧树脂的潜在固化剂及其制造方法
公开(公告)号：US20080249258A1
公开(公告)日：2008-10-09
申请号：US12078165
申请日：2008-03-27
申请人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
发明人： Daisuke Masuko , Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima
IPC分类号： C08G18/58
CPC分类号： C08G18/6484
摘要： A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct. After the slurry was cooled, the polyfunctional isocyanate compound is added thereto to crosslink the ethyl cellulose film.
摘要翻译：提供一种潜在的环氧树脂固化剂，其可以在不需要使用痛苦的试错误选择方法的两亲性聚合物化合物的情况下制造，显示出优异的耐溶剂性和低温快速固化能力，并且含有咪唑类化合物作为主要零件。在含有咪唑类化合物作为主要成分的潜在环氧树脂固化剂中，环氧类化合物和咪唑类化合物的加合物颗粒用乙基纤维素膜包覆，其表面与多官能团异氰酸酯化合物。环氧类化合物，咪唑类化合物和乙基纤维素在搅拌和加热下溶解在预定的饱和烃类溶剂中。然后，将环氧类化合物和咪唑类化合物进行加合反应，得到加合物的淤浆。在浆料冷却后，加入多官能异氰酸酯化合物以使乙基纤维素膜交联。

8. 发明申请

US20100188829A1 ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND JOINED STRUCTURE USING THE SAME 审中-公开
标题翻译：各向异性导电膜，其制造方法和使用其的接合结构
公开(公告)号：US20100188829A1
公开(公告)日：2010-07-29
申请号：US12727346
申请日：2010-03-19
申请人： Masahiko Ito , Daisuke Masuko
发明人： Masahiko Ito , Daisuke Masuko
IPC分类号： H01R4/58 , B05D1/04 , B32B5/16 , H01R11/01 , H01B5/16 , H01R43/00
CPC分类号： H05K3/323 , H05K3/102 , H05K2203/105 , H05K2203/1344 , H05K2203/1355 , H05K2203/1366 , Y10T428/25
摘要： An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 μm or less based on 10-point average.
摘要翻译：含有树脂膜的各向异性导电膜; 以及相对于树脂膜的厚度方向与树脂膜相邻或相对于树脂膜的一个平面排列成单层的导电性粒子，其中树脂膜的一个面与导电性粒子的中心之间的距离基于10点平均值为9μm以下。

9. 发明申请

US20090230360A1 Latent Curing Agent 审中-公开
标题翻译：潜在固化剂
公开(公告)号：US20090230360A1
公开(公告)日：2009-09-17
申请号：US12227905
申请日：2008-01-17
申请人： Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima , Daisuke Masuko
发明人： Katsuhiko Komuro , Masahiko Ito , Tadasu Kawashima , Daisuke Masuko
IPC分类号： H01B1/12 , C08L63/00 , C08L23/18
CPC分类号： C08G59/70 , C08G59/24 , C08L63/00 , H05K3/323
摘要： An aluminum chelate-based latent curing agent, which can cure a thermosetting epoxy resin at a relatively low temperature in a short time, is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound, and then further reacting the resultant mixture with a liquid epoxy resin and an imidazole compound or with an aromatic vinyl compound and a radical polymerization initiator.
摘要翻译：通过在脂环族环氧化合物的存在下使硅倍半氧烷型氧杂环丁烷衍生物与铝螯合剂反应，可以在短时间内在相对低的温度下固化热固性环氧树脂的铝螯合物系潜在性固化剂然后使所得混合物与液体环氧树脂和咪唑化合物或芳族乙烯基化合物和自由基聚合引发剂进一步反应。

10. 发明授权

US07557230B2 Latent curing agent 有权
标题翻译：潜在固化剂
公开(公告)号：US07557230B2
公开(公告)日：2009-07-07
申请号：US11884527
申请日：2006-06-02
申请人： Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
发明人： Katsuhiko Komuro , Tadasu Kawashima , Masahiko Ito , Daisuke Masuko
IPC分类号： C07F7/02 , C11D3/39
CPC分类号： C07F7/21
摘要： An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily.The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.
摘要翻译：提供一种能够在短时间内在相对较低温度的条件下固化热固性环氧树脂的铝螯合物系潜在性固化剂。此外，提供了一种用于制造潜在性固化剂的方法，其中可以相对容易地控制铝螯合物类潜在性固化剂的固化条件。铝螯合物系潜在性固化剂是通过使铝螯合剂与倍半硅氧烷型氧杂环丁烷衍生物在水不溶性或难溶于水的纤维素醚存在下反应制备的，由此赋予延迟性能。该潜在性固化剂含有由水不溶性或难溶于水的纤维素醚构成的涂层。优选地，用异氰酸酯化合物处理表面。

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