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    • 7. 发明授权
    • Method for power routing and distribution in an integrated circuit with multiple interconnect layers
    • 具有多个互连层的集成电路中的电力布线和分配方法
    • US06308307B1
    • 2001-10-23
    • US09240126
    • 1999-01-29
    • Francisco A. CanoDavid A. ThomasClive Bittlestone
    • Francisco A. CanoDavid A. ThomasClive Bittlestone
    • G06F1750
    • G06F17/5068G06F17/5077G06F2217/78H01L23/5286H01L2924/0002H01L2924/00
    • An integrated circuit 210 has a power grid formed from a first set of power buses 201a and 202a on a metal interconnect level M1, a second set of power buses 203a and 204a on interconnect level M4, and a third set of power buses 205a and 206a on inter-connect level M5. The set of power buses on level M4 are oriented in the same direction as the set of power buses on level M1, and both sets of buses are located coincidentally. A high power logic cell 220 is pre-defined with a set of M1-M4 power vias 221 and 222 so that logic cell 220 can be positioned in a horizontal row unconstrained by pre-positioned M1-M4 power vias. Dummy cell 230 with M1-M4 power vias is positioned as needed so as not to exceed a maximum strapping distance D1. A maximum value for distance D1 is selected based on dynamic power requirements of nearby logic cells 250a-n as determined by simulation. A method for designing and fabricating integrated circuit 210 is described.
    • 集成电路210具有由金属互连级M1上的第一组电源总线201a和202a形成的电网,以及互连级M4上的第二组电源总线203a和204a以及第三组电源总线205a和206a 在连接间级别M5上。 M4级的电力总线集合方向与M1级的电力总线相同,两组总线同时定位。 高功率逻辑单元220用一组M1-M4电源通孔221和222预定义,使得逻辑单元220可以被定位在不受预定义的M1-M4电源通孔约束的水平行中。 具有M1-M4电源通孔的假电池230根据需要定位,以便不超过最大捆扎距离D1。 基于通过仿真确定的附近的逻辑单元250a-n的动态功率要求来选择距离D1的最大值。 描述了集成电路210的设计和制造方法。
    • 8. 发明授权
    • High speed flip-flop for gate array
    • 门阵列高速触发器
    • US5612632A
    • 1997-03-18
    • US346562
    • 1994-11-29
    • Shivaling Mahant-ShettiKevin OvensClive BittlestoneRobert C. MartinRobert J. Landers
    • Shivaling Mahant-ShettiKevin OvensClive BittlestoneRobert C. MartinRobert J. Landers
    • H03K3/037H03K3/356H03K19/173H03K19/00
    • H03K3/356173H03K3/037H03K3/356156
    • A flip-flop includes a data storage node for driving an inverter (62) and transfer gate (64) combination to transfer data stored on the data node (60) to a master storage node (66). A master cross-coupled latch (68) has two cross-coupled inverters (72) and (74) connected thereto such that the master storage node (66) is only connected to one side of the latch (68). The data node (66) directly drives a slave stage comprised of an inverter (76) and transfer gate (78) which in turn drives a slave storage node (80). The slave storage node (80) is connected to a slave cross-coupled latch (82) comprised of cross-coupled inverters (86) and (88). The slave storage node (80) comprises the Q-output of the inverter. The data is transferred to storage node (66) on the negative going edge of the clock signal and latched thereto on the positive going edge of the clock signal. ON the positive going edge of the clock signal, data is transferred from the storage node (66) to the slave storage node (80) and then latched in the latch (82) on the negative going edge of the clock signal. This results in a minimum number of inverters, thus decreasing the Clock-to-Q time.
    • 触发器包括用于驱动逆变器(62)和传送门(64)组合以将存储在数据节点(60)上的数据传送到主存储节点(66)的数据存储节点。 主交叉耦合锁存器(68)具有连接到其上的两个交叉耦合的反相器(72)和(74),使得主存储节点(66)仅连接到锁存器(68)的一侧。 数据节点(66)直接驱动由逆变器(76)和传输门(78)组成的从动级,后者又驱动从存储节点(80)。 从存储节点(80)连接到由交叉耦合的反相器(86)和(88)组成的从交叉耦合锁存器(82)。 从存储节点(80)包括逆变器的Q输出。 数据被传送到时钟信号的负向边缘上的存储节点(66),并在时钟信号的正向沿被锁存在存储节点(66)上。 在时钟信号的正向边缘上,数据从存储节点(66)传送到从存储节点(80),然后锁存在时钟信号的负沿的锁存器(82)中。 这导致最小数量的反相器,从而减少了Clock-to-Q时间。
    • 9. 发明授权
    • Flip flop with reduced leakage current
    • 触发器具有减少的漏电流
    • US06781411B2
    • 2004-08-24
    • US10256302
    • 2002-09-27
    • Donald E. SteissClive BittlestonePeter CummingChristopher Barr
    • Donald E. SteissClive BittlestonePeter CummingChristopher Barr
    • H03K19173
    • H03K3/012H03K3/35625H03K17/693
    • A flip flop (30) comprising a master stage (34) comprising a first plurality of transistors (54, 56), wherein each of the first plurality of transistors comprises a selective conductive path between a source and drain. The flip flop also comprises a slave stage (42) comprising a second plurality of transistors (60, 62, 64, 66), wherein each of the second plurality of transistors comprises a selective conductive path between a source and drain. For the flip flop, in a low power mode the flip flop is operable to receive a first voltage (VDD) coupled to the selective conductive path for each of the first plurality of transistors. Also in the low power mode, the flip flop is operable to receive a second voltage (VDDL) coupled to the selective conductive path for each of the second plurality of transistors. Lastly, the second voltage is greater than the first voltage in the low power mode.
    • 一种触发器(30),包括包括第一多个晶体管(54,56)的主级(34),其中所述第一多个晶体管中的每一个包括在源极和漏极之间的选择性导电路径。 触发器还包括由第二多个晶体管(60,62,64,66)组成的从级(42),其中第二多个晶体管中的每一个包括在源极和漏极之间的选择性导电路径。 对于触发器,在低功率模式下,触发器可操作以接收耦合到第一多个晶体管中的每一个的选择导电路径的第一电压(VDD)。 同样在低功率模式下,触发器可操作以接收耦合到第二多个晶体管中的每一个的选择性导电路径的第二电压(VDDL)。 最后,第二电压大于低功率模式下的第一电压。
    • 10. 发明授权
    • Method for power routing and distribution in an integrated circuit with multiple interconnect layers
    • 具有多个互连层的集成电路中的电力布线和分配方法
    • US06581201B2
    • 2003-06-17
    • US09969378
    • 2001-10-02
    • Francisco A. CanoDavid A. ThomasClive Bittlestone
    • Francisco A. CanoDavid A. ThomasClive Bittlestone
    • G06F1750
    • G06F17/5068G06F17/5077G06F2217/78H01L23/5286H01L2924/0002H01L2924/00
    • An integrated circuit 210 has a power grid formed from a first set of power buses 201a and 202a on a metal interconnect level M1, a second set of power buses 203a and 204a on interconnect level M4, and a third set of power buses 205a and 206a on interconnect level M5. The set of power buses on level M4 are oriented in the same direction as the set of power buses on level M1, and both sets of buses are located coincidentally. A high power logic cell 220 is pre-defined with a set of M1-M4 power vias 221 and 222 so that logic cell 220 can be positioned in a horizontal row unconstrained by pre-positioned M1-M4 power vias. Dummy cell 230 with M1-M4 power vias is positioned as needed so as not to exceed a maximum strapping distance D1. A maximum value for distance D1 is selected based on dynamic power requirements of nearby logic cells 250a-n as determined by simulation. A method for designing and fabricating integrated circuit 210 is described.
    • 集成电路210具有由金属互连级M1上的第一组电源总线201a和202a形成的电网,以及互连级M4上的第二组电源总线203a和204a以及第三组电源总线205a和206a 在互连级别M5上。 M4级的电力总线集合方向与M1级的电力总线相同,两组总线同时定位。 高功率逻辑单元220用一组M1-M4电源通孔221和222预定义,使得逻辑单元220可以被定位在不受预定义的M1-M4电源通孔约束的水平行中。 具有M1-M4电源通孔的假电池230根据需要定位,以便不超过最大捆扎距离D1。 基于通过仿真确定的附近的逻辑单元250a-n的动态功率要求来选择距离D1的最大值。 描述了集成电路210的设计和制造方法。