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    • 3. 发明授权
    • Multilayered ceramic electronic component
    • 多层陶瓷电子元件
    • US08570710B2
    • 2013-10-29
    • US13356320
    • 2012-01-23
    • Jong Han KimHyun Chul Jeong
    • Jong Han KimHyun Chul Jeong
    • H01G4/06
    • H01G4/005H01G4/12H01G4/30
    • There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein when a region in which the internal electrodes are overlapped is defined as an active region in a cross section of a central portion in a length direction of the ceramic body, taken in width and thickness directions thereof, the entire area of the cross section taken in the width and thickness directions is defined as At, and an area of the active region is defined as Aa, the following equation is satisfied: 65%≦Aa/At≦90%.
    • 提供具有0603尺寸以下的多层陶瓷电子部件,所述多层陶瓷电子部件包括:陶瓷体,包括设置在所述内部电极之间的多个内部电极和电介质层; 以及设置在所述陶瓷体的外表面并与内部电极电连接的外部电极,其中,当内部电极重叠的区域被定义为在所述内部电极的长度方向上的中心部分的截面中的有源区域 陶瓷体的宽度方向和厚度方向的截面宽度和厚度方向的整个面积被定义为At,有源区域的面积被定义为Aa,满足下式:65% @Aa / At @ 90%。
    • 5. 发明授权
    • Asynchronous upsizing circuit in data processing system
    • 数据处理系统中的异步升压电路
    • US08443122B2
    • 2013-05-14
    • US12917854
    • 2010-11-02
    • JaeGeun YunJunhyung UmWoo-Cheol KwonHyun-Joon KangBub-chul Jeong
    • JaeGeun YunJunhyung UmWoo-Cheol KwonHyun-Joon KangBub-chul Jeong
    • G06F3/00G06F5/00
    • G06F13/4059
    • An asynchronous upsizing circuit in a data processing system. The asynchronous upsizing circuit includes an asynchronous packer and an asynchronous unpacker. The asynchronous packer includes a write buffer commonly used for an asynchronous bridge and for upsizing and for buffering a write channel data; and first and second asynchronous packing controllers controlling channel compaction according to first and second clocks, respectively, regarding the write channel data inputted/outputted to/from the write buffer during a burst write operation. The asynchronous unpacker includes a read buffer commonly used for an asynchronous bridge and for upsizing and for buffering a read channel data; and first and second asynchronous unpacking controllers controlling channel compaction according to the first and second clocks, respectively, regarding the read channel data inputted/outputted to/from the read buffer during a burst read operation.
    • 数据处理系统中的异步增大电路。 异步升压电路包括异步封隔器和异步解包器。 异步封隔器包括通常用于异步桥的写入缓冲器,并且用于增大和缓冲写通道数据; 以及第一和第二异步打包控制器,分别根据第一和第二时钟控制在突发写入操作期间输入/输出到写入缓冲器的写入通道数据的通道压缩。 异步解包器包括通常用于异步网桥的读缓冲器,并用于增大和缓冲读通道数据; 以及分别针对在突发读取操作期间从读取缓冲器输入/输出的读通道数据,分别根据第一和第二时钟控制信道压缩的第一和第二异步解包控制器。
    • 7. 发明申请
    • MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    • 多层陶瓷电子元件及其制造方法
    • US20130063862A1
    • 2013-03-14
    • US13333359
    • 2011-12-21
    • Jong Han KIMHyun Chul JeongJae Man Park
    • Jong Han KIMHyun Chul JeongJae Man Park
    • H01G4/008B32B38/14
    • H01G4/30H01G4/005
    • There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 μm≦te≦0.5 μm and (td+te)/te≦2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm≦Ra≦30 nm, 150 nm≦Rz≦td/2, and 8≦Rz/Ra≦20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.
    • 提供了一种多层陶瓷电子部件,包括:包括电介质层的陶瓷主体; 以及在陶瓷主体内部彼此相对配置的内部电极,介电层插入其间,其中,当电介质层的平均厚度为td,内部电极的平均厚度为te时,为0.1μm< lE; te≦̸ 0.5 并且当内部电极的虚拟表面粗糙度中心线上的平均表面粗糙度为Ra并且内部电极的10个点的平均粗糙度为Rz时,为5nm& nlE;并且(td + te)/te& Ra和nlE; 30nm,150nm和nlE; Rz& NlE; td / 2和8≦̸ Rz / Ra≦̸ 20。 多层陶瓷电子部件通过提高介电层与内部电极之间的粘合强度和耐电压特性而具有优异的可靠性。