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    • 5. 发明授权
    • Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method, and method of optimizing recipe of cleaning process for process chamber
    • 用于制造半导体器件的化学气相沉积设备,其驱动方法和优化处理室清洗过程配方的方法
    • US06432838B1
    • 2002-08-13
    • US09496315
    • 2000-02-01
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • H01L2131
    • C23C16/4405
    • There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS). According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF3 gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.
    • 提供了一种通过使用残留气体分析仪四极质谱仪(RGA-QMS)在半导体晶片上的特定工艺之后优化处理室的原位清洗工艺的方法。 根据本发明,用于制造半导体器件的化学气相沉积(CVD)装置包括:处理室; 工艺气体供应管线,用于将处理气体供应到处理室中; 用于从处理室中除去废气的废气排放管线; 用于将ClF 3气体供应到处理室中的供应管线; 采样歧管,用于通过使用压力差来对处理室内的气体进行采样; 和用于分析取样气体的RGA-QMS,并通过上述RGA-QMS的分析实现了根据工艺室清洁过程的气体流量,压力和温度对端点进行优化。
    • 6. 发明授权
    • Chemical vapor deposition apparatus for manufacturing semiconductor devices
    • 用于制造半导体器件的化学气相沉积设备
    • US06279503B1
    • 2001-08-28
    • US09183599
    • 1998-10-29
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • C23C1600
    • C23C16/4405
    • There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS). According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a CiF3 gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.
    • 提供了一种通过使用残留气体分析仪四极质谱仪(RGA-QMS)在半导体晶片上的特定工艺之后优化处理室的原位清洗工艺的方法。 根据本发明,用于制造半导体器件的化学气相沉积(CVD)装置包括:处理室; 工艺气体供应管线,用于将处理气体供应到处理室中; 用于从处理室中除去废气的废气排放管线; 用于将CiF3气体供应到处理室中的供应管线; 采样歧管,用于通过使用压力差来对处理室内的气体进行采样; 和用于分析采样气体的RGA-QMS,并通过上述RGA-QMS的分析实现了根据工艺室清洁过程的气体流量,压力和温度对端点进行优化。
    • 9. 发明授权
    • Chemical vapor deposition method for manufacturing semiconductor devices
    • 用于制造半导体器件的化学气相沉积设备,其驱动方法和优化处理室清洗过程配方的方法
    • US06664119B2
    • 2003-12-16
    • US09804635
    • 2001-03-09
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • Baik-soon ChoiJung-il AnJin-sung KimJung-ki Kim
    • H01L2166
    • C23C16/4405
    • There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS) According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF3 gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.
    • 提供了一种通过使用残留气体分析仪四极质谱仪(RGA-QMS)对半导体晶片进行特定处理后的处理室的现场清洁处理的优化方法。根据本发明,化学气相沉积(CVD) 用于制造半导体器件的设备包括:处理室; 工艺气体供应管线,用于将处理气体供应到处理室中; 用于从处理室中除去废气的废气排放管线; 用于将ClF 3气体供应到处理室中的供应管线; 采样歧管,用于通过使用压力差来对处理室内的气体进行采样; 和用于分析取样气体的RGA-QMS,并通过上述RGA-QMS的分析实现了根据工艺室清洁过程的气体流量,压力和温度对端点进行优化。
    • 10. 发明授权
    • Method of stripping a wafer of its film with gas injected into a CVD
apparatus in which the wafer is disposed
    • 用注入到其中设置晶片的CVD装置中的气体剥离其膜的晶片的方法
    • US6015758A
    • 2000-01-18
    • US140332
    • 1998-08-26
    • Joong-il AnKyung-su KimJung-su LimJung-ki Kim
    • Joong-il AnKyung-su KimJung-su LimJung-ki Kim
    • H01L21/205H01L21/00H01L21/306
    • H01L21/67017Y10S156/912
    • A method for stripping a film from a wafer substrate includes the steps of inserting a boat holding the wafer into a processing chamber of a CVD apparatus, and injecting gas into the chamber, to thereby strip the wafer of its film. A typical film requiring stripping is a polysilicon film grown on an underlying oxide layer of the substrate. In this case, CIF.sub.3 is used to strip the polysilicon film without damaging the oxide layer. Accordingly, this method is applicable to the quality testing of semiconductor wafer films using a test wafer. In such quality testing a film is formed on a test wafer substrate at the same time the semiconductor wafer film is formed. The film of the test wafer is tested to evaluate the quality of the formation of the semiconductor wafer film. The test wafer can then be stripped within the chemical vapor deposition apparatus and thus can be reused soon thereafter.
    • 从晶片基板剥离膜的方法包括将保持晶片的舟状物插入CVD装置的处理室中并将气体注入到室中从而剥离其膜的晶片的步骤。 需要剥离的典型膜是在基底的下面的氧化物层上生长的多晶硅膜。 在这种情况下,CIF3用于剥离多晶硅膜而不损坏氧化物层。 因此,该方法适用于使用测试晶片的半导体晶片膜的质量测试。 在这种质量测试中,在形成半导体晶片膜的同时,在测试晶片衬底上形成膜。 测试测试晶片的膜以评估半导体晶片膜的形成质量。 然后可以在化学气相沉积设备内剥离测试晶片,因此可以在此之后重新使用。