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1. 发明授权

US07951624B2 Method of manufacturing light emitting diode 有权
标题翻译：制造发光二极管的方法
公开(公告)号：US07951624B2
公开(公告)日：2011-05-31
申请号：US12320020
申请日：2009-01-15
申请人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
发明人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
IPC分类号： H01L21/00
CPC分类号： H01L33/46 , H01L33/0079 , H01L33/405 , H01L33/42
摘要： A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.
摘要翻译：制造发光二极管的方法具有提供封装基底的步骤，提供发光结构并将发光结构结合在封装基底上。封装基底具有分别形成在其顶部和底部上的第一金属层和第二金属层。发光结构具有基板，发光层叠体和反射金属层。发光层叠形成在基板上，并且依次具有在基板上沉积的n型半导体层，发光层，p型半导体层和透明电极层。反射金属层形成在基板的底部。第一金属层通过超声波热压技术连接到反射金属层。因此，成品LED的热阻降低。

2. 发明授权

US07875473B2 Method of manufacturing light emitting diode device 失效
公开(公告)号：US07875473B2
公开(公告)日：2011-01-25
申请号：US12776367
申请日：2010-05-07
申请人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
发明人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
IPC分类号： H01L21/00
CPC分类号： H01L33/50 , H01L24/16 , H01L33/0095 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2924/00
摘要： A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

3. 发明授权

US07716945B2 Pressure equalization port apparatus and method for a refrigeration unit 有权
标题翻译：压力均衡口装置及制冷机组的方法
公开(公告)号：US07716945B2
公开(公告)日：2010-05-18
申请号：US11100411
申请日：2005-04-07
申请人： Chuan Weng
发明人： Chuan Weng
IPC分类号： F25D11/00
CPC分类号： F25D21/04 , F25D17/047
摘要： A pressure equalization port for a refrigeration unit is provided. The port includes a conduit having a thermally conductive body. The conduit includes a first opening exposed to a refrigeration chamber enclosed within the refrigeration unit, and a second opening exposed to a space external to the refrigeration chamber. At least one heat-dissipating refrigerant flow coil surrounds a portion of the thermally conductive body to heat said body.
摘要翻译：提供了一种用于制冷单元的压力平衡端口。该端口包括具有导热体的导管。导管包括暴露于冷藏室内的冷藏室的第一开口和暴露于冷藏室外部的空间的第二开口。至少一个散热制冷剂流动盘管围绕导热体的一部分以加热所述主体。

4. 发明申请

US20100055814A1 METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE 失效
公开(公告)号：US20100055814A1
公开(公告)日：2010-03-04
申请号：US12615262
申请日：2009-11-09
申请人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
发明人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
IPC分类号： H01L21/50
CPC分类号： H01L33/50 , H01L24/16 , H01L33/0095 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2924/00
摘要： A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

5. 发明申请

US20100047940A1 METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE 失效
公开(公告)号：US20100047940A1
公开(公告)日：2010-02-25
申请号：US12611852
申请日：2009-11-03
申请人： Ben FAN , Hsin-Chuan WENG , Kuo-Kuang YEH
发明人： Ben FAN , Hsin-Chuan WENG , Kuo-Kuang YEH
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L24/16 , H01L33/0095 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2924/00
摘要： A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

6. 发明授权

US07596145B2 Automatic setting method for ATM network 有权
标题翻译： ATM网络自动设置方法
公开(公告)号：US07596145B2
公开(公告)日：2009-09-29
申请号：US10948125
申请日：2004-09-24
申请人： Ming-Chuan Weng , Chi-Wen Chen
发明人： Ming-Chuan Weng , Chi-Wen Chen
IPC分类号： H04L12/28
CPC分类号： H04L12/5601 , H04L2012/5629 , H04L2012/563 , H04L2012/5667
摘要： An automatic setting method for ATM network is used in an information device for automatic connecting to an ATM network of an ISP office. At first an automatic configuration table is provided and includes a plurality sets of setting parameters of virtual path identifier (VPI)/virtual channel identifier (VCI) and encapsulation capacity for a plurality of default ISP offices. A user tries connection to the ISP office by selecting one set of the setting parameters as a connecting parameter to the ISP office and receives a reply message from the ISP office. The user selects another one set of the setting parameters as a connecting parameter to the ISP office when the connection fails and tries again until the connection to the ISP office successes.
摘要翻译：用于ATM网络的自动设置方法用于自动连接到ISP办公室的ATM网络的信息设备。首先提供自动配置表，并且包括多组虚拟路径标识符（VPI）/虚拟信道标识符（VCI）的设置参数和多个默认ISP办公室的封装容量。用户通过选择一组设置参数作为ISP办公室的连接参数来尝试连接到ISP办公室，并从ISP办公室收到回复消息。当连接失败时，用户选择另一组设置参数作为连接参数到ISP办公室，直到连接到ISP办公室成功为止。

7. 发明申请

US20090215210A1 METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE 审中-公开
标题翻译：制造发光二极管器件的方法
公开(公告)号：US20090215210A1
公开(公告)日：2009-08-27
申请号：US12351668
申请日：2009-01-09
申请人： Ben FAN , Hsin-Chuan WENG , Kuo-Kuang YEH
发明人： Ben FAN , Hsin-Chuan WENG , Kuo-Kuang YEH
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L24/16 , H01L33/0095 , H01L2924/12036 , H01L2924/12041 , H01L2933/0041 , H01L2924/00
摘要： A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.
摘要翻译：制造发光二极管装置的方法具有以下步骤：通过在引线接合区域上设置分隔板并在LED的发光侧涂覆荧光体来将LED芯片的发光侧与引线接合区隔离芯片处于荧光体涂层工艺中。该方法可以应用于制造具有倒装芯片结构或垂直芯片结构的LED器件。根据该方法，可以直接制造白色LED器件而不采用荧光体封装技术，从而简化了白色LED器件的整体封装处理。

8. 发明申请

US20090184337A1 Light-Emitting Diode, Package Structure Thereof and Manufacturing Method for the Same 审中-公开
标题翻译：发光二极管，封装结构及其制造方法
公开(公告)号：US20090184337A1
公开(公告)日：2009-07-23
申请号：US12351011
申请日：2009-01-09
申请人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
发明人： Ben Fan , Hsin-Chuan Weng , Kuo-Kuang Yeh
IPC分类号： H01L33/00 , H01L51/52 , H01L21/04
CPC分类号： H01L33/385 , H01L33/405 , H01L33/44 , H01L33/62 , H01L2224/48247 , H01L2224/48463 , H01L2224/73265
摘要： A light-emitting diode includes a sapphire substrate, an n-type semiconductor, a light-emitting layer, a p-type semiconductor layer, an anode and a conductive material. The n-type semiconductor layer is formed on the sapphire substrate and has a side surface, a center section and an edge around the center portion. The light-emitting layer is formed on the n-type semiconductor layer. The p-type semiconductor layer is formed on the light-emitting layer. The anode is formed on the p-type semiconductor layer. The conductive material is formed on the bottom surface of the sapphire substrate and is in contact with the n-type semiconductor layer.
摘要翻译：发光二极管包括蓝宝石衬底，n型半导体，发光层，p型半导体层，阳极和导电材料。 n型半导体层形成在蓝宝石衬底上，并且具有侧表面，中心部分和围绕中心部分的边缘。发光层形成在n型半导体层上。 p型半导体层形成在发光层上。阳极形成在p型半导体层上。导电材料形成在蓝宝石衬底的底表面上并与n型半导体层接触。

9. 发明授权

US06845632B1 Cooling circuit apparatus and method 失效
标题翻译：冷却回路装置及方法
公开(公告)号：US06845632B1
公开(公告)日：2005-01-25
申请号：US10727600
申请日：2003-12-05
申请人： Brian Darling , Chuan Weng , James D. Nye
发明人： Brian Darling , Chuan Weng , James D. Nye
IPC分类号： F25B41/04 , F25D11/00 , F25D17/06 , F25D21/04 , F25B1/00
CPC分类号： F25B41/04 , F25B2339/047 , F25B2400/0401 , F25B2400/0403 , F25B2400/0409 , F25B2500/06 , F25B2600/0251 , F25B2600/2501 , F25D11/00 , F25D17/06 , F25D21/04 , Y02B40/32
摘要： A cooling circuit through which coolant flows, for use with a refrigerated cabinet. The cooling circuit includes a compressor and a condenser with a flow path extending there between. The cooling circuit also includes an evaporator and a second flow path that extends between the evaporator and the condenser. The cooling circuit additionally includes a suction accumulator and a flow path extending between the evaporator and the suction accumulator, while a fourth flow path extends between the suction accumulator and the compressor. The cooling circuit also includes a coolant bypass and a switch that switches the cooling circuit between a cycling mode and a non-cycling mode.
摘要翻译：冷却液流过的冷却回路，用于冷藏柜。冷却回路包括压缩机和冷凝器，其间具有在其间延伸的流路。冷却回路还包括在蒸发器和冷凝器之间延伸的蒸发器和第二流动通道。冷却回路还包括抽吸蓄能器和在蒸发器和抽吸蓄能器之间延伸的流路，而第四流动路径在抽吸蓄能器和压缩机之间延伸。冷却回路还包括冷却剂旁路和在循环模式和非循环模式之间切换冷却回路的开关。

10. 发明授权

US06766652B2 Dual independent chamber ultra-low temperature freezer 有权
标题翻译：双独立室超低温冷柜
公开(公告)号：US06766652B2
公开(公告)日：2004-07-27
申请号：US10321584
申请日：2002-12-18
申请人： Allan Kelly , Chuan Weng
发明人： Allan Kelly , Chuan Weng
IPC分类号： F25B500
CPC分类号： F25D11/022 , F25B5/02 , F25B7/00 , F25B41/043 , F25B2600/2511 , F25D23/025 , F25D2201/126 , F25D2201/14 , F25D2400/04 , Y02B40/34
摘要： Methods and apparatus for a two chamber freezer whereby both chambers can be maintained at a substantially constant ultra-low temperature, such as within the range of about −40° C. to −80° C. Short term items may be stored in and accessed by the upper door from an upper chamber while long term items may be stored in and accessed by the lower door in the lower chamber. The upper and lower chambers are thermodynamically independent of each other thereby reducing the power usage of the freezer.
摘要翻译：用于双室冷冻器的方法和装置，其中两个室可以保持在基本上恒定的超低温，例如在约-40℃至-80℃的范围内。短期物品可以存储并存取通过从上部室的上部门，而长期物品可以存储在下部室中的下部门中并被其访问。上下室在热力学上彼此独立，从而减少了冷冻机的功率使用。

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