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    • 4. 发明授权
    • Method of forming contacts using auxiliary structures
    • 使用辅助结构形成触点的方法
    • US07416976B2
    • 2008-08-26
    • US11217122
    • 2005-08-31
    • Josef WillerPatrick HaibachChristoph Andreas KleintNicolas Nagel
    • Josef WillerPatrick HaibachChristoph Andreas KleintNicolas Nagel
    • H01L21/44
    • H01L21/76897H01L21/76895H01L27/115H01L27/11568
    • A semiconductor product includes a substrate having a substrate surface. A plurality of wordlines are arranged at a distance from one another and running along a first direction. A plurality of conductive contact structures are provided between the wordlines. The product also includes a plurality of filling structures. Each filling structure separates from one another two respective contact structures arranged between two respective wordlines. The two respective contact structures are arranged at a distance from one another in the first direction. In the preferred embodiment, the contact structures have a top side provided at a distance from the substrate surface and extends to the substrate surface. The contact structures at the substrate surface have a width along the first direction that is larger than a width of the top sides of the contact structures along the first direction.
    • 半导体产品包括具有基板表面的基板。 多个字线被布置成彼此间隔一定距离并沿着第一方向延伸。 在字线之间提供多个导电接触结构。 该产品还包括多个填充结构。 每个填充结构彼此分开布置在两个相应字线之间的两个相应的接触结构。 两个相应的接触结构在第一方向上彼此间隔一定距离。 在优选实施例中,接触结构具有设置在离基板表面一定距离处并且延伸到基板表面的顶侧。 衬底表面处的接触结构具有沿着第一方向的宽度,该宽度大于沿着第一方向的接触结构的顶侧宽度。
    • 5. 发明授权
    • Semiconductor memory
    • 半导体存储器
    • US07405441B2
    • 2008-07-29
    • US11078647
    • 2005-03-11
    • Joachim DeppeMathias KrauseChristoph Andreas KleintChristoph LudwigJens-Uwe SachseGünther Wein
    • Joachim DeppeMathias KrauseChristoph Andreas KleintChristoph LudwigJens-Uwe SachseGünther Wein
    • H01L29/788
    • H01L21/28282H01L29/4234H01L29/792
    • A non-volatile semiconductor memory (30) comprising a semiconductor substrate (1) and a plurality of memory cells (19) and methods for manufacturing such a memory is provided. Each memory cell (19) comprises a charge-trapping element (5), a gate stack (20), nitride spacers (10) and electrically insulating elements (21). The charge-trapping element (5) is arranged on the semiconductor substrate (1) and comprises a nitride layer (3) sandwiched between a bottom oxide layer (2) and a top oxide layer (4), the charge-trapping element (5) having two lateral sidewalls (24) opposed to one another. The gate stack (20) is arranged on top of the charge-trapping element (5), the gate stack having two lateral sidewalls (25) opposing one another. The electrically insulating elements (21) are disposed at opposing sidewalls (24) of the charge-trapping element (5) and cover the sidewalls (24) of the charge-trapping element (5). The nitride spacers (10) cover the electrically insulating elements (21) and are arranged on opposing sidewalls (25) of the gate stack (20) and on the electrically insulating elements (21).
    • 提供了包括半导体衬底(1)和多个存储单元(19)的非易失性半导体存储器(30)和用于制造这种存储器的方法。 每个存储单元(19)包括电荷捕获元件(5),栅极堆叠(20),氮化物间隔物(10)和电绝缘元件(21)。 电荷捕获元件(5)设置在半导体衬底(1)上并且包括夹在底部氧化物层(2)和顶部氧化物层(4)之间的氮化物层(3),电荷俘获元件(5) )具有彼此相对的两个侧壁(24)。 栅极堆叠(20)布置在电荷捕获元件(5)的顶部,栅极堆叠具有彼此相对的两个侧壁(25)。 电绝缘元件(21)设置在电荷捕获元件(5)的相对侧壁(24)处并覆盖电荷捕获元件(5)的侧壁(24)。 氮化物间隔物(10)覆盖电绝缘元件(21)并且布置在栅极堆叠(20)的相对侧壁(25)上以及电绝缘元件(21)上。