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    • 5. 发明申请
    • Method of forming trench isolation in the fabrication of integrated circuitry
    • 在集成电路制造中形成沟槽隔离的方法
    • US20060008972A1
    • 2006-01-12
    • US11215934
    • 2005-08-31
    • Garo DerderianChris Hill
    • Garo DerderianChris Hill
    • H01L21/8238
    • H01L21/02164C23C16/0272C23C16/402H01L21/02145H01L21/02214H01L21/02271H01L21/31612H01L21/76227
    • This invention includes methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and to methods of forming trench isolation in the fabrication of integrated circuitry. In one implementation, a method of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry includes flowing an aluminum containing organic precursor to a chamber containing a semiconductor substrate effective to deposit an aluminum comprising layer over the substrate. An alkoxysilanol is flowed to the substrate comprising the aluminum comprising layer within the chamber effective to deposit a silicon dioxide comprising layer over the substrate. At least one halogen is provided within the chamber during at least one of the aluminum containing organic precursor flowing and the alkoxysilanol flowing under conditions effective to reduce rate of the deposit of the silicon dioxide comprising layer over the substrate than would otherwise occur under identical conditions but for providing the halogen. Other implementations are contemplated.
    • 本发明包括在制造集成电路中沉积含二氧化硅的层的方法以及在集成电路的制造中形成沟槽隔离的方法。 在一个实施方案中,在集成电路的制造中沉积含二氧化硅的层的方法包括将含有铝的有机前体流动到含有半导体衬底的室,该半导体衬底有效地在衬底上沉积含铝层。 烷氧基硅烷流到包含室内的包含铝的基材的基材中,有效地将二氧化硅包含层沉积在基材上。 在含铝的有机前驱体和烷氧基硅烷中的至少一种中,至少有一个卤素在有效地降低衬底上沉积二氧化硅层的条件下流动的条件下流动,这与在相同条件下将会发生的情况相反,但是 用于提供卤素。 考虑其他实现。
    • 8. 发明申请
    • Methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and methods of forming trench isolation in the fabrication of integrated circuitry
    • 在制造集成电路中沉积含二氧化硅的层的方法以及在集成电路的制造中形成沟槽隔离的方法
    • US20060189159A1
    • 2006-08-24
    • US11404703
    • 2006-04-14
    • Garo DerderianChris Hill
    • Garo DerderianChris Hill
    • H01L21/31
    • H01L21/02164C23C16/0272C23C16/402H01L21/02145H01L21/02214H01L21/02271H01L21/31612H01L21/76227
    • This invention includes methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and to methods of forming trench isolation in the fabrication of integrated circuitry. In one implementation, a method of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry includes flowing an aluminum containing organic precursor to a chamber containing a semiconductor substrate effective to deposit an aluminum comprising layer over the substrate. An alkoxysilanol is flowed to the substrate comprising the aluminum comprising layer within the chamber effective to deposit a silicon dioxide comprising layer over the substrate. At least one halogen is provided within the chamber during at least one of the aluminum containing organic precursor flowing and the alkoxysilanol flowing under conditions effective to reduce rate of the deposit of the silicon dioxide comprising layer over the substrate than would otherwise occur under identical conditions but for providing the halogen. Other implementations are contemplated.
    • 本发明包括在制造集成电路中沉积含二氧化硅的层的方法以及在集成电路的制造中形成沟槽隔离的方法。 在一个实施方案中,在集成电路的制造中沉积含二氧化硅的层的方法包括将含有铝的有机前体流动到含有半导体衬底的室,该半导体衬底有效地在衬底上沉积含铝层。 烷氧基硅烷流到包含室内的包含铝的基材的基材中,有效地将二氧化硅包含层沉积在基材上。 在含铝的有机前驱体和烷氧基硅烷中的至少一种中,至少有一个卤素在有效地降低衬底上沉积二氧化硅层的条件下流动的条件下流动,这与在相同条件下将会发生的情况相反,但是 用于提供卤素。 考虑其他实现。