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1. 发明授权

US07858446B2 Sensor-type semiconductor package and fabrication method thereof 有权
标题翻译：传感器型半导体封装及其制造方法
公开(公告)号：US07858446B2
公开(公告)日：2010-12-28
申请号：US11982516
申请日：2007-11-02
申请人： Chien-Ping Huang , Tse-Wen Chang , Chang-Yueh Chan , Cheng-Yi Chang
发明人： Chien-Ping Huang , Tse-Wen Chang , Chang-Yueh Chan , Cheng-Yi Chang
IPC分类号： H01L21/48 , H01L21/50 , H01L21/78
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00012
摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要翻译：提供了一种传感器型半导体封装及其制造方法。传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。

2. 发明授权

US07365364B2 Sensor semiconductor device with sensor chip 有权
标题翻译：传感器半导体器件与传感器芯片
公开(公告)号：US07365364B2
公开(公告)日：2008-04-29
申请号：US11162135
申请日：2005-08-30
申请人： Chien-Ping Huang , Chih-Ming Huang , Cheng-Yi Chang
发明人： Chien-Ping Huang , Chih-Ming Huang , Cheng-Yi Chang
IPC分类号： H01L29/267 , H01L29/22
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/24226
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.
摘要翻译：提出了一种传感器半导体器件及其制造方法。传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。电介质层形成有用于暴露传感器芯片的传感器区域的开口。透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。

3. 发明申请

US20070278701A1 Semiconductor package and method for fabricating the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20070278701A1
公开(公告)日：2007-12-06
申请号：US11591800
申请日：2006-11-01
申请人： Cheng-Yi Chang , Chien-Ping Huang , Chih-Ming Huang , Chieh-Yuan Lin , Cheng-Hsu Hsiao
发明人： Cheng-Yi Chang , Chien-Ping Huang , Chih-Ming Huang , Chieh-Yuan Lin , Cheng-Hsu Hsiao
IPC分类号： H01L23/28
CPC分类号： H01L21/561 , H01L21/481 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.
摘要翻译：公开了一种半导体封装及其制造方法。该方法包括在芯片载体模块的多个芯片载体上安装多个导电组件，将导电组件电连接到相邻芯片载体的电连接点，将半导体芯片安装并电连接到每个芯片载体，形成用于包封半导体芯片和导电部件的密封剂，切割芯片载体以分离安装在其上的导电组件，将一部分导电组分暴露于密封剂外，在导电组件的暴露部分上形成电镀层镍/金，并且将芯片载体彼此分离。从密封剂露出的导电组件提供额外的电连接点，从而促进电子产品的功能。

4. 发明申请

US20070252167A1 Surface mounting optoelectronic device 审中-公开
标题翻译：表面贴装光电器件
公开(公告)号：US20070252167A1
公开(公告)日：2007-11-01
申请号：US11600126
申请日：2006-11-16
申请人： Chung-Fu Chen , Cheng-Yi Chang , Chih-Chia Tsai
发明人： Chung-Fu Chen , Cheng-Yi Chang , Chih-Chia Tsai
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2224/48091 , H04N5/2256 , H01L2924/00014 , H01L2924/00
摘要： A surface mounting optoelectronic device is provided. The surface mounting optoelectronic device comprises a circuit board, a conductive layer, an auto-focus LED chip, a flash LED chip, a reflector and an encapsulant. The auto-focus LED chip and the flash LED chip are located on the conductive layer. The reflector is located on the edge of the circuit board. The encapsulant is filled into the reflector to hermetically seal the auto-focus LED chip and the flash LED chip.
摘要翻译：提供表面贴装光电器件。表面安装光电器件包括电路板，导电层，自动聚焦LED芯片，闪光LED芯片，反射器和密封剂。自动对焦LED芯片和闪光LED芯片位于导电层上。反射器位于电路板的边缘。将密封剂填充到反射器中以气密地密封自动聚焦LED芯片和闪光LED芯片。

5. 发明申请

US20070018088A1 Sensor semiconductor device and fabricating method thereof 有权
标题翻译：传感器半导体器件及其制造方法
公开(公告)号：US20070018088A1
公开(公告)日：2007-01-25
申请号：US11373723
申请日：2006-03-10
申请人： Chien Ping Huang , Chih Ming Huang , Cheng Yi Chang
发明人： Chien Ping Huang , Chih Ming Huang , Cheng Yi Chang
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14632 , H01L27/14687 , H01L2224/24225 , H01L2224/97 , H01L2224/82
摘要： A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.
摘要翻译：提供了一种传感器半导体器件及其制造方法。制造方法包括将传感器芯片安装在基板的表面上; 在传感器芯片上形成透明盖; 在基板上形成电介质层和电路层，其中传感器芯片通过电路层与基板电连接，透明盖从电介质层露出，使得光可透过透明盖到达传感器区域的传感器芯片，并允许传感器芯片工作; 以及在所述基板的另一表面上植入多个焊球，以将所述传感器芯片电连接到外部设备。可以成本有效地制造传感器半导体器件，并且可以避免现有技术的电路破裂和已知的良好裸片（KGD）问题。

6. 发明授权

US07148626B2 Flat lamp structure with electrodes disposed on outer surface of the substrate 失效
标题翻译：平板灯结构，其电极设置在基板的外表面上
公开(公告)号：US07148626B2
公开(公告)日：2006-12-12
申请号：US10604588
申请日：2003-07-31
申请人： Yui-Shin Fran , Lai-Cheng Chen , Cheng-Yi Chang , Chien-Chung Wu , Jui-Hsia Chen , Jer-Shien Yang
发明人： Yui-Shin Fran , Lai-Cheng Chen , Cheng-Yi Chang , Chien-Chung Wu , Jui-Hsia Chen , Jer-Shien Yang
IPC分类号： H01J1/62
CPC分类号： H01J65/046 , H01J61/305
摘要： A flat lamp structure is disclosed. The flat lamp structure includes a gas discharge chamber, a fluorescence substance, a discharge gas, and a plurality of electrodes. The fluorescence substance is disposed on the inner wall of the gas discharge chamber, and the discharge gas is disposed in the gas discharge chamber. The electrodes are disposed on the outer wall of the gas discharge chamber, wherein the gas discharge chamber comprises a dielectric substrate, a plate, and a plurality of rods, and the plate is disposed on the upper portion of the dielectric substrate and the rods are disposed between the plate and the dielectric substrate, and the plate and the edge of dielectric are connected. Additionally, the gas discharge chamber, for example, can dispose with at least a spacer to enhance the strength of the gas discharge chamber.
摘要翻译：公开了一种平板灯结构。扁平灯结构包括气体放电室，荧光物质，放电气体和多个电极。荧光物质设置在气体放电室的内壁上，放电气体设置在气体放电室中。电极设置在气体放电室的外壁上，其中气体放电室包括电介质基板，板和多个杆，并且该板设置在电介质基板的上部，并且棒是设置在板和电介质基板之间，并且板和电介质的边缘连接。此外，气体放电室例如可以配置至少一个间隔件，以增强气体放电室的强度。

7. 发明授权

US08496047B2 Heat dissipating apparatus extended laterally from heat pipe 有权
标题翻译：散热装置从热管横向延伸
公开(公告)号：US08496047B2
公开(公告)日：2013-07-30
申请号：US12345956
申请日：2008-12-30
申请人： Cheng-Yi Chang
发明人： Cheng-Yi Chang
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.
摘要翻译：散热装置包括导热基座和连接到导热基座的热管。每个热管包括加热部分和散热部分。连接到导热基座的部分是加热部分，并且散热部分从导热基底向外延伸。在热管中，热管的至少一个散热部从导热基体的侧面向外侧延伸，热管的散热部位于比加热部高的位置，散热片设置在热管的散热部上。因此，热管将导热基底吸收的热量引导到侧面，以从附近的热源散发热量。

8. 发明授权

US08278562B2 Multi-layer substrate and manufacturing method thereof 有权
标题翻译：多层基板及其制造方法
公开(公告)号：US08278562B2
公开(公告)日：2012-10-02
申请号：US11960107
申请日：2007-12-19
申请人： Chih-Kuang Yang , Cheng-Yi Chang
发明人： Chih-Kuang Yang , Cheng-Yi Chang
IPC分类号： H05K1/02
CPC分类号： H05K3/28 , H05K3/0058 , H05K3/381 , H05K3/4682 , H05K2201/0154 , H05K2203/016 , H05K2203/065 , H05K2203/0759 , H05K2203/095 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.
摘要翻译：公开了多层基板的多层基板和多层基板的制造方法。通过使用载体交替地在其上形成介电层和金属结构层。每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

9. 发明授权

US07939846B2 Circuit board for LED 失效
标题翻译： LED电路板
公开(公告)号：US07939846B2
公开(公告)日：2011-05-10
申请号：US12404350
申请日：2009-03-16
申请人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
发明人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.
摘要翻译： LED连接到电路板。电路板包括芯片安装区域，焊盘和连接部分。 LED用粘合剂安装在芯片安装区域，焊盘与LED的电极连接。此外，连接部位于芯片安装区域和焊盘之间。连接部的一侧与芯片安装区域连接，另一侧与接合焊盘连接。通过连接部分的中空部分，防止粘合剂流到接合焊盘。

10. 发明申请

US20100123157A1 CIRCUIT BOARD FOR LED 失效
标题翻译： LED电路板
公开(公告)号：US20100123157A1
公开(公告)日：2010-05-20
申请号：US12404350
申请日：2009-03-16
申请人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
发明人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.
摘要翻译： LED连接到电路板。电路板包括芯片安装区域，焊盘和连接部分。 LED用粘合剂安装在芯片安装区域，焊盘与LED的电极连接。此外，连接部位于芯片安装区域和焊盘之间。连接部的一侧与芯片安装区域连接，另一侧与接合焊盘连接。通过连接部分的中空部分，防止粘合剂流到接合焊盘。

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