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1. 发明申请

US20070018088A1 Sensor semiconductor device and fabricating method thereof 有权
标题翻译：传感器半导体器件及其制造方法
公开(公告)号：US20070018088A1
公开(公告)日：2007-01-25
申请号：US11373723
申请日：2006-03-10
申请人： Chien Ping Huang , Chih Ming Huang , Cheng Yi Chang
发明人： Chien Ping Huang , Chih Ming Huang , Cheng Yi Chang
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14632 , H01L27/14687 , H01L2224/24225 , H01L2224/97 , H01L2224/82
摘要： A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.
摘要翻译：提供了一种传感器半导体器件及其制造方法。制造方法包括将传感器芯片安装在基板的表面上; 在传感器芯片上形成透明盖; 在基板上形成电介质层和电路层，其中传感器芯片通过电路层与基板电连接，透明盖从电介质层露出，使得光可透过透明盖到达传感器区域的传感器芯片，并允许传感器芯片工作; 以及在所述基板的另一表面上植入多个焊球，以将所述传感器芯片电连接到外部设备。可以成本有效地制造传感器半导体器件，并且可以避免现有技术的电路破裂和已知的良好裸片（KGD）问题。

2. 发明申请

US20060231944A1 Thermally enhanced semiconductor package and fabrication method thereof 审中-公开
标题翻译：热增强半导体封装及其制造方法
公开(公告)号：US20060231944A1
公开(公告)日：2006-10-19
申请号：US11404674
申请日：2006-04-14
申请人： Chien Ping Huang , Chih Ming Huang
发明人： Chien Ping Huang , Chih Ming Huang
IPC分类号： H01L23/34
CPC分类号： H01L23/3128 , H01L21/4878 , H01L21/6835 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/18301 , H01L2224/85 , H01L2224/81 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A thermally enhanced semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted and electrically connected to a chip carrier. A receiving plate having an opening is provided on the chip carrier and the semiconductor chip is received in the opening. A heat sink formed with an interface layer on a surface thereof is attached via another surface thereof to the semiconductor chip. An encapsulant encapsulating the heat sink, the semiconductor chip and a portion of the receiving plate is formed. A cutting process is performed to cut along edges of the opening of the receiving plate to remove the receiving plate and a portion of the encapsulant formed on the receiving plate. A portion of the encapsulant formed on the interface layer is removed. This allows heat produced by the semiconductor chip to be effectively dissipated by the heat sink.
摘要翻译：提供一种热增强型半导体封装及其制造方法。半导体芯片安装并电连接到芯片载体。具有开口的接收板设置在芯片载体上，并且半导体芯片被接收在开口中。在其表面上形成有界面层的散热器经由其另一表面附接到半导体芯片。形成封装散热器，半导体芯片和接收板的一部分的密封剂。执行切割处理以切割接收板的开口的边缘，以去除接收板和形成在接收板上的一部分密封剂。除去形成在界面层上的一部分密封剂。这使得由半导体芯片产生的热能被散热器有效地消散。

3. 发明授权

US5961912A Encapsulating method of substrate based electronic device 失效
标题翻译：基于基板的电子装置的封装方法
公开(公告)号：US5961912A
公开(公告)日：1999-10-05
申请号：US986934
申请日：1997-12-08
申请人： Chien Ping Huang , Kevin Yu , Chih Ming Huang
发明人： Chien Ping Huang , Kevin Yu , Chih Ming Huang
IPC分类号： B29C45/14 , H01L21/56 , B29C70/70 , B29C45/02
CPC分类号： B29C45/14655 , H01L21/565 , H01L2924/0002
摘要： An encapsulating method of a substrate-based electronic device of the present invention comprises:the substrate-based electronic device to be encapsulated is placed in the cavity of an encapsulating mold, then an encapsulant is put in a pot of the encapsulating mold, and said encapsulating mold is closed;said encapsulant in the pot is liquidized by heating, and let the liquidized encapsulant go in the cavity through a runner and a gate, and then fill in a semiconductor die;after the encapsulant filled in said semiconductor die is substantially solidified, said encapsulating mold is opened and an encapsulated substrate-based electronic device is taken out from said cavity;which is characterized by that, before encapsulant injection, a degate shim is pre-placed on the substrate of said substrate-based electronic device locating at the position where the runner passes through, in order to let this degate shim substantially makes said encapsulant have no contact with said substrate during injection of encapsulant.
摘要翻译：本发明的基于基板的电子器件的封装方法包括：将待封装的基于基板的电子器件放置在封装模具的空腔中，然后将密封剂放入封装模具的一个罐中，并且所述封闭模具封闭; 所述罐中的密封剂通过加热而液化，并使液化的密封剂通过流道和浇口进入腔体，然后填充半导体管芯; 在填充在所述半导体管芯中的密封剂基本上固化之后，打开所述封装模具，并且从所述腔体中取出封装的基于衬底的电子器件; 其特征在于，在密封剂注入之前，将位移垫片预先放置在位于所述流道穿过的位置处的所述基于衬底的电子设备的衬底上，以便使该去角垫片基本上使得所述密封剂不具有在注射密封剂期间与所述基底接触。

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