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1. 发明申请

WO1997034206A1 MULTI-TOOL POSITIONING SYSTEM 审中-公开
标题翻译：多工具定位系统
公开(公告)号：WO1997034206A1
公开(公告)日：1997-09-18
申请号：PCT/US1997003385
申请日：1997-03-04
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , CUTLER, Donald, R. , PAILTHORP, Robert, M. , UNRATH, Mark, A. , RICHARDSON, Thomas, W. , CABLE, Alan, J.
发明人： ELECTRO SCIENTIFIC INDUSTRIES, INC.
IPC分类号： G05B19/39
CPC分类号： B23K26/08 , B23K26/082 , B23K26/083 , B23K26/0853 , G05B19/39 , G05B2219/34047 , G05B2219/34391 , G05B2219/36029 , G05B2219/41331 , G05B2219/42209 , G05B2219/42219 , G05B2219/45041 , G05B2219/45139 , H05K3/0008 , H05K3/0017 , H05K3/0038 , H05K2203/0165 , H05K2203/108
摘要： A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.
摘要翻译：多速率多头定位器（150）接收和处理未通用的定位命令以致动缓慢级（56,58）和多个快速级（154），所述缓慢级（56,58）和多级快速级（154）安装在所述慢速级中的一级以同时定位多个工具）相对于多个相关工件（152）上的目标位置（162）。每个快速级耦合到快速级信号处理器（172），其向每个快速定位器提供校正的位置数据，以补偿多个工件之间的快速阶段非线性和工件放置，偏移，旋转和尺寸变化。在蚀刻电路板（ECB）中通过盲孔切割盲孔时，通过制造一半的工具紫外线（“UV”）激光器可以实现提高的产量和工艺产量，这些激光器易于切割导体和电介质层，并使另一半的工具是红外线（“IR”）激光器，其易于切割电介质层。控制UV激光器以切割上导体层和底层电介质层的一部分，并且IR激光器被控制以切割剩余的电介质层而不切割或损坏第二下面的导体层。通过在未加工的ECB中切割导体层，同时切割已经具有导体层切割的ECB中的电介质层，从而提高了生产量。通过在每个切割步骤之前执行工件校准以考虑任何ECB放置，偏移，旋转和尺寸变化来增加工艺屈服。

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