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    • 1. 发明授权
    • Encapsulated microelectromechanical (MEMS) devices
    • 封装的微机电(MEMS)器件
    • US06472739B1
    • 2002-10-29
    • US09441190
    • 1999-11-15
    • Robert L. WoodBruce W. Dudley
    • Robert L. WoodBruce W. Dudley
    • H01L2312
    • B81C1/00333B81C2203/0136
    • A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. A sacrificial material is first deposited over the substrate to cover at least a portion of the MEMS structure. An encapsulation material is then deposited over the sacrificial material such that the encapsulation material covers at least a portion of the sacrificial material over the MEMS structure. The sacrificial material is subsequently removed such that the encapsulation material forms a shell spaced apart from and covering the MEMS structure and permits the intended operation of the MEMS structure. Associated MEMS devices fabricated using a method of encapsulating MEMS structures according to embodiments of the present invention are also provided.
    • 提供了一种封装微机电(MEMS)结构的方法,其中MEMS结构形成在基底上并在其包装之前被封装。 牺牲材料首先沉积在衬底上以覆盖MEMS结构的至少一部分。 然后将封装材料沉积在牺牲材料上,使得封装材料覆盖MEMS结构上的牺牲材料的至少一部分。 随后去除牺牲材料,使得封装材料形成与MEMS结构间隔开并覆盖MEMS结构并允许MEMS结构的预期操作。 还提供了使用根据本发明的实施例的封装MEMS结构的方法制造的相关MEMS器件。