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1. 发明专利

JP2014045011A The substrate support system 审中-公开
标题翻译：基板支持系统
公开(公告)号：JP2014045011A
公开(公告)日：2014-03-13
申请号：JP2012185442
申请日：2012-08-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA , KUWAUCHI SHIGEKI
IPC分类号： H01L21/60 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate support system including a substrate support which allows for heating of a substrate while supporting, without hindering the optical path of light used in the positioning of a chip for the substrate.SOLUTION: In a substrate support system having an optical system for positioning a chip at a predetermined position on a substrate WA by image recognition, and substrate side heating means for heating the substrate while supporting on a substrate supporting surface 501, the optical system includes a light-emitting device and a light-receiving device configured so that light is propagated while transmitting through at least the substrate side heating means in a direction substantially perpendicular to the substrate supporting surface, and an image recognition device for measuring a relative positional error of the chip and substrate, by recognizing a chip side mark put on the chip and a substrate side mark put on the substrate. The substrate side heating means includes a first transparent insulation layer 504 having the substrate supporting surface and a heater surface 502 on the front and back, and a transparent conductive layer 503 provided on the heater surface of the first transparent insulation layer and generating heat by electrification.
摘要翻译：要解决的问题：提供一种基板支撑系统，其包括基板支撑件，其允许在支撑的同时加热基板，而不会妨碍用于定位基板的芯片的光路。解决方案：在基板支撑系统具有用于通过图像识别在芯片WA上的预定位置处定位芯片的光学系统，以及用于在支撑在基板支撑表面501上的同时加热基板的基板侧加热装置，该光学系统包括发光装置和光接收装置，被配置为使得光在基本上垂直于基板支撑表面的方向上至少通过至少基板侧加热装置传播;以及图像识别装置，用于通过识别芯片和基板的相对位置误差，放在芯片上的芯片侧标记和放在基板上的基板侧标记。基板侧加热装置包括具有基板支撑表面的第一透明绝缘层504和前后的加热表面502，以及设置在第一透明绝缘层的加热器表面上并通过带电产生热量的透明导电层503 。

2. 发明专利

JP2013243333A Chip-on wafer bonding method and bonding device and structure including chip and wafer 审中-公开
标题翻译：嵌入式晶片结合方法和结合器件及其结构包括芯片和晶圆
公开(公告)号：JP2013243333A
公开(公告)日：2013-12-05
申请号：JP2012243900
申请日：2012-11-05
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/16 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L24/81 , H01L24/95 , H01L2224/16145
摘要： PROBLEM TO BE SOLVED: To provide a technique for enhancing mechanical strength by establishing electrical connection between a chip and a wafer or between a plurality of stacked chips, and for bonding a chip onto a wafer efficiently.SOLUTION: The method for bonding a chip-on wafer includes: step S1 for performing surface activation at least of a metal area of a chip side bonding surface by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S2 for performing surface activation at the bonding part of a substrate by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S3 for attaching a plurality of chips subjected to surface activation and hydrophilization, respectively, onto the corresponding bonding parts of the substrate subjected to surface activation and hydrophilization so that the metal area of the chip comes into contact with the bonding part of the substrate; and step S4 for heating a structure including the substrate and the plurality of chips attached onto the substrate.
摘要翻译：要解决的问题：提供一种通过建立芯片和晶片之间或多个堆叠芯片之间的电连接并且有效地将芯片接合到晶片上的机械强度的技术。解决方案：在晶片上包括：步骤S1，用于通过碰撞具有预定动能的颗粒，并且通过沉积水或含OH材料进行亲水化来至少对芯片侧接合表面的金属区进行表面活化; 步骤S2，用于通过碰撞具有预定动能的颗粒在基底的接合部分进行表面活化，并通过沉积水或含OH材料进行亲水化; 分别将经表面活化和亲水处理的多个芯片附着到经过表面活化和亲水处理的基板的相应接合部分上，使芯片的金属区域与基板的接合部分接触的步骤S3; 以及用于加热包括基板和附接到基板上的多个芯片的结构的步骤S4。

3. 发明专利

JP2012166263A Pressurizing device and pressurizing method 有权
标题翻译：加压装置和压缩方法
公开(公告)号：JP2012166263A
公开(公告)日：2012-09-06
申请号：JP2012011655
申请日：2012-01-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B30B15/06 , B30B15/24
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of more flexibly controlling the flatness of a pressurizing face.SOLUTION: The pressurizing device 1 is the device pressurizing the objects 91, 92 to be pressurized. The pressurizing device 1 includes: a head 22; and a stage 12. After the head 22 and the stage 12 are relatively moved in a mutually adjoining direction in a Z direction (vertical direction), both the objects 91, 92 to be pressurized are sandwiched between the stage 12 and the head 22 to be pressurized. The head 22 includes: a pressurizing face FC of transmitting force for pressurization to the object 92 to be pressurized; and a piezo actuator 37. The piezo actuator 37 displaces the central part of the pressurizing face FC in a Z direction, and relatively displaces the central part of the pressurizing face FC in a Z direction to the outer circumferential side part of the pressurizing face FC.
摘要翻译：要解决的问题：提供能够更灵活地控制加压面的平坦度的技术。解决方案：加压装置1是对被加压物体91,92加压的装置。加压装置1包括：头部22; 在平台12和台架12沿Z方向（垂直方向）相互相邻的方向相对移动之后，被加压物体91,92被夹在台架12和头部22之间，加压。头部22包括：用于加压的物体92被加压的传递力的加压面FC; 和压电致动器37.压电致动器37沿Z方向移动加压面FC的中心部分，并且使加压面FC的Z方向的中心部位相对于加压面FC的外周侧部位。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011119293A Alignment device 有权
标题翻译：对齐设备
公开(公告)号：JP2011119293A
公开(公告)日：2011-06-16
申请号：JP2009268266
申请日：2009-11-26
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/02 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of miniaturizing an alignment device. SOLUTION: The alignment device includes a stage 12 holding an article 91 to be joined, a supporting member slidably supporting the stage 12, and a positioning mechanism 50 moving the stage 12 in the direction parallel with a substantially horizontal plane by applying a pushing force from the side of the stage 12. The positioning mechanism 50 includes a pushing-force applicator 51 pushing the stage 12 in the X direction at pushing points PT11, a pushing-force applicator 52 pushing the stage 12 in the Y direction at the pushing point PT12, and a pushing-force applicator 53 pushing the stage 12 in the Y direction at the pressing point PT13. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够使对准装置小型化的技术。解决方案：对准装置包括保持待接合物品91的台架12，可滑动地支撑台架12的支撑部件和定位机构50，该台架12沿平行于基本上水平的平面的方向移动台架12，定位机构50包括：推力施加器51，其在推压点PT11处沿X方向推压平台12，推力施加器52沿着Y方向推动平台12 推压点PT12，以及推压施加器53，在按压点PT13沿着Y方向推动台12。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008085322A Mounting apparatus and mounting method 有权
标题翻译：安装设备和安装方法
公开(公告)号：JP2008085322A
公开(公告)日：2008-04-10
申请号：JP2007225664
申请日：2007-08-31
申请人： Bondtech Inc , ボンドテック株式会社
发明人： OKADA MASUAKI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a technique that can improve productivity with a low-cost configuration. SOLUTION: A mounting apparatus equipped with a light path changing means 8 in an upper part of a head and a light path changing means 9 on a side of the head can read a part 20 and alignment marks 20a and 22a on a substrate 22 using one camera and can adjust a relative position between the head 7 and a stage 10 with high accuracy. Accordingly, it is not necessary to have two cameras, thereby allowing for cost reduction. In addition, since the part 20 can be mounted on the substrate 22 with high accuracy using only one camera, there is no need to calibrate the relative position between 2 cameras although such operation has been required in the conventional technique. Further, it is not necessary to interrupt the mounting process of mounting the part 20 on the substrate 22 for such calibration process, thereby providing the improved productivity. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以通过低成本配置来提高生产率的技术。解决方案：在头部上部配备有光路改变装置8和头部侧面上的光路改变装置9的安装装置可以在基板上读取部分20和对准标记20a和22a 22使用一个摄像机，并且可以高精度地调整头部7和台架10之间的相对位置。因此，不需要具有两个照相机，从而可以降低成本。此外，由于部分20可以仅使用一个相机以高精度安装在基板22上，所以不需要校准两个相机之间的相对位置，尽管在常规技术中需要这样的操作。此外，不需要中断将部件20安装在用于这种校准过程的基板22上的安装过程，从而提供提高的生产率。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007096057A Positioning method, positioning device, and device 有权
标题翻译：定位方法，定位装置和装置
公开(公告)号：JP2007096057A
公开(公告)日：2007-04-12
申请号：JP2005284572
申请日：2005-09-29
申请人： Bondtech Inc , ボンドテック株式会社
发明人： OKADA MASUAKI
IPC分类号： H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a positioning method and a positioning device that use a piezoelectric driving body composed of a piezoelectric element, are compact and obtain fine precision. SOLUTION: A pedestal which receives a load, and piezoelectric drivers 30 and 109 which move a movable table 16 and are each composed of one leg, are unitized in one and arranged at three places on a periphery of the movable table. Accordingly, high precision that the piezoelectric drivers 30 and 109 composed of piezoelectric elements 31 have, and the high withstand load of the pedestal and the reduction in the number of piezoelectric elements 31 to a half, are obtained to make the positioning device compact and reduce the cost. Further, tips of support legs of the piezoelectric drivers are made spherical to achieve smooth positioning with fine precision. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：为了提供使用由压电元件构成的压电驱动体的定位方法和定位装置，是紧凑的并且获得精确的精度。解决方案：接收负载的基座和移动可移动台16并且各自由一个腿组成的压电驱动器30和109被组合在一起并布置在可移动台的周边上的三个位置处。因此，获得由压电元件31构成的压电驱动器30和109具有的高精度，以及基座的高耐受载荷和压电元件数量的减少31至半，以使得定位装置紧凑并且减小成本。此外，压电驱动器的支撑腿的尖端被制成球形以实现精确的平滑定位。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006248895A Bonding method, device produced by this method, and bonding device 有权
标题翻译：粘合方法，通过该方法生产的装置和粘合装置
公开(公告)号：JP2006248895A
公开(公告)日：2006-09-21
申请号：JP2006129069
申请日：2006-05-08
申请人： Bondtech Inc , ボンドテック株式会社
发明人： OKADA MASUAKI
IPC分类号： C03C27/02 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a bonding method which comprises sticking OH groups on the bonding surfaces of both objects to be bonded by atomically coupling the OH groups by utilizing plasma and then subjecting the both objects to be bonded to anode bonding; and a bonding device. SOLUTION: After sticking OH groups on the bonding surfaces of an upper wafer 7 comprising glass and a lower wafer 8 comprising Si by atomically coupling the OH groups by utilizing plasma, anode bonding is performed. Thereby, the bonding strength can be enhanced at a lower temperature. After temporary bonding by hydrophilizing treatment, the final anode bonding is performed. Thus, the production efficiency is enhanced and objects to be bonded are mutually bonded in a three-layer structure without causing warp. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种接合方法，其包括通过利用等离子体使OH基团原子连接并且然后使两个物体接合而进行阳极接合，从而在要接合的两个物体的接合表面上粘附OH基团; 和接合装置。解决方案：通过利用等离子体原子上连接OH基团，在包含玻璃的上晶片7和包含Si的下晶片8的接合表面上粘合OH基之后，进行阳极接合。由此，能够在较低温度下提高接合强度。通过亲水化处理临时接合后，进行最终的阳极接合。因此，提高了生产效率，并且将要结合的物体以三层结构相互结合而不会发生翘曲。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2013251404A Surface treatment method of chip, bonding method, and surface treatment device 有权
标题翻译：切片，接合方法和表面处理装置的表面处理方法
公开(公告)号：JP2013251404A
公开(公告)日：2013-12-12
申请号：JP2012125236
申请日：2012-05-31
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/24 , C23C8/16 , C23G5/00
CPC分类号： H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide a technique for bonding a plurality of chips to a substrate, such as a wafer, efficiently and stably by leaving no undesirable residue, such as an oxide, on a junction interface, thereby processing the chips in an oxidative atmosphere, such as the atmosphere, before and after surface treatment.SOLUTION: The surface treatment method of a metal region for bonding a chip having a chip side junction interface having one or a plurality of metal regions to a substrate includes a step S1 for preparing a chip where the surface of a metal region is coated with a volatile material, a step S2 for evaporating the volatile material and exposing the surface of the metal region, and a step S3 for performing surface activation by colliding particles having predetermined kinetic energy against the surface of the metal region in a non-oxidative atmosphere, following to the step for exposing the surface of the metal region, and further performing hydrophilic treatment by depositing the water.
摘要翻译：要解决的问题：提供一种通过在接合界面上不留下不需要的残留物（例如氧化物）将多个芯片与晶片等基板（例如晶片）结合而成的技术，从而将芯片加工成氧化气氛，如大气，表面处理前后的处理。解决方案：将具有一个或多个金属区域的具有芯片侧接合界面的芯片接合到基板的金属区域的表面处理方法包括：步骤S1，用于制备金属区域的表面涂覆有挥发性材料的芯片，用于蒸发挥发性材料并暴露金属区域的表面的步骤S2，以及通过使具有预定动能的颗粒碰撞而进行表面活化的步骤S3 在非氧化性气氛中的金属区域的表面，接着暴露金属区域的表面的步骤，并进一步进行亲水处理放水。

9. 发明专利

JP2013048249A Transfer method and transfer device 有权
标题翻译：传输方法和传输设备
公开(公告)号：JP2013048249A
公开(公告)日：2013-03-07
申请号：JP2012204101
申请日：2012-09-18
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/027 , B29C59/02 , G01B11/00
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of imprinting a rough pattern which an original plate contains onto a transfer liquid layer on a substrate with high positional accuracy, with ease.SOLUTION: Under a condition where a rough pattern P surface of an original plate M contacts with a transfer liquid layer UVR which is coated on a substrate S, alignment marks AL formed on the original plate M and the substrate S respectively are imaged at the same time from the direction in which both alignment marks AL overlap each other by a single recognizing means, thereby a single image is obtained. By applying a recognizing process to respective positions of both alignment marks AL separately in the image, the original plate M is aligned with the substrate S. As a result, there is no possibility of occurrence of relative positional error between the alignment mark images of the original plate M and the substrate S that have been imaged, thereby preventing occurrence of positional error that is caused by vibration or different scanning timing.
摘要翻译：要解决的问题：提供一种能够容易地以高位置精度将原始板所含的粗糙图案印刷在基板上的转印液体层上的技术。解决方案：在原版M的粗糙图案P表面与涂覆在基板S上的转印液层UVR接触的状态下，分别在原版M和基板S上形成对准标记AL 同时从两个对准标记AL的方向通过单个识别装置重叠，从而获得单个图像。通过在图像中分别对两个对准标记AL的各个位置应用识别处理，原版M与基板S对准。结果，不可能发生相对位置误差原版M和已经成像的基板S，从而防止由振动或不同的扫描定时引起的位置误差的发生。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2011066287A Pressing device and pressing method 有权
标题翻译：压制装置和压制方法
公开(公告)号：JP2011066287A
公开(公告)日：2011-03-31
申请号：JP2009216985
申请日：2009-09-18
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/60 , H01L21/02
CPC分类号： H01L24/75 , G01B11/14 , H01L23/544 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/75 , H01L2224/75301 , H01L2224/757 , H01L2224/81009 , H01L2224/81121 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81204 , H01L2224/81801 , H01L2224/83121 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , H05K1/0269 , H05K3/303 , H05K2201/09918 , H05K2203/166 , Y02P70/613 , H01L2924/00012 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonding technique which can bond two objects to be bonded with higher accuracy. SOLUTION: Objects to be bonded 91 and 92 are relatively moved in a Z direction, and the object to be bonded 91 and the object to be bonded 92 is brought into contact with each other (step S13). A position gap ΔD of the objects to be bonded 91 and 92 in a horizontal direction is measured, in a state where the objects to be bonded 91 and 92 are made to come into contact with each other (step S14). Then, the objects to be bonded 91 and 92 are moved relatively in a horizontal direction, the alignment of the objects to be bonded 91 and 92 are carried out again, and the position gap ΔD is corrected (step S17). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以更高的精度结合两个待接合的物体的接合技术。解决方案：待接合物体91和92在Z方向上相对移动，并且待接合物体91和被接合物体92彼此接触（步骤S13）。在待接合对象91,92彼此接触的状态下，测量被粘接物91,92在水平方向上的位置间隔ΔD（步骤S14）。然后，被粘接物91,92在水平方向上相对移动，再次进行被接合物91,92的对准，校正位置间隙ΔD（步骤S17）。版权所有（C）2011，JPO＆INPIT

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