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    • 4. 发明授权
    • Methods and apparatus for current sensing in mutually coupled inductors
    • 互耦电感器电流检测方法及装置
    • US08044650B2
    • 2011-10-25
    • US12332627
    • 2008-12-11
    • Benjamin TangTimothy M. NgKenneth Ostrom
    • Benjamin TangTimothy M. NgKenneth Ostrom
    • G05F1/40
    • H02M3/1584H02M2001/0009
    • Methods and apparatus for current sensing in mutually coupled inductors according to various aspects of the present invention may operate in conjunction with a control system adapted to control current through the inductors and multiple current sensors connected to the control system. Each current sensor may comprise a series combination comprising a capacitor and a resistor. The series combination may be connected in parallel with one of the inductors, and may be adapted to generate branch inductor current signals according to a sensed current in the connected inductor. In addition, a coupling capacitor may be coupled between at least two of the current sensors to compensate a time constant of the current sensor for mutual coupling inductance between the inductors.
    • 根据本发明的各个方面的相互耦合的电感器中的电流感测的方法和装置可以与适于控制通过电感器的电流和连接到控制系统的多个电流传感器的控制系统一起工作。 每个电流传感器可以包括包括电容器和电阻器的串联组合。 串联组合可以与电感器中的一个并联连接,并且可以适于根据所连接的电感器中的感测电流产生分支电感器电流信号。 此外,耦合电容器可耦合在至少两个电流传感器之间,以补偿电流传感器在电感器之间的互耦合电感的时间常数。
    • 6. 发明申请
    • METHODS AND APPARATUS FOR CURRENT-CONTROLLED TRANSIENT REGULATION
    • 电流控制瞬态调节的方法和装置
    • US20070075692A1
    • 2007-04-05
    • US11538218
    • 2006-10-03
    • Kenneth OstromBenjamin TangTim NgClifford Duong
    • Kenneth OstromBenjamin TangTim NgClifford Duong
    • G05F1/00
    • G05F1/618G06F1/30G06F1/305
    • Methods and apparatus for regulating power supply according to various aspects of the present invention operate in conjunction with an electronic system configured to interface with a primary voltage regulator. The electronic system comprises a load configured to receive supply current from the primary voltage regulator and a secondary voltage regulator. The secondary voltage regulator includes at least one current source coupled to the load and is configured to provide current to the load. The secondary voltage regulator further comprises a control circuit coupled to the current source and the load, which determines a current demand for the load exceeding the supply current received from the primary voltage regulator, and adjusts the current provided to the load by the current source according to the current demand.
    • 根据本发明的各个方面的用于调节电源的方法和装置与配置成与初级电压调节器接口的电子系统一起工作。 电子系统包括被配置为从主电压调节器和次级电压调节器接收电源电流的负载。 次级电压调节器包括耦合到负载的至少一个电流源,并被配置为向负载提供电流。 次级电压调节器还包括耦合到电流源和负载的控制电路,其确定负载的电流需求超过从主电压调节器接收的电源电流,并且根据电流源调整提供给负载的电流, 到目前的需求。
    • 7. 发明申请
    • Method for optimal path selection in traversal of packets through network address translators
    • 通过网络地址转换器遍历数据包的最优路径选择方法
    • US20050259637A1
    • 2005-11-24
    • US10850977
    • 2004-05-21
    • Thomas ChuTao JinFrancis MageeSteven RichmanBenjamin Tang
    • Thomas ChuTao JinFrancis MageeSteven RichmanBenjamin Tang
    • H04L12/24H04L12/66H04L29/12
    • H04L41/12H04L29/12009H04L61/00
    • Reduction of administrative overhead in maintaining network information, rapid convergence on an optimal routing path through the data network, and utilization of only required network resources are realized by a novel method for establishing a call path between network users. The method is based upon deployment of a network information server that stores network topology information and that is addressable by each end user. In this method, the network information server receives a request to establish a call path. The request identifies at least the calling party. In response to the request, the network information server determines a network traversal between the calling party and a root network wherein the network traversal includes call path information about the sub-networks between the calling party and the root network. The request for establishing a call path can also identify the called party. Based on the calling and called party identification, the network information server also determines a second network traversal between the called party and the root network. The second network traversal is sent to either the calling party or the called party or to both the calling and called parties. The server can determine an intersection of the traversals and send the intersection information to the parties. The intersection information is known as a merge point and represents an optimal call path between the parties.
    • 通过一种在网络用户之间建立呼叫路径的新颖方法,实现了维护网络信息管理开销,通过数据网络优化路由路径快速收敛以及仅需要网络资源利用的管理开销。 该方法基于网络信息服务器的部署,网络信息服务器存储网络拓扑信息,并且可由每个最终用户寻址。 在该方法中,网络信息服务器接收建立呼叫路径的请求。 该请求至少标识主叫方。 响应于该请求,网络信息服务器确定呼叫方和根网络之间的网络遍历,其中,网络遍历包括关于呼叫方和根网络之间的子网络的呼叫路径信息。 建立呼叫路径的请求也可以标识被叫方。 基于呼叫方和被叫方识别,网络信息服务器还确定被叫方与根网络之间的第二网络遍历。 第二个网络遍历被发送到呼叫方或被叫方,或者呼叫方和被叫方。 服务器可以确定遍历的交集,并将交叉路口信息发送给各方。 交叉路口信息称为合并点,表示双方之间的最佳通话路径。
    • 9. 发明授权
    • Chip-to-board connection assembly and method therefor
    • 芯片到板连接组件及其方法
    • US06219254B1
    • 2001-04-17
    • US09286282
    • 1999-04-05
    • Gershon AkerlingJames M. AndersonJohn W. SpargoBenjamin Tang
    • Gershon AkerlingJames M. AndersonJohn W. SpargoBenjamin Tang
    • H05K118
    • H01L23/13H01L23/49833H01L24/48H01L2224/05599H01L2224/16H01L2224/48091H01L2224/73253H01L2224/85399H01L2924/00014H01L2924/01078H01L2924/01079H01L2924/01322H01L2924/1305H01L2924/14H01L2924/15153H01L2924/1517H01L2924/15311H01L2924/1532H01L2924/16152H01L2924/19041H01L2924/30107H01L2924/3011H01L2924/00H01L2224/45015H01L2924/207H01L2224/45099
    • The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51). The connection carrier (33) is provided with the electrical contacts (34) such as bump electrodes each interconnecting a contact location (37) at the surface side of the connection carrier facing the semiconductor chip and the oppositely disposed (i) external pad on the chip or (ii) external pad or landing (35) at a side of the board (32) facing the connection carrier (33). Heat generated during operation is released through the rear side of the semiconductor chip (31r), which is affixed to the board or MCM (32).
    • 芯片对板(或芯片到MCM)连接组件及其方法的特征在于具有设置有外部端子焊盘的前表面(31f)的半导体芯片(31) 在芯片的后表面(31r)的第一侧具有表面(例如凹陷表面)的板或MCM(32); 以及连接载体(33),其被布置为覆盖层,其将所述芯片和所述板或MCM电连接。 在该组装方案中,固定到芯片和板或MCM的连接载体(例如,凸块载体)包含所有所需的信号线追踪(57),以提供半导体芯片和板之间的电互连 MCM。 凸块载体代替所有接合线(24)等,并且可以包括与例如高速/大功率IC芯片(51)相关联的支持/控制电路(无源和/或有源)。 连接载体(33)上设有诸如凸起电极的电触点(34),每个凸起电极互相连接在面向半导体芯片的连接载体的表面侧的接触位置(37)和相对设置的(i)外部垫 芯片或(ii)位于板(32)的面向连接载体(33)的一侧的外部焊盘或着陆(35)。 在半导体芯片(31r)的背面放出运行中产生的热量,该半导体芯片(31r)固定在板或MCM(32)上。