专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070212976A1 Smart polishing media assembly for planarizing substrates 审中-公开
标题翻译：用于平坦化基板的智能抛光介质组件
公开(公告)号：US20070212976A1
公开(公告)日：2007-09-13
申请号：US11374250
申请日：2006-03-13
申请人： Peter McReynolds , Gregory Menk , Benjamin Bonner , Gopalakrishna Prabhu , Erik Rondum , Garlen Leung , Anand Iyer
发明人： Peter McReynolds , Gregory Menk , Benjamin Bonner , Gopalakrishna Prabhu , Erik Rondum , Garlen Leung , Anand Iyer
IPC分类号： B24B51/00 , B24B49/00 , B24D11/00
CPC分类号： B24B21/004 , B24B37/20
摘要： A smart polishing media assembly is provided, along with a polishing system and a method for using the same. In one embodiment, the smart polishing media assembly includes a memory device coupled to a polishing material. The polishing material may be in pad, web or belt form. The memory device generally stores at least one material information, historical use information, and/or conditioning information of the polishing material.
摘要翻译：提供了一种智能抛光介质组件，以及抛光系统及其使用方法。在一个实施例中，智能抛光介质组件包括耦合到抛光材料的存储器件。抛光材料可以是垫，网或带形式。存储装置通常存储抛光材料的至少一种材料信息，历史使用信息和/或调理信息。

2. 发明申请

US20070197147A1 Polishing system with spiral-grooved subpad 审中-公开
标题翻译：抛光系统带螺旋槽子板
公开(公告)号：US20070197147A1
公开(公告)日：2007-08-23
申请号：US11707549
申请日：2007-02-15
申请人： Erik Rondum , Peter McReynolds , Benjamin Bonner , Gregory Menk , Gopalakrishna Prabhu , Garlen Leung , Anand Iyer
发明人： Erik Rondum , Peter McReynolds , Benjamin Bonner , Gregory Menk , Gopalakrishna Prabhu , Garlen Leung , Anand Iyer
IPC分类号： B24B29/00 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A polishing system is described. The polishing system includes a polishing layer, and a subpad supporting the polishing layer, where the subpad has a spiral groove formed therein.
摘要翻译：描述了抛光系统。抛光系统包括抛光层和支撑抛光层的子垫，其中子垫具有形成在其中的螺旋槽。

3. 发明申请

US20060246831A1 Materials for chemical mechanical polishing 有权
标题翻译：化学机械抛光材料
公开(公告)号：US20060246831A1
公开(公告)日：2006-11-02
申请号：US11119682
申请日：2005-05-02
申请人： Benjamin Bonner , Peter McReynolds , Gregory Menk , Anand Iyer , Gopalakrishna Prabhu , Erik Rondum , Robert Jackson , Garlen Leung
发明人： Benjamin Bonner , Peter McReynolds , Gregory Menk , Anand Iyer , Gopalakrishna Prabhu , Erik Rondum , Robert Jackson , Garlen Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24B7/228 , B24D2203/00
摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
摘要翻译：公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

4. 发明申请

US20060097219A1 High selectivity slurry compositions for chemical mechanical polishing 审中-公开
标题翻译：用于化学机械抛光的高选择性浆料组合物
公开(公告)号：US20060097219A1
公开(公告)日：2006-05-11
申请号：US11258466
申请日：2005-10-24
申请人： Benjamin Bonner , Anand Iyer , Olivier Nguyen , Donald Chua , Christopher Lee , Shijian Li
发明人： Benjamin Bonner , Anand Iyer , Olivier Nguyen , Donald Chua , Christopher Lee , Shijian Li
IPC分类号： C09K13/00 , H01L21/461
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1463
摘要： A chemical-mechanical polishing composition that includes less than about 1% wt. abrasive, an additive, and water, where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of polishing a semiconductor substrate in a shallow trench isolation process, the method including contacting the substrate with a polishing pad of a polishing apparatus while applying a high selectivity slurry to the polishing pad, where the slurry comprises less than about 1% wt. abrasive, an additive, and water, and where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of making a chemical-mechanical polishing slurry composition, the method including adding together an abrasive, an additive and water to form the slurry, where a weigh percent of the additive is greater than a weight percent of the abrasive, and the abrasive and additive together comprise less than 2% by wt. of the slurry.
摘要翻译：化学机械抛光组合物，其包含小于约1重量％研磨剂，添加剂和水，其中添加剂的重量百分比大于研磨剂的重量百分比。此外，在浅沟槽隔离工艺中抛光半导体衬底的方法，该方法包括使衬底与抛光装置的抛光垫接触，同时向抛光垫施加高选择性浆料，其中浆料包含小于约1％重量研磨剂，添加剂和水，并且其中添加剂的重量百分比大于研磨剂的重量百分比。另外，制备化学 - 机械抛光浆料组合物的方法，该方法包括将研磨剂，添加剂和水相加以形成浆料，其中添加剂的重量百分比大于磨料的重量百分数，并且研磨剂和添加剂一起包含小于2重量％。的浆料。

5. 发明申请

US20070117500A1 MATERIALS FOR CHEMICAL MECHANICAL POLISHING 有权
标题翻译：化学机械抛光材料
公开(公告)号：US20070117500A1
公开(公告)日：2007-05-24
申请号：US11626014
申请日：2007-01-23
申请人： BENJAMIN BONNER , Peter Mcreynolds , Gregory Menk , Anand Iyer , Gopalakrishna Prabhu , Erik Rondum , Robert Jackson , Garlen Leung
发明人： BENJAMIN BONNER , Peter Mcreynolds , Gregory Menk , Anand Iyer , Gopalakrishna Prabhu , Erik Rondum , Robert Jackson , Garlen Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24B7/228 , B24D2203/00
摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
摘要翻译：公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

6. 发明申请

US20070197141A1 Polishing apparatus with grooved subpad 有权
标题翻译：抛光装置带有凹槽的底垫
公开(公告)号：US20070197141A1
公开(公告)日：2007-08-23
申请号：US11707651
申请日：2007-02-15
申请人： Steven Zuniga , Peter McReynolds , Erik Rondum , Benjamin Bonner , Henry Au , Gregory Menk , Gopalakrishna Prabhu , Anand Iyer , Garlen Leung
发明人： Steven Zuniga , Peter McReynolds , Erik Rondum , Benjamin Bonner , Henry Au , Gregory Menk , Gopalakrishna Prabhu , Anand Iyer , Garlen Leung
IPC分类号： B24B7/30 , B24B7/00 , B24B5/00 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
摘要翻译：描述了抛光装置。抛光装置包括可旋转压板，驱动机构，用于逐渐推进具有沿着线性方向的研磨表面的抛光片横过压板，压板上的子垫以支撑抛光片，子板具有形成在其中的凹槽，以及真空源连接到子垫的凹槽，并被配置为施加足以将抛光片的一部分拉入到子垫的凹槽中以在抛光表面中引起凹槽的真空。

7. 发明申请

US20070218693A1 HIGH SELECTIVITY SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：高选择性浆料组合物化学机械抛光
公开(公告)号：US20070218693A1
公开(公告)日：2007-09-20
申请号：US11750897
申请日：2007-05-18
申请人： Benjamin Bonner , Anand Iyer , Olivier Nguyen , Donald Chua , Christopher Lee , Shijian Li
发明人： Benjamin Bonner , Anand Iyer , Olivier Nguyen , Donald Chua , Christopher Lee , Shijian Li
IPC分类号： C09G1/00
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1463
摘要： A chemical-mechanical polishing composition that includes less than about 1% wt. abrasive, an additive, and water, where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of polishing a semiconductor substrate in a shallow trench isolation process, the method including contacting the substrate with a polishing pad of a polishing apparatus while applying a high selectivity slurry to the polishing pad, where the slurry comprises less than about 1% wt. abrasive, an additive, and water, and where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of making a chemical-mechanical polishing slurry composition, the method including adding together an abrasive, an additive and water to form the slurry, where a weigh percent of the additive is greater than a weight percent of the abrasive, and the abrasive and additive together comprise less than 2% by wt. of the slurry.
摘要翻译：化学机械抛光组合物，其包含小于约1重量％研磨剂，添加剂和水，其中添加剂的重量百分比大于研磨剂的重量百分比。此外，在浅沟槽隔离工艺中抛光半导体衬底的方法，该方法包括使衬底与抛光装置的抛光垫接触，同时向抛光垫施加高选择性浆料，其中浆料包含小于约1％重量研磨剂，添加剂和水，并且其中添加剂的重量百分比大于研磨剂的重量百分比。另外，制备化学 - 机械抛光浆料组合物的方法，该方法包括将研磨剂，添加剂和水相加以形成浆料，其中添加剂的重量百分比大于磨料的重量百分数，并且研磨剂和添加剂一起包含小于2重量％。的浆料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式