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1. 发明申请

WO2004008526A1 A LAYER TRANSFER METHOD 审中-公开
标题翻译：层转移方法
公开(公告)号：WO2004008526A1
公开(公告)日：2004-01-22
申请号：PCT/EP2003/007853
申请日：2003-07-16
申请人： S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES , COMMISSARIAT A L'ENERGIE ATOMIQUE , ASPAR, Bernard , BRESSOT, Séverine , RAYSSAC, Olivier
发明人： ASPAR, Bernard , BRESSOT, Séverine , RAYSSAC, Olivier
IPC分类号： H01L21/762
CPC分类号： H01L21/76259 , H01L21/76254
摘要： The invention concerns a method for transferring a layer of material (41) deriving from a source substrate (4) onto a support substrate (5), comprising at least the steps consisting in : depositing additional material (6) on at least one of the front faces of the source substrate (4) and the support substrate (5) and applying said two substrates (4, 5) against each other; then detaching said layer to be transferred (41) from the source substrate (4) along a zone of weakness (43) by applying a stress of mechanical origin. This method is remarkable in that prior to the step of depositing the material (6), at least one recess (56) for receiving excess additional material (6) is formed in at least one of the two substrates (4, 5), said recess opening onto the front face of said substrate. Application to the fabrication of a composite substrate in the fields of electronics, optoelectronics and optics.
摘要翻译：本发明涉及一种将从源底物（4）衍生的材料层（41）转移到支撑衬底（5）上的方法，该方法至少包括以下步骤：将附加材料（6）沉积在至少一个所述源极基板（4）和所述支撑基板（5）的前表面彼此相对地施加所述两个基板（4,5）; 然后通过施加机械来源的应力，将所述待迁移层（41）从所述源基板（4）沿弱区（43）分离。该方法是显着的，因为在沉积材料（6）的步骤之前，用于接收多余的附加材料（6）的至少一个凹部（56）形成在两个基板（4,5）中的至少一个中，所述在所述衬底的前表面上的凹口。应用于电子，光电子学和光学领域的复合衬底的制造。

2. 发明申请

WO2004066380A1 A LAYER TRANSFER METHOD 审中-公开
标题翻译：层转移方法
公开(公告)号：WO2004066380A1
公开(公告)日：2004-08-05
申请号：PCT/EP2004/000646
申请日：2004-01-22
申请人： S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES , COMMISSARIAT A L'ENERGIE ATOMIQUE , BRESSOT, Séverine , RAYSSAC, Olivier , ASPAR, Bernard
发明人： BRESSOT, Séverine , RAYSSAC, Olivier , ASPAR, Bernard
IPC分类号： H01L21/762
CPC分类号： H01L21/76259 , C09J5/00 , H01L21/76254
摘要： The invention relates to a method of removing a peripheral zone (62) of adhesive while using a layer of adhesive (6) in the process of assembling and transferring a layer (41) of material coming from a source substrate (4) and placed on a support substrate (5). The method is remarkable in that it consists in bonding the two substrates (4 and 5) together by means of an intermediate layer of curable adhesive (6), in curing only that zone (61) of the layer of adhesive (6) which extends facing the front face (43) of said layer (41) of material to be transferred, in removing the zone (62) of non-cured adhesive, and in detaching said layer (41) to be transferred from the remainder (42) of the source substrate. The invention is applicable to fabricating a composite substrate in the fields of electronics, optoelectronics, or optics.
摘要翻译：本发明涉及一种在组装和转移来自源底板（4）的材料层（41）的过程中使用一层粘合剂（6）的同时去除粘合剂的周边区域（62）的方法，并将其放置在支撑基板（5）。该方法是显着的，它包括通过可固化粘合剂（6）的中间层将两个基底（4和5）粘合在一起，仅固化延伸的粘合剂层（6）的区域（61）面对所述待转移材料的所述层（41）的前表面（43），以去除未固化粘合剂的区域（62），并且从所述层（41）的剩余部分（42）分离所述待转移的层（41）源底物。本发明可应用于在电子，光电子学或光学领域制造复合衬底。

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