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1. 发明授权

US07207105B2 Method for producing an integral ceramic circuit board 有权
标题翻译：一体化陶瓷电路板的制造方法
公开(公告)号：US07207105B2
公开(公告)日：2007-04-24
申请号：US11049856
申请日：2005-02-04
申请人： Akira Miyai , Yukihiko Nakajima , Hideki Hirotsuru , Ryozo Nonogaki , Takuya Okada , Masahiro Ibukiyama
发明人： Akira Miyai , Yukihiko Nakajima , Hideki Hirotsuru , Ryozo Nonogaki , Takuya Okada , Masahiro Ibukiyama
IPC分类号： H05K3/36
CPC分类号： H01L23/142 , H01L23/15 , H01L23/3735 , H01L2924/0002 , H05K1/053 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158 , Y10T29/49984 , Y10T428/24917 , H01L2924/00
摘要： A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.
摘要翻译：用于安装电子部件的基板包括具有形成有或不具有凹部的主表面的基板。陶瓷基板设置在基板的主表面上并且具有比基板更小的尺寸。提供金属层以覆盖基板和陶瓷基板。金属层具有远离基板的表面，陶瓷基板平坦，基板由金属材料和陶瓷材料的金属 - 陶瓷复合材料制成，复合材料和金属层中的金属材料具有不同的组合物。因此，可以实现耐受重复的热应力并且可靠性优异的整体陶瓷电路板。

2. 发明授权

US06399187B1 Metal-ceramics composite, heat dissipation device employing it, and processes for producing them 有权
标题翻译：金属陶瓷复合材料，使用它的散热装置及其制造方法
公开(公告)号：US06399187B1
公开(公告)日：2002-06-04
申请号：US09598366
申请日：2000-06-21
申请人： Ryuichi Terasaki , Akira Miyai , Hideki Hirotsuru
发明人： Ryuichi Terasaki , Akira Miyai , Hideki Hirotsuru
IPC分类号： B32B514
CPC分类号： C04B41/009 , C04B38/0003 , C04B41/5155 , C04B41/52 , C04B2111/00844 , C22C1/1036 , C22C2001/1021 , H01L23/15 , H01L2924/0002 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24331 , Y10T428/249957 , Y10T428/249986 , Y10T428/24999 , C04B35/565 , C04B41/4596 , C04B41/5076 , C04B41/5144 , C04B14/324 , C04B14/38 , C04B28/02 , C04B38/00 , H01L2924/00
摘要： A metal-ceramics composite comprising a porous inorganic structure and a metal containing aluminum as the main component, infiltrated into the porous inorganic structure, wherein a part of the porous inorganic structure is made of an inorganic fiber and a hardened product of a hydraulic inorganic substance.
摘要翻译：一种金属陶瓷复合体，其特征在于，包括多孔无机结构体和含有铝的金属作为主要成分，渗透到所述多孔无机结构体中，所述多孔无机结构体的一部分由无机纤维和水硬性无机物质。

3. 发明授权

US4112290A Evaporation vessel for use in vacuum evaporation 失效
标题翻译：用于真空蒸发的蒸发容器
公开(公告)号：US4112290A
公开(公告)日：1978-09-05
申请号：US736169
申请日：1976-10-27
申请人： Yukihiko Nakajima , Shuzou Watanabe , Akira Miyai , Masaji Ishii
发明人： Yukihiko Nakajima , Shuzou Watanabe , Akira Miyai , Masaji Ishii
IPC分类号： C23C14/26 , C23C13/12
CPC分类号： C23C14/26
摘要： An evaporation vessel for vacuum evaporation of electroconductive ceramic boat for use in the vacuum evaporation of a metallic or non-metallic substance by virtue of resistance heating, wherein the surface of the adjoining portion on the both sides of a cavity is lower than the top of the outside wall of the cavity.
摘要翻译：用于通过电阻加热用于金属或非金属物质的真空蒸发的导电陶瓷舟皿的真空蒸发的蒸发容器，其中腔体两侧的相邻部分的表面低于腔的外壁。

4. 发明授权

US08025962B2 Aluminum-silicon carbide composite and heat dissipation device employing the same 有权
标题翻译：铝 - 碳化硅复合材料和采用其的散热装置
公开(公告)号：US08025962B2
公开(公告)日：2011-09-27
申请号：US12095005
申请日：2006-11-13
申请人： Hideki Hirotsuru , Goh Iwamoto , Hideo Tsukamoto , Akira Miyai , Yoshio Sasaki
发明人： Hideki Hirotsuru , Goh Iwamoto , Hideo Tsukamoto , Akira Miyai , Yoshio Sasaki
IPC分类号： B32B3/26 , B32B15/00
CPC分类号： H01L23/13 , C04B35/565 , C04B35/71 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C04B2235/3217 , C04B2235/3418 , C04B2235/402 , C04B2235/5436 , C04B2235/5472 , C04B2235/77 , C04B2235/9607 , C22C1/0475 , C22C1/051 , C22C29/065 , H01L23/15 , H01L23/3731 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , Y10T428/12361 , Y10T428/12389 , Y10T428/12479 , Y10T428/12736 , Y10T428/12993 , Y10T428/2495 , Y10T428/24975 , Y10T428/249957 , Y10T428/249969 , Y10T428/249974 , C04B41/4521 , C04B41/4523 , C04B38/00 , H01L2924/00
摘要： An aluminum-silicon carbide composite suitable for a base plate for power module, having an aluminum-silicon carbide composite, with a front and a rear surface plane, that is a flat plate-shaped silicon carbide porous body impregnated with a metal mainly containing aluminum, and an aluminum layer made of a metal mainly containing aluminum formed only on the front surface plane, wherein the rear surface plane of the composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is rectangular, optionally having peripheral portions encompassing holes removed. Plating is imparted to the composite by providing an aluminum layer on the rear surface plane. Flatness of the composite is improved by grinding its rear surface so that the composite is exposed to the outside. Warpage after grinding the rear surface, is controlled by controlling the thickness of the aluminum layer.
摘要翻译：一种适用于功率模块用基板的铝 - 碳化硅复合体，具有铝 - 碳化硅复合材料，前表面和后表面是浸渍有主要含有铝的金属的平板状碳化硅多孔体，并且由主要含有铝的金属制成的铝层仅形成在前表面上，其中复合材料的后表面平面暴露于外部，并且暴露的铝 - 碳化硅复合材料的形状为矩形，可选地具有包围孔的周边部分被去除。通过在背面平面上设置铝层来赋予复合材料电镀。复合材料的平整度通过研磨其后表面而提高，使得复合材料暴露于外部。研磨后表面后的翘曲是通过控制铝层的厚度来控制的。

5. 发明申请

US20090280351A1 ALUMINUM/SILICON CARBIDE COMPOSITE AND HEAT RADIATION PART MAKING USE OF THE SAME 有权
标题翻译：铝/碳化硅复合材料和热辐射部分使用它们
公开(公告)号：US20090280351A1
公开(公告)日：2009-11-12
申请号：US12095005
申请日：2006-11-13
申请人： Hideki Hirotsuru , Goh Iwamoto , Hideo Tsukamoto , Akira Miyai , Yoshio Sasaki
发明人： Hideki Hirotsuru , Goh Iwamoto , Hideo Tsukamoto , Akira Miyai , Yoshio Sasaki
IPC分类号： B32B5/18
CPC分类号： H01L23/13 , C04B35/565 , C04B35/71 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C04B2235/3217 , C04B2235/3418 , C04B2235/402 , C04B2235/5436 , C04B2235/5472 , C04B2235/77 , C04B2235/9607 , C22C1/0475 , C22C1/051 , C22C29/065 , H01L23/15 , H01L23/3731 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , Y10T428/12361 , Y10T428/12389 , Y10T428/12479 , Y10T428/12736 , Y10T428/12993 , Y10T428/2495 , Y10T428/24975 , Y10T428/249957 , Y10T428/249969 , Y10T428/249974 , C04B41/4521 , C04B41/4523 , C04B38/00 , H01L2924/00
摘要： An aluminum-silicon carbide composite suitable for a base plate for power module is provided. A base plate for power module, comprising an aluminum-silicon carbide composite that is a flat plate-shaped silicon carbide porous body impregnated with a metal containing aluminum as the main component, and an aluminum layer made of a metal containing aluminum as the main component formed only on one of the principal planes of the composite, wherein a rear surface being the other one of principal planes of the aluminum-silicon carbide composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is a rectangle or a rectangle from which portions encompassing holes in the peripheral portion are removed. Plating property is imparted to the composite by providing an aluminum layer on one principal plane of the composite, and the flatness of the composite was improved by grinding its rear surface so that the aluminum-silicon carbide composite is exposed to the outside, and further, the warpage shape after the rear surface is ground is controlled by controlling the thickness of the aluminum layer.
摘要翻译：提供一种适用于功率模块底板的铝 - 碳化硅复合材料。一种用于功率模块的基板，包括铝 - 碳化硅复合体，其为浸有含有铝作为主要成分的金属的平板状碳化硅多孔体，以及由以铝为主要成分的金属制成的铝层仅形成在复合材料的一个主平面上，其中作为铝 - 碳化硅复合材料的另一个主平面的后表面暴露于外部，并且暴露的铝 - 碳化硅复合材料的形状是矩形或从外围部分中包围孔的部分移除的矩形。通过在复合材料的一个主平面上设置铝层，赋予复合材料的电镀特性，并通过研磨其后表面改善复合材料的平整度，使得铝 - 碳化硅复合材料暴露于外部，通过控制铝层的厚度来控制后表面被研磨后的翘曲形状。

6. 发明授权

US06447894B1 Silicon carbide composite, method for producing it and heat dissipation device employing it 有权
标题翻译：碳化硅复合材料，其制造方法以及使用其的散热装置
公开(公告)号：US06447894B1
公开(公告)日：2002-09-10
申请号：US09432568
申请日：1999-11-12
申请人： Hideki Hirotsuru , Kenji Nomura , Ryuichi Terasaki , Mitsuaki Saito , Kazuyuki Hiruta , Akira Miyai
发明人： Hideki Hirotsuru , Kenji Nomura , Ryuichi Terasaki , Mitsuaki Saito , Kazuyuki Hiruta , Akira Miyai
IPC分类号： B32B326
CPC分类号： C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C22C32/0063 , H01L23/3733 , H01L2924/0002 , Y10T428/12007 , Y10T428/249957 , Y10T428/249971 , Y10T428/249974 , Y10T428/24998 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B35/565 , C04B38/00 , H01L2924/00
摘要： A silicon carbide composite which is a flat composite comprising a porous preform of silicon carbide and a metal containing aluminum as the main component, infiltrated into the porous preform, said composite having a warpage of at most 250 &mgr;m per 10 cm of the principal plane length of the composite.
摘要翻译：一种碳化硅复合材料，其是包含碳化硅的多孔预制件和以铝为主要成分的金属作为主要成分的平坦复合材料，其渗透到多孔预型体中，所述复合材料的翘曲最大为250mum / 10cm的主平面长度的复合材料。

7. 发明授权

US4137476A Thermionic cathode 失效
标题翻译：热阴极
公开(公告)号：US4137476A
公开(公告)日：1979-01-30
申请号：US798243
申请日：1977-05-18
申请人： Masaji Ishii , Shuzo Watanabe , Akira Miyai , Hideo Hiraoka
发明人： Masaji Ishii , Shuzo Watanabe , Akira Miyai , Hideo Hiraoka
IPC分类号： H01J1/13 , H01J1/16 , H01J19/10
CPC分类号： H01J1/13
摘要： A thermionic cathode for an electron beam device is provided which comprises a first layer of thermoelectron emissive compound sharpened towards a point, a third layer of metal of high melting point and a second layer of reaction barrier interposed between the first and third layers, current terminals being attached to said third layer. According to the invention, a thermionic cathode capable of emitting stable electron beams of high intensity for a long period of time can be manufactured.
摘要翻译：提供了一种用于电子束装置的热离子阴极，其包括朝向点锐化的第一层热电子发射化合物，高熔点金属第三层和介于第一和第三层之间的第二反应栅层，电流端子附着于所述第三层。根据本发明，可以制造能够长时间发射高强度电子束的热离子阴极。

8. 发明申请

US20080245305A1 Metal Evaporation Heating Element and Method for Evaporating Metal 审中-公开
标题翻译：金属蒸发加热元件和蒸发金属的方法
公开(公告)号：US20080245305A1
公开(公告)日：2008-10-09
申请号：US10579717
申请日：2004-11-16
申请人： Kouki Ikarashi , Akira Miyai , Shoujiro Watanabe , Junichi Susaki , Kentaro Iwamoto
发明人： Kouki Ikarashi , Akira Miyai , Shoujiro Watanabe , Junichi Susaki , Kentaro Iwamoto
IPC分类号： C23C16/00 , H05B3/02
CPC分类号： C23C14/243 , H05B3/141
摘要： A metal evaporation boat having improved wettability to a molten metal and having a prolonged life, and a method for evaporating a metal employing it.A metal evaporation heating element characterized by having one or more grooves in a direction not in parallel with a current direction, on an upper surface of a ceramic sintered body comprising titanium diboride (TiB2) and/or zirconium diboride (ZrB2), and boron nitride (BN). It is preferred that the direction not in parallel with the current collection is from 20 to 160° C. to the current direction, that the ceramic sintered body has a cavity and the groove is formed on the bottom surface thereof, and that a predetermined pattern is drawn by a plurality of grooves on the upper surface of the ceramic sintered body and/or on the upper surface of the cavity. In addition, a method for evaporating a metal characterized by using the metal evaporation heating element and heating a metal in vacuum in a state where part or whole of the groove is in contact with the metal.
摘要翻译：一种具有改善的对熔融金属的润湿性并具有延长使用寿命的金属蒸发舟，以及一种使用该金属的蒸发金属的方法。一种金属蒸发加热元件，其特征在于在与电流方向不平行的方向上具有一个或多个槽，在包含二硼化钛（TiB 2 N 2）和/或锆的陶瓷烧结体的上表面上二硼化物（ZrB 2 N 2）和氮化硼（BN）。优选的是，与电流收集不平行的方向为20至160℃至当前方向，陶瓷烧结体具有空腔并且在其底表面上形成凹槽，并且预定图案由陶瓷烧结体的上表面上和/或在空腔的上表面上的多个凹槽拉出。此外，一种蒸发金属的方法，其特征在于，在所述槽的一部分或整体与所述金属接触的状态下，使用所述金属蒸发加热元件并在真空中加热金属。

9. 发明申请

US20050167792A1 Integral ceramic circuit board and method for producing the same 有权
标题翻译：一体化陶瓷电路板及其制造方法
公开(公告)号：US20050167792A1
公开(公告)日：2005-08-04
申请号：US11049856
申请日：2005-02-04
申请人： Akira Miyai , Yukihiko Nakajima , Hideki Hirotsuru , Ryozo Nonogaki , Takuya Okada , Masahiro Ibukiyama
发明人： Akira Miyai , Yukihiko Nakajima , Hideki Hirotsuru , Ryozo Nonogaki , Takuya Okada , Masahiro Ibukiyama
IPC分类号： H01L23/14 , H01L23/15 , H01L23/373 , H05K1/05 , H01L23/495
CPC分类号： H01L23/142 , H01L23/15 , H01L23/3735 , H01L2924/0002 , H05K1/053 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158 , Y10T29/49984 , Y10T428/24917 , H01L2924/00
摘要： A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.
摘要翻译：用于安装电子部件的基板包括具有形成有或不具有凹部的主表面的基板。陶瓷基板设置在基板的主表面上并且具有比基板更小的尺寸。提供金属层以覆盖基板和陶瓷基板。金属层具有远离基板的表面，陶瓷基板平坦，基板由金属材料和陶瓷材料的金属 - 陶瓷复合材料制成，复合材料和金属层中的金属材料具有不同的组合物。因此，可以实现耐受重复的热应力并且可靠性优异的整体陶瓷电路板。

10. 发明授权

US4610858A Chlorosilane disproportionation catalyst and method for producing a silane compound by means of the catalyst 失效
标题翻译：氯硅烷歧化催化剂和通过催化剂制备硅烷化合物的方法
公开(公告)号：US4610858A
公开(公告)日：1986-09-09
申请号：US713901
申请日：1985-03-20
申请人： Mitsunori Yamada , Masaji Ishii , Akira Miyai , Yukihiko Nakajima , Shinsei Sato
发明人： Mitsunori Yamada , Masaji Ishii , Akira Miyai , Yukihiko Nakajima , Shinsei Sato
IPC分类号： B01D3/32 , C01B33/04 , C01B33/107
CPC分类号： C01B33/10773 , B01D3/322 , C01B33/043
摘要： A chlorosilane disproportionation catalyst comprising a tertiary amine of the formula: ##STR1## where each R represents an aliphatic hydrocarbon group and the sum of carbon atoms in the three aliphatic hydrocarbon groups as R is 12 or more, and a tertiary amine hydrochloride of the formula: ##STR2## where R is as defined above.
摘要翻译：一种氯硅烷歧化催化剂，其包含下式的叔胺：其中每个R表示脂族烃基，并且作为R的三个脂族烃基中的碳原子总数为12或更大，以及叔胺盐酸盐式（B）其中R如上定义。

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