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1. 发明申请

US20090039908A1 MICROSTRUCTURE INSPECTING APPARATUS AND MICROSTRUCTURE INSPECTING METHOD 审中-公开
标题翻译：微结构检测装置和微结构检测方法
公开(公告)号：US20090039908A1
公开(公告)日：2009-02-12
申请号：US12282744
申请日：2006-04-12
申请人： Naoki Ikeuchi , Masami Yakabe , Akiko Kamigori
发明人： Naoki Ikeuchi , Masami Yakabe , Akiko Kamigori
IPC分类号： G01R31/02
CPC分类号： G01P21/00 , B81C99/005 , G01P15/123 , G01P15/18 , G01P2015/0842 , G01R31/2829
摘要： A microstructure inspecting apparatus for evaluating a characteristic of at least one microstructure having a movable section formed on a substrate, includes: a probe, which electrically connects with pads formed on the microstructure, for obtaining an electric signal of the microstructure; a plurality of nozzles, positioned in the vicinity of the movable section of the microstructure, for discharging or sucking a gas; a nozzle flow rate controller for controlling a flow rate of the gas discharged from or sucked into the plurality of nozzles; and an evaluation unit for detecting a displacement of the movable section of the microstructure by using the electric signal obtained through the probe, wherein the displacement is made by the gas discharged from or sucked into the plurality of nozzles, and evaluating the characteristic of the microstructure based on the detected result.
摘要翻译：一种用于评价具有形成在基板上的可移动部分的至少一个微结构的特性的微结构检查装置，包括：与形成在微结构体上的焊盘电连接的探针，用于获得微结构的电信号; 多个喷嘴，位于微细结构的可移动部分附近，用于排出或吸入气体; 喷嘴流量控制器，用于控制从所述多个喷嘴排出或吸入所述多个喷嘴的气体的流量; 以及评估单元，用于通过使用通过探针获得的电信号来检测微结构的可移动部分的位移，其中通过从多个喷嘴排出或吸入多个喷嘴的气体进行位移，并评估微观结构的特性基于检测结果。

2. 发明授权

US07023002B2 Surface treating device and surface treating method 失效
标题翻译：表面处理装置及表面处理方法
公开(公告)号：US07023002B2
公开(公告)日：2006-04-04
申请号：US10895039
申请日：2004-07-21
申请人： Kazuya Nagaseki , Tadashi Onishi , Koichi Murakami , Daisuke Hayashi , Akiko Kamigori , Minoru Honda
发明人： Kazuya Nagaseki , Tadashi Onishi , Koichi Murakami , Daisuke Hayashi , Akiko Kamigori , Minoru Honda
IPC分类号： G21G5/00 , H01J37/00
CPC分类号： H01L21/67161 , G03F7/40 , H01J2237/31 , H01L21/67115 , H01L21/67248 , H01L21/68742 , H01L21/68785
摘要： Installed in a vacuum chamber is a mounting table for supporting semiconductor wafer, which is a substrate to be treated, with an electron beam irradiation mechanism mounted on the ceiling of the vacuum chamber for generating electron beams. The mounting table is adapted to be vertically moved by a lifting/lowering device, allowing the distance between the electron beam irradiating mechanism and the semiconductor wafer to be set at a desired value. This makes it possible to perform a uniform satisfactory treatment over the entire surface of the substrate to be treated.
摘要翻译：安装在真空室中的是用于支撑作为待处理基板的半导体晶片的安装台，其中电子束照射机构安装在用于产生电子束的真空室的天花板上。安装台适于通过提升/降低装置垂直移动，允许将电子束照射机构和半导体晶片之间的距离设定在期望值。这使得可以对待处理的基底的整个表面进行均匀的令人满意的处理。

3. 发明申请

US20060194516A1 Processing apparatus and processing method 审中-公开
标题翻译：处理装置及处理方法
公开(公告)号：US20060194516A1
公开(公告)日：2006-08-31
申请号：US11342827
申请日：2006-01-31
申请人： Akiko Kamigori , Tadashi Onishi
发明人： Akiko Kamigori , Tadashi Onishi
IPC分类号： B24B7/30 , B24B1/00 , B24B7/19
CPC分类号： H01L21/6875 , H01L21/67109
摘要： A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a predetermined distance from the table. This structure minimizes the extent of uneven heating of the substrate, which, in turn, enables uniform processing of the surface on the substrate.
摘要翻译：根据本发明的处理装置包括至少三个用于将基板保持在预定的位置的突出部分，该基板放置在配备有加热器的工作台上的基板，同时通过在基板上辐射电子束，距离桌子的距离这种结构使得衬底的不均匀加热的程度最小化，这进而使得能够均匀地处理衬底上的表面。

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