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    • 2. 发明授权
    • Method and apparatus for improved video coding
    • 用于改进视频编码的方法和装置
    • US5973738A
    • 1999-10-26
    • US921484
    • 1997-09-02
    • Aditya Srivastava
    • Aditya Srivastava
    • H04N5/14H04N7/36H04N7/50H04N11/02
    • H04N19/51H04N19/503H04N5/145
    • The present invention includes a video encoder optimized so as to be implemented using general purpose DSPs or as software executable on a general purpose microprocessor. The present invention includes a modified motion detector module (50) which classifies blocks in the currently processing image as moving or stationary. Blocks classified as moving are then processed by an modified motion compensation module (52) which uses a center-biased orthogonal searching procedure to match the block with a previously processed image. A zero block detector module (54) determines whether the block will generate a zero-valued block after being processed by a transform module 18 and a quantization module 20. If a zero-valued block is predicted, the transformation module 18 and the quantization module 20 are bypassed.
    • 本发明包括优化的视频编码器,以便使用通用DSP来实现,或者作为在通用微处理器上可执行的软件。 本发明包括将当前处理图像中的块分类为移动或静止的修改的运动检测器模块(50)。 分类为移动的块然后由修改的运动补偿模块(52)处理,该修改的运动补偿模块使用中心偏置正交搜索过程来将块与先前处理的图像相匹配。 零块检测器模块(54)确定在由变换模块18和量化模块20处理之后块是否将产生零值块。如果预测了零值块,则变换模块18和量化模块 20被旁路。
    • 9. 发明授权
    • Apparatus and method for production process diagnosis using dynamic time
warping
    • 使用动态时间扭曲的生产过程诊断的装置和方法
    • US4861419A
    • 1989-08-29
    • US233878
    • 1988-08-15
    • Bruce E. FlinchbaughSteven B. DolinsAditya SrivastavaJon Reese
    • Bruce E. FlinchbaughSteven B. DolinsAditya SrivastavaJon Reese
    • H01J37/32
    • H01J37/32935
    • Operations of a plasma etch reactor (10) are monitored to detect aberrations in etching operations. A reference end point trace is defined (62) for the etch process. Regions are defined in the reference end point trace (70) with aid of a dynamic time warping matching function (84) and characteristics and tolerances for each region are defined (72-80). The etcher is run and an actual end point trace is obtained (82) from the running of the etcher. A warping function is constructed (88) between the actual trace and the reference trace. In building the warping function, candidate path segments (100) are constructed according to a minimum cumulative cost function (96). Once the regions of the reference trace and the actual trace has been matched according to an optimum dynamic time warping function path (106), characteristics of the matched regions are compared (66) to determine whether aberrations have occurred during the etch process. In an alternative embodiment, the actual trace (164) is matched to each of a library of reference traces (162,182) by dynamic time warping (166). By determining the best match, a determination can be made whether the actual trace is abnormal (174) or normal (176), and the type of abnormality.
    • 监测等离子体蚀刻反应器(101)的操作以检测蚀刻操作中的像差。 为刻蚀工艺定义参考端点迹线(62)。 通过动态时间扭曲匹配函数(84)的帮助,在参考端点迹线(70)中定义区域,并且定义每个区域的特征和公差(72-80)。 蚀刻器运行,从蚀刻器的运行中获得实际的终点痕迹(82)。 在实际轨迹和参考轨迹之间构建(88)翘曲函数。 在构建翘曲函数中,根据最小累积成本函数构建候选路径段(100)(96)。 一旦根据最佳动态时间扭曲函数路径(106)参考轨迹和实际迹线的区域被匹配,比较匹配区域的特性(66)以确定在蚀刻过程期间是否发生像差。 在替代实施例中,通过动态时间扭曲(166)将实际迹线(164)与参考迹线库(162,182)中的每一个匹配。 通过确定最佳匹配,可以确定实际迹线是否异常(174)或正常(176)以及异常的类型。