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    • 2. 发明专利
    • Mold for golf ball, manufacturing method therefor, and golf ball manufacturing method
    • 高尔夫球模具,其制造方法和高尔夫球杆制造方法
    • JP2003305743A
    • 2003-10-28
    • JP2002110964
    • 2002-04-12
    • Purotonikusu Kenkyusho:KkSumitomo Rubber Ind Ltd住友ゴム工業株式会社有限会社プロトニクス研究所
    • SAKAGAMI MASATAKEYUGAWA AKIHIRO
    • B29C43/36B29K21/00B29L31/54
    • PROBLEM TO BE SOLVED: To provide a mold 1 for a golf ball exerting no adverse effect on the physical properties of the golf ball and having good lasting releasability.
      SOLUTION: The mold 1 comprises a base part 6, a substrate layer 7 and a release layer 8. The release layer 8 comprises first and second release layers 9 and 10. The substrate layer 7 comprises a composite film containing nickel and a fluorine type polymeric compound dispersed in nickel. The first release layer is obtained by substituting nickel of a preparatory composite film containing nickel and the fluorine type polymeric compound dispersed in nickel with gold. The second release layer 10 is a composite film containing gold and the fluorine type polymeric compound dispersed in gold. The content of the fluorine type polymeric compound in the second release layer is 15-40 vol.%. The sum total thickness of the first and second release layers 9 and 10 is 0.5-3 μm.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种用于高尔夫球的模具1,其对高尔夫球的物理性能没有不利影响并且具有良好的持久释放性。 解决方案:模具1包括基部6,基底层7和释放层8.剥离层8包括第一和第二释放层9和10.基底层7包括含镍和复合膜的复合膜 分散在镍中的氟类聚合物。 第一剥离层是通过用镍代替含有镍的预备复合膜的镍和用金分散在镍中的氟类聚合物来获得的。 第二剥离层10是含有金的分散在金中的氟系高分子化合物的复合膜。 第二脱模层中的氟系高分子化合物的含量为15〜40体积%。 第一和第二释放层9和10的总和厚度为0.5-3μm。 版权所有(C)2004,JPO
    • 3. 发明专利
    • HIGH CORROSION RESISTANT Ni-BASED COMPOSITE PLATING COATING FILM
    • 高耐腐蚀镍基复合镀膜
    • JP2011137195A
    • 2011-07-14
    • JP2009296784
    • 2009-12-28
    • Purotonikusu Kenkyusho:Kk有限会社プロトニクス研究所
    • YUGAWA AKIHIRO
    • C25D5/12C25D3/56
    • PROBLEM TO BE SOLVED: To provide a high corrosion resistant Ni-based composite plating coating film formed on the surface of a base metal, particularly aluminum alloy, provided with high corrosion resistance to be used to withstand a severe environment that salt water is sprayed in a metal component of aircraft, ship or port and having small environmental load to replace a Cd plating film. SOLUTION: A copper cyanate plating film 4 and a glossiness copper sulfate plating film 5 are formed on the surface of the metal component 1 one by one and a Ni-P plating film 6 or Ni-P-Sn plating film containing P with high concentration is formed thereon. Alternatively, the Ni-P plating film containing P with high concentration and the Ni-P-Sn plating film are formed on the surface of the metal component one by one. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供高耐腐蚀的镍基复合镀覆膜,其形成在贱金属,特别是铝合金的表面上,具有高耐腐蚀性,可用于经受苛刻环境的盐水 喷涂在飞机,船舶或港口的金属部件中,环境负荷小,以取代Cd镀膜。 解决方案:在金属组分1的表面上一个接一个地形成氰酸铜镀覆膜4和光泽度硫酸铜电镀膜5,以及Ni-P镀膜6或含P的Ni-P-Sn镀膜 在其上形成高浓度。 或者,将含有高浓度P的Ni-P镀膜和Ni-P-Sn镀膜逐一形成在金属成分的表面上。 版权所有(C)2011,JPO&INPIT
    • 6. 发明专利
    • Method for surface treatment of silver thin film, precision component and electric and electronic devices using the same
    • 用于表面处理银薄膜,精密组件和使用该薄膜的电子和电子器件的方法
    • JP2010144198A
    • 2010-07-01
    • JP2008320474
    • 2008-12-17
    • Purotonikusu Kenkyusho:Kk有限会社プロトニクス研究所
    • YUGAWA AKIHIRO
    • C23C28/00B32B15/082C25D5/48C25D7/00
    • PROBLEM TO BE SOLVED: To provide a method for surface treatment of a silver thin film capable of safely executing the PTFE coating of a surface of the silver thin film formed on a precision component or electric and electronic devices with less environmental load and the characteristics equivalent to or higher than those of the conventional ones by a simple process, and to provide precision components and electric and electronic devices using the same. SOLUTION: In the method for surface treatment in which the PTFE coating is executed on a surface of a silver thin film pattern-formed on the entire surface of a base body or partially thereon, PTFE powder is brought into contact with the base body and deposited on its surface, and then, the PTFE coating film is fixed on the surface of the silver thin film by the heat treatment, and any excessive particles deposited on the surface of the base body and the surface of the silver thin film are removed by a brush, the vibration or the gas purge. The silver thin film is a glossless silver-plated coating film, and after depositing the PTFE powder of the grain size of 0.2-2 μm on the surface of the silver thin film, the PTFE powder is subjected to the heat treatment at the temperature of 50-250°C. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种能够安全地执行形成在精密部件上的银薄膜的表面的PTFE涂层或具有较小环境负荷的电气和电子设备的银薄膜的表面处理方法, 通过简单的工艺等同于或高于常规特性的特性,以及提供使用其的精密部件和电气和电子设备。 解决方案:在表面处理方法中,在基体的整个表面上形成的银薄膜图案的表面上或部分地进行PTFE涂层的方法中,使PTFE粉末与基底 在其表面上沉积,然后通过热处理将PTFE涂膜固定在银薄膜的表面上,沉积在基体表面和银薄膜表面上的任何过量颗粒是 用刷子清除,振动或气体吹扫。 银薄膜是无光泽的镀银膜,在银薄膜的表面上沉积0.2-2μm粒径的PTFE粉末后,将PTFE粉末在温度为 50-250℃。 版权所有(C)2010,JPO&INPIT