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1. 发明专利

JP2009168755A Humidity indicator 审中-公开
标题翻译：湿度指示器
公开(公告)号：JP2009168755A
公开(公告)日：2009-07-30
申请号：JP2008009749
申请日：2008-01-18
申请人： Kiyofumi Mizoguchi , Kenji Nabeta , Akio Okamoto , 彰夫岡本 , 清文溝口 , 健司鍋田
发明人： OKAMOTO AKIO , NABETA KENJI , MIZOGUCHI KIYOFUMI
IPC分类号： G01N31/22 , G01N31/00
摘要： PROBLEM TO BE SOLVED: To provide a humidity indicator which indicates the humidity and elapsed time by discoloration, wherein the indication is stored, and reduces the occurrence of cracks or the like after moisture absorption.
SOLUTION: The humidity indicator includes a substrate 11, a discoloration layer 12 formed on the surface of the substrate, and a moisture sensitive layer 13 formed on the discoloration layer, and the discoloration layer includes a pH indicator which discolors in a pH acidic region, and hydrophilic resin. The moisture sensitive layer includes hydrophilic resin and, (A) nonaqueous solvent-soluble and hydrosoluble organic compound including carboxyl radical and/or phenolic hydroxyl, or (B) anhydride, ester, or lactone which reacts with water to produce the organic compound. An adjustment layer 14 may be formed on the moisture sensitive layer 13 to adjust time to the discoloration.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种湿度指示器，其通过变色指示湿度和经过时间，其中存储指示，并且减少吸湿后的裂纹等的发生。解决方案：湿度指示器包括基板11，形成在基板表面上的变色层12和形成在变色层上的湿度敏感层13，并且变色层包括在pH值变色的pH指示剂酸性区域和亲水性树脂。湿敏层包括亲水性树脂和（A）包含羧基和/或酚羟基的非水溶剂可溶性和水溶性有机化合物，或（B）与水反应产生有机化合物的酸酐，酯或内酯。可以在湿敏层13上形成调整层14，以调节变色的时间。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2013180792A Cover tape for packaging chip type electronic part 审中-公开
标题翻译：包装芯片类型电子部件的封条
公开(公告)号：JP2013180792A
公开(公告)日：2013-09-12
申请号：JP2012045045
申请日：2012-03-01
申请人： Line Plast:Kk , 株式会社ラインプラスチック , T & K Toka Co Ltd , 株式会社ティ−アンドケイ東華 , Kenji Nabeta , 健司鍋田
发明人： IKEDA KENTARO , SHINODA MAKOTO , NABETA KENJI
IPC分类号： B65D85/86 , B32B25/08 , B32B27/18 , B32B27/32 , B65D53/00 , B65D65/40 , B65D73/02
摘要： PROBLEM TO BE SOLVED: To provide a cover tape for packaging chip type electronic parts which can suppress static electricity generated upon friction or peeling of a cover tape, suppress the lowering of tape strength which is caused by width-narrowing of the cover tape or the lowering of transparency of the cover tape stored under a high temperature condition, and retain the peel-off strength within a proper range.SOLUTION: A cover tape for packaging chip type electronic parts, to be heat-sealed onto an embossed carrier tape having a housing pocket of chip type electronic parts, has a multilayer structure including: an antistatic layer 1 containing an antistatic agent; a substrate layer 2 of a biaxially stretched plastic film; an intermediate layer 4 made from polyethylene; an interlayer bonding layer 3 for bonding a substrate and the intermediate layer; and a seal layer 5 heat-sealed to the embossed carrier tape, wherein the seal layer is configured such that metal oxide conductive fine powder and spherical polymer fine particles are dispersed in a resin mixture of a thermoplastic elastomer resin, a tackifier resin, and an acrylic resin.
摘要翻译：要解决的问题：为了提供一种用于包装芯片型电子部件的盖带，其能够抑制由于盖带的摩擦或剥离而产生的静电，抑制由带状物的宽度变窄引起的带强度的降低或降低在高温条件下储存的盖带的透明度，并将剥离强度保持在适当的范围内。解决方案：将用于包装芯片型电子部件的盖带热封在具有芯片型电子部件的容纳口袋具有多层结构，包括：抗静电层1，其含有抗静电剂; 双轴拉伸塑料薄膜的基材层2; 由聚乙烯制成的中间层4; 用于将衬底和中间层接合的层间结合层3; 以及密封层5，其被密封到压花载带上，其中密封层被构造成使得金属氧化物导电细粉末和球形聚合物细颗粒分散在热塑性弹性体树脂，增粘树脂和丙烯酸树脂。

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