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1. 发明申请

WO2010096317A1 POWER SOURCE ESTIMATION METHODS AND APPARATUS 审中-公开
标题翻译：电源估计方法和设备
公开(公告)号：WO2010096317A1
公开(公告)日：2010-08-26
申请号：PCT/US2010/023827
申请日：2010-02-11
申请人： SEGWAY INC. , ROBINSON, David
发明人： ROBINSON, David
IPC分类号： G01R31/36 , B60L11/18
CPC分类号： G01R31/3693 , B60L7/14 , B60L11/1861 , B60L2200/16 , B60L2220/14 , B60L2220/16 , B60L2220/46 , B60L2240/421 , B60L2240/423 , B60L2240/547 , B60L2240/549 , B62K11/007 , G01R31/3624 , Y02T10/642 , Y02T10/7005 , Y02T10/7044 , Y02T10/705
摘要： A method for estimating power capability of a power source driving an electrical load can include obtaining initial values of power source parameters including a voltage value and a current value while preventing the power source from causing kinetic energy to be produced in the electrical load. The method can also include estimating power capability of the power source based on the initial values of the power source parameters.
摘要翻译：用于估计驱动电负载的电源的功率能力的方法可以包括获得包括电压值和电流值的电源参数的初始值，同时防止电源在电负载中产生动能。该方法还可以包括基于电源参数的初始值来估计电源的功率能力。

2. 发明申请

WO2009099733A1 FLUIDIC SYSTEM WITH IMPROVED FLOW CHARACTERISTICS 审中-公开
标题翻译：具有改进流动特性的流体系统
公开(公告)号：WO2009099733A1
公开(公告)日：2009-08-13
申请号：PCT/US2009/031060
申请日：2009-01-15
申请人： BIOSCALE, INC. , MASTERS, Brett, P. , FALB, Peter, W. , MILLER, Michael, F.
发明人： MASTERS, Brett, P. , FALB, Peter, W. , MILLER, Michael, F.
IPC分类号： B01L3/00 , G01N29/02
CPC分类号： G01N29/222 , B01L3/502707 , B01L3/502746 , B01L2200/027 , B01L2200/0668 , B01L2300/0627 , B01L2300/0877 , B01L2400/0487 , B01L2400/084 , G01N29/022 , G01N2291/014 , G01N2291/0423 , G01N2291/0427 , Y10T137/2082 , Y10T137/2191 , Y10T137/2224
摘要： The invention relates to a fluidic system (200) that includes a body structure having a chamber (264) disposed therein. The fluidic system (200) includes at least one fluid input (268) at a first end (276) of the chamber (264) and at least one fluid output (274) at a second end ( (280) of the chamber (264). The fluidic system also includes a sensor device (260) (e.g., an acoustic device) having a surface (284) defining a portion of a surface of the chamber (264). The fluidic system (200) also includes a first surface (222a) at the first end (276) of the chamber (264) oriented at an oblique or arcuate (e.g., curved) angle relative to the surface (284) of the sensor device (260) to direct fluid through the chamber (264).
摘要翻译：本发明涉及一种流体系统（200），其包括具有设置在其中的室（264）的主体结构。流体系统（200）包括在腔室（264）的第一端（276）处的至少一个流体输入（268）和在腔室（264）的第二端（280）处的至少一个流体输出（274）流体系统还包括具有限定腔室（264）表面的一部分的表面（284）的传感器装置（例如，声学装置），流体系统（200）还包括第一表面（260）的表面（284）以倾斜或弓形（例如，弯曲）的角度定向的腔室（264）的第一端（276）处的导管（222a），以引导流体通过腔室）。

3. 发明申请

WO2007146558A2 CLASSIFYING FAULTS ASSOCIATED WITH A MANUFACTURING PROCESS 审中-公开
标题翻译：与制造过程相关的分类故障
公开(公告)号：WO2007146558A2
公开(公告)日：2007-12-21
申请号：PCT/US2007/069457
申请日：2007-05-22
申请人： MKS INSTRUMENTS, INC , HENDLER, Lawrence , LEV-AMI, Uzi, Josef
发明人： HENDLER, Lawrence , LEV-AMI, Uzi, Josef
CPC分类号： G05B23/0281
摘要： Faults that are associated with a set of variables that are each associated with a manufacturing parameter are classified. A fault vector is defined according to a multivariate analysis based on a contribution to a metric of a subset of the variables. The fault vector is compared to a plurality of previously-defined fault vectors to determine a comparison value indicative of a correlation between the fault vector and the plurality of previously-defined fault vectors. The fault vector is associated with at least one of a first set of fault vectors indicative of a known fault or a second set of fault vectors indicative of an unknown fault based in part on the comparison value.
摘要翻译：与与制造参数相关联的一组变量相关联的故障被分类。根据对变量子集的度量的贡献，根据多变量分析来定义故障向量。将故障向量与多个先前定义的故障向量进行比较，以确定指示故障向量与多个先前定义的故障向量之间的相关性的比较值。部分地基于比较值，故障向量与指示已知故障的第一组故障向量或指示未知故障的第二组故障向量中的至少一个相关联。

4. 发明申请

WO2007127107A3 MICROFABRICATED DEVICES AND METHOD FOR FABRICATING MICROFABRICATED DEVICES 审中-公开
公开(公告)号：WO2007127107A3
公开(公告)日：2007-11-08
申请号：PCT/US2007/009399
申请日：2007-04-17
申请人： BIOSCALE, INC. , BAKSHI, Shivalik , MILLER, Michael, F.
发明人： BAKSHI, Shivalik , MILLER, Michael, F.
IPC分类号： B81B7/00
摘要： Microfabricated devices for operation in a fluid that include a substrate that has a first and second surface and a first electrode material layer located over the first surface of the substrate. The devices have a piezoelectric material layer located over the first electrode material layer and a second electrode material layer located over the piezoelectric material layer. The devices also include a layer of isolation material located over the second electrode material layer that at least one of chemically or electrically isolates a portion of the second electrode material layer from a fluid. Some devices include a layer of conductive material located over the layer of isolation material.

5. 发明申请

WO2007062038A1 METHODS AND APPARATUS FOR ASSAY MEASUREMENTS 审中-公开
标题翻译：测量方法和装置
公开(公告)号：WO2007062038A1
公开(公告)日：2007-05-31
申请号：PCT/US2006/045057
申请日：2006-11-21
申请人： BIOSCALE, INC. , MASTERS, Brett, P. , MILLER, Michael, F. , SAUER-BUDGE, Alexis, F.
发明人： MASTERS, Brett, P. , MILLER, Michael, F. , SAUER-BUDGE, Alexis, F.
IPC分类号： G01N33/543 , B06B1/00 , G01N29/02
CPC分类号： G01N33/54373 , B82Y15/00 , B82Y30/00 , G01N29/022 , G01N29/036 , G01N29/30 , G01N29/4436 , G01N2291/0255 , G01N2291/0256 , G01N2291/02836 , G01N2291/0423 , G01N2291/0426 , G01N2291/0427 , Y10T436/2575
摘要： Methods and apparatuses for performing assays involving binding material elements with a plurality of bonds over a substantial area of a surface of a resonant device establishing a normalized exposure. The methods and apparatuses also involve controlling an external influence applied to the material elements over a first period of time and measuring a signal during a second period of time that is indicative of the change in the amount of material elements bound to the surface relative to the normalized exposure. In some cases, the measured signals are integrated with respect to time to determine the time averaged amount of material elements bound to the surface.
摘要翻译：用于进行测定的方法和装置，其涉及在谐振装置的表面的实质区域上结合具有多个键的材料元件，从而建立归一化曝光。所述方法和装置还涉及控制在第一时间段内施加到材料元件的外部影响，并且在第二时间段内测量指示与表面相关的材料元素量相对于归一化曝光在一些情况下，测量的信号相对于时间被积分，以确定与表面结合的材料元素的时间平均量。

6. 发明申请

WO2006107961A3 ELECTRICALLY RESPONSIVE DEVICE 审中-公开
公开(公告)号：WO2006107961A3
公开(公告)日：2006-10-12
申请号：PCT/US2006/012491
申请日：2006-04-05
申请人： BIOSCALE, INC. , MASTERS, Brett P. , MILLER, Michael F.
发明人： MASTERS, Brett P. , MILLER, Michael F.
IPC分类号： H03H3/00 , H03H3/04 , H03H3/10 , H03H9/02
摘要： Electrically responsive devices and methods for fabricating electrically- responsive devices involves applying an electrically responsive material (e.g. piezoelectric material) (132) over at least a portion of a surface of a substrate material (104) and applying an electrode material (140) over at least a portion of a surface of the electrically responsive material. At least one region of the electrode material (140) is selectively removed exposing the electrically responsive material (244) . At least some of the electrically responsive material is selectively removed in a region corresponding to the at least one region of the electrode material.

7. 发明申请

WO2013151606A1 SEMICONDUCTOR COOLING APPARATUS 审中-公开
标题翻译：半导体冷却装置
公开(公告)号：WO2013151606A1
公开(公告)日：2013-10-10
申请号：PCT/US2013/021619
申请日：2013-01-16
申请人： RAYTHEON COMPANY
发明人： KOONTZ, Christopher, R. , CHU, Charles , FLORES, Gilbert, A.
IPC分类号： H01L23/433 , H01L23/473
CPC分类号： H01L23/4332 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20254 , H05K7/20509 , H01L2924/00
摘要： In some embodiments, a semiconductor cooling apparatus includes a heat exchanger configured to thermally couple to a semiconductor element to transfer heat to coolant flowing through the heat exchanger. The apparatus also includes a flexible coolant supply manifold and a flexible coolant return manifold. The flexible coolant supply manifold and flexible coolant return manifold flex to conform to a height of the semiconductor element to apply a force to maintain the thermal coupling between the heat exchanger and the semiconductor element. The apparatus also includes a cold plate located under the semiconductor element, the cold plate configured to couple to the flexible coolant supply manifold via a first riser to provide coolant to the flexible coolant supply manifold and configured to couple to the flexible coolant return manifold via a second riser to exhaust returned coolant to the cold plate.
摘要翻译：在一些实施例中，半导体冷却装置包括被配置为热耦合到半导体元件以将热量传递到流过热交换器的冷却剂的热交换器。该装置还包括柔性冷却剂供应歧管和柔性冷却剂回流歧管。柔性冷却剂供应歧管和柔性冷却剂返回歧管弯曲以符合半导体元件的高度以施加力以保持热交换器和半导体元件之间的热耦合。所述设备还包括位于所述半导体元件下方的冷板，所述冷板经配置以经由第一提升管耦合到所述柔性冷却剂供应歧管，以向所述柔性冷却剂供应歧管提供冷却剂，并经配置以经由第二提升管将返回的冷却剂排放到冷板。

8. 发明申请

WO2012158454A3 HIGH POWERED LIGHT EMITTING DIODE LIGHTING UNIT 审中-公开
公开(公告)号：WO2012158454A3
公开(公告)日：2012-11-22
申请号：PCT/US2012/037286
申请日：2012-05-10
申请人： LUMENPULSE LIGHTING INC. , HAMEL, Yvan , CAMPBELL, Gregory
发明人： HAMEL, Yvan , CAMPBELL, Gregory
IPC分类号： F21V23/00 , F21V29/00
摘要： A light emitting diode (LED) lighting unit including power supply housing accommodating a power supply and an LED array housing defining an internal compartment and a lens sealing the internal compartment. An LED array and an LED control circuit are mounted on a printed circuit board, which is accommodated within the compartment. The rear surface of the LED array housing includes a heat transfer element. At least one of the LED array and power supply housings has a chimney extending therethrough from a front to rear surface. The rear surface of the LED array housing is spaced from the front surface of the power supply housing to define and airflow space therebetween. During operation of the LED lighting unit, air flows into the airflow space and toward a central axis of the LED lighting unit before flowing out through the chimney to facilitate removing heat from the LED lighting unit.

9. 发明申请

WO2011005277A1 METHODS AND APPARATUS FOR PROTECTING PLASMA CHAMBER SURFACES 审中-公开
标题翻译：保护等离子体表面的方法和装置
公开(公告)号：WO2011005277A1
公开(公告)日：2011-01-13
申请号：PCT/US2009/064535
申请日：2009-11-16
申请人： MKS INSTRUMENTS, INC. , TAI, Chiu-Ying , CHEN, Xing , HU, Chaolin , COWE, Andrew , SHAJII, Ali
发明人： TAI, Chiu-Ying , CHEN, Xing , HU, Chaolin , COWE, Andrew , SHAJII, Ali
IPC分类号： C25D11/04 , C25D11/18 , C25D11/30 , H01J37/32
CPC分类号： C25D11/04 , C25D11/026 , C25D11/18 , C25D11/30 , H01J37/32477
摘要： A method for creating a protective layer over a surface of an object comprising aluminum and magnesium for use in a semiconductor processing system, which includes oxidizing the surface of the object using a plasma electrolytic oxidation process. The method also includes generating a halogen-comprising plasma by exciting a gas comprising a halogen. The method also includes exposing the oxidized surface to the halogen-comprising plasma or excited gas.
摘要翻译：一种用于在半导体处理系统中使用的用于在包括铝和镁的物体的表面上形成保护层的方法，其包括使用等离子体电解氧化工艺氧化物体的表面。该方法还包括通过激发包含卤素的气体产生含卤素的等离子体。该方法还包括将氧化的表面暴露于含卤素等离子体或激发气体。

10. 发明申请

WO2009099486A1 RADIO FREQUENCY POWER DELIVERY SYSTEM 审中-公开
标题翻译：无线电频率供电系统
公开(公告)号：WO2009099486A1
公开(公告)日：2009-08-13
申请号：PCT/US2008/087921
申请日：2008-12-22
申请人： MKS INSTRUMENTS, INC. , NAGARKATTI, Siddharth, P. , BARSKIY, Yevgeniy , TIAN, Feng , BYSTRYAK, Ilya
发明人： NAGARKATTI, Siddharth, P. , BARSKIY, Yevgeniy , TIAN, Feng , BYSTRYAK, Ilya
IPC分类号： H03F3/191 , H01J37/32 , H03H7/40
CPC分类号： H03F3/20 , H01J37/32082 , H01J37/32183 , H03F1/565 , H03F3/195 , H03F2200/321 , H03F2200/387 , H03F2200/391 , H03F2200/393 , H03F2200/451 , H03H7/40 , Y10T307/305
摘要： A system and method are provided for delivering power to a dynamic load (260). The system includes a power supply (210) providing DC power having a substantially constant power open loop response, a power amplifier (220) for converting the DC power to RF power, a sensor (240) for measuring voltage, current and phase angle between voltage and current vectors associated with the RF power, an electrically controllable impedance matching system (250) to modify the impedance of the power amplifier (220) to at least a substantially matched impedance of a dynamic load (260), and a controller (252) for controlling the electrically controllable impedance matching system. The system further includes a sensor calibration measuring module for determining power delivered by the power amplifier, an electronic matching system calibration module for determining power delivered to a dynamic load, and a power dissipation module for calculating power dissipated in the electrically controllable impedance matching system.
摘要翻译：提供了一种将功率传递给动态负载（260）的系统和方法。该系统包括提供具有基本上恒定的功率开环响应的DC电力的电源（210），用于将DC功率转换成RF功率的功率放大器（220），用于测量DC功率的电压，电流和相位角的传感器（240）与RF功率相关联的电压和电流矢量，将电力可控阻抗匹配系统（250）修改为功率放大器（220）的阻抗至少为动态负载（260）的基本上匹配的阻抗;以及控制器（252）），用于控制电可控阻抗匹配系统。该系统还包括用于确定由功率放大器输出的功率的传感器校准测量模块，用于确定输送到动态负载的功率的电子匹配系统校准模块，以及用于计算在电气可控阻抗匹配系统中消耗的功率的功率耗散模块。

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