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1. 发明申请

WO2012119900A1 MAGNETIC SENSORS 审中-公开
标题翻译：磁传感器
公开(公告)号：WO2012119900A1
公开(公告)日：2012-09-13
申请号：PCT/EP2012/053419
申请日：2012-02-29
申请人： NXP B.V. , ZIEREN, Victor , VAN VELDHOVEN, Robert , WUNNICKE, Olaf , TUINHOUT, Hans
发明人： ZIEREN, Victor , VAN VELDHOVEN, Robert , WUNNICKE, Olaf , TUINHOUT, Hans
IPC分类号： G01R33/06 , H01L29/82 , G01R33/00
CPC分类号： G01R35/005 , G01R33/0035 , G01R33/06 , G01R33/066 , H01L29/82
摘要： The disclosure relates to the field of magnetic sensors, sensor governing circuits and associated methods. Certain disclosed embodiments relate to semiconductor (e.g. silicon-based) magnetic sensors, including a magnetic sensor assembly comprising a semiconductor layer (17), the semiconductor layer comprising a first collector (113) and a second collector (114), a first emitter (111) and a second emitter (112); and a governing circuit (120) configured to control and measure current flow independently between the first collector and first emitter in a first direction, and between the second collector and second emitter in a second opposing direction.
摘要翻译：本公开涉及磁传感器，传感器控制电路和相关方法领域。某些公开的实施例涉及半导体（例如基于硅的）磁传感器，包括包括半导体层（17）的磁传感器组件，该半导体层包括第一集电极（113）和第二集电极（114），第一发射极 111）和第二发射器（112）; 以及配置成在第一方向上在第一集电器和第一发射极之间以及在第二相对方向上在第二集电极和第二发射极之间独立地控制和测量电流的控制电路（120）。

2. 发明申请

WO2011080536A1 ADJUSTABLE MOS RESISTOR 审中-公开
标题翻译：可调电阻
公开(公告)号：WO2011080536A1
公开(公告)日：2011-07-07
申请号：PCT/IB2009/055956
申请日：2009-12-28
申请人： NXP B.V. , KOHSIEK, Cord-Heinrich
发明人： KOHSIEK, Cord-Heinrich
IPC分类号： H03H11/24
CPC分类号： H03H11/245
摘要： A variety of circuits, methods and devices are implemented for providing an adjustable resistance. According to one such implementation an adjustable resistive device includes a metal-oxide semiconductor (MOS) transistor having a gate, a drain, a source, and a body. First circuitry controls a resistance from drain to source by applying a gate voltage that is a function of a variable control input. Second circuitry adjusts a voltage at the body according to a drain voltage and a source voltage, whereby the resistance from drain to source is substantially linear for a given value of the variable control input and over a voltage range.
摘要翻译：实现了各种电路，方法和装置以提供可调电阻。根据一种这样的实施方案，可调电阻器件包括具有栅极，漏极，源极和主体的金属氧化物半导体（MOS）晶体管。第一电路通过施加作为可变控制输入的函数的栅极电压来控制从漏极到源极的电阻。第二电路根据漏极电压和源极电压来调节电压，由此对于给定的可变控制输入值和电压范围，漏极到源极的电阻基本上是线性的。

3. 发明申请

WO2010038212A2 EMBEDDED VIDEO COMPRESSION FOR HYBRID CONTENTS 审中-公开
标题翻译：嵌入式视频压缩混合内容
公开(公告)号：WO2010038212A2
公开(公告)日：2010-04-08
申请号：PCT/IB2009/054304
申请日：2009-10-01
申请人： NXP B.V. , HE, Haiyan , JANSSEN, Johan Gerard Willem Maria
发明人： HE, Haiyan , JANSSEN, Johan Gerard Willem Maria
IPC分类号： H04N7/26
CPC分类号： H04N19/93 , H04N19/12 , H04N19/126 , H04N19/146 , H04N19/154 , H04N19/176 , H04N19/27
摘要： The present application relates to a method for embedded video compression comprising receiving image data. The method comprises compressing the image data into compressed data blocks with a predefined data rate by using a video compression mode. The method comprises compressing the image data into compressed data blocks with the predefined data rate by using a graphic compression mode, wherein the predefined data rate defines a target code size of a compressed data block. The method comprises detecting whether a code size of the data block does not meet the target code size. The method comprises quantizing at least one input pixel of the image data in case a code size of the data block does not meet the target code size. The present application relates also to a method for embedded video decompression, an apparatus for embedded video compression and an apparatus for embedded video decompression. Furthermore the present application relates to a system comprising said apparatus for embedded video compression and said apparatus for embedded video compression and to a computer readable medium having a computer program stored thereon for performing said method for embedded video compression and said method for embedded video decompression.
摘要翻译：本申请涉及一种用于嵌入式视频压缩的方法，其包括接收图像数据。该方法包括通过使用视频压缩模式以预定数据速率将图像数据压缩成压缩数据块。该方法包括通过使用图形压缩模式以预定数据速率将图像数据压缩成压缩数据块，其中预定义数据速率定义压缩数据块的目标代码大小。该方法包括检测数据块的代码大小是否不符合目标代码大小。该方法包括在数据块的代码大小不符合目标代码大小的情况下量化图像数据的至少一个输入像素。本申请还涉及用于嵌入式视频解压缩的方法，用于嵌入式视频压缩的装置和用于嵌入式视频解压缩的装置。此外，本申请涉及一种包括所述用于嵌入式视频压缩的设备和所述用于嵌入式视频压缩的设备的系统，以及涉及其上存储有用于执行所述用于嵌入式视频压缩的方法和所述用于嵌入式视频解压缩的方法的计算机程序的计算机可读介质。

4. 发明申请

WO2013034517A1 SWITCHED MODE CONVERTER AND METHODS OF CONTROLLING SWITCHED MODE CONVERTERS 审中-公开
标题翻译：开关模式转换器和控制开关模式转换器的方法
公开(公告)号：WO2013034517A1
公开(公告)日：2013-03-14
申请号：PCT/EP2012/067092
申请日：2012-09-03
申请人： NXP.B.V. , SCHMID, Markus , KUEBRICH, Johann , DUERBAUM, Thomas , HALBERSTADT, Hans , HOOGZAAD, Gian , PANSIER, Frans
发明人： SCHMID, Markus , KUEBRICH, Johann , DUERBAUM, Thomas , HALBERSTADT, Hans , HOOGZAAD, Gian , PANSIER, Frans
IPC分类号： H02M3/335
CPC分类号： H02M3/33507 , H02M1/08 , H02M3/33523 , H02M2001/0032 , H02M2001/0035 , H02M2001/0054 , H02M2001/0058 , Y02B70/1491 , Y02B70/16
摘要： A method is disclosed of controlling a switched mode converter comprising a switch and for providing power to device having a load, comprising: in response to the load exceeding a first threshold, operating in a first mode, being a CCM; in response to the load exceeding a second threshold and not exceeding the first threshold, operating in second mode, being a BCM without valley skipping wherein the switching frequency increases with decreasing load; in response to the load exceeding a third threshold and not exceeding the second threshold, operating in a third mode, being a BCM with valley skipping, wherein the switching frequency depends on the load and the number of valleys skipped and is between a fixed upper and a lower switching frequency limit; and in response to the load not exceeding the third threshold, operating in a fourth mode, being a BCM with valley skipping, wherein the switching frequency depends on at least the load, and is between an upper and a lower switching frequency limit wherein the upper switching frequency limit decreases with decreasing load. A switched mode converter controlled by such a method is also disclosed.
摘要翻译：公开了一种控制包括开关并用于向具有负载的装置提供电力的开关模式转换器的方法，包括：响应于所述负载超过第一阈值，以第一模式操作，为CCM; 响应于所述负载超过第二阈值且不超过所述第一阈值，在第二模式下操作，所述BCM不具有谷跳跃，其中所述开关频率随负载减小而增加; 响应于超过第三阈值并且不超过第二阈值的负载，以第三模式操作，作为具有谷跳跃的BCM，其中开关频率取决于跳过的负载和谷数，并且在固定的上限和较低的开关频率限制; 并且响应于不超过第三阈值的负载，以第四模式操作，作为具有谷跳跃的BCM，其中开关频率至少取决于负载，并且处于上和下开关频率极限之间，其中上部开关频率限制随负载减小而减小。还公开了通过这种方法控制的开关模式转换器。

5. 发明申请

WO2011080672A2 FAN-OUT CHIP SCALE PACKAGE 审中-公开
标题翻译： FAN-OUT芯片尺寸包装
公开(公告)号：WO2011080672A2
公开(公告)日：2011-07-07
申请号：PCT/IB2010/056012
申请日：2010-12-22
申请人： NXP B.V. , HOCHSTENBACH, Hendrik Pieter , VON GEMERT, Leonardus Antonius Elisabeth
发明人： HOCHSTENBACH, Hendrik Pieter , VON GEMERT, Leonardus Antonius Elisabeth
IPC分类号： H01L21/683
CPC分类号： H01L24/11 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L24/19 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.
摘要翻译：芯片级封装具有半导体管芯，其具有以每单位面积的焊盘密度排列的管芯接合焊盘的阵列，嵌入在具有支撑导电触头阵列的表面的模制模具支撑体中，每个触点通过电连接导致相应的一个管芯接合焊盘。

6. 发明申请

WO2011077181A1 SEMICONDUCTOR DEVICE WITH MULTILAYER CONTACT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有多层接触的半导体器件及其制造方法
公开(公告)号：WO2011077181A1
公开(公告)日：2011-06-30
申请号：PCT/IB2009/055864
申请日：2009-12-21
申请人： NXP B.V. , HABENICHT, Sönke , OELGESCHLAEGER, Detlef , SCHUMACHER, Olrik , BERGLUND, Stefan Bengt
发明人： HABENICHT, Sönke , OELGESCHLAEGER, Detlef , SCHUMACHER, Olrik , BERGLUND, Stefan Bengt
IPC分类号： H01L21/331 , H01L29/06 , H01L29/417 , H01L29/732
CPC分类号： H01L29/66303 , H01L29/0692 , H01L29/0813 , H01L29/1004 , H01L29/41708 , H01L29/66295 , H01L29/732
摘要： The present invention provides a semiconductor with a multilayered contact structure. The multilayered structure includes a metal contact placed on an active region of a semiconductor and a metal contact extension placed on the metal contact.
摘要翻译：本发明提供具有多层接触结构的半导体。多层结构包括设置在半导体的有源区域上的金属接触件和放置在金属接触件上的金属接触延伸部分。

7. 发明申请

WO2011083368A1 DELAMINATION RESISTANT SEMICONDUCTOR DEVICES 审中-公开
标题翻译：耐分解半导体器件
公开(公告)号：WO2011083368A1
公开(公告)日：2011-07-14
申请号：PCT/IB2010/050021
申请日：2010-01-05
申请人： NXP B.V. , OFFERMANN, Bernd
发明人： OFFERMANN, Bernd
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/05639 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/8538 , H01L2224/85439 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A leadframe of a metal foil has a die paddle for supporting a semiconductor die, an outer frame connected to the die paddle by a die paddle support, and a conductor lead connected to the outer frame, extending toward the die paddle and terminating at a distal end proximal to the die paddle. The conductor lead has a wedgepad formed at its distal end, and the wedgepad has a thickness substantially less than the thickness of the remaining portions of the conductor lead. A semiconductor die may be supported on the die paddle and a wire may connect to the wedgepad to a bond pad on the semiconductor die. An encapsulating material may encapsulate a portion of the leadframe, the wedgepad, the semiconductor die and the wire.
摘要翻译：金属箔的引线框架具有用于支撑半导体管芯的管芯焊盘，通过管芯焊盘支撑件连接到管芯焊盘的外部框架，以及连接到外部框架的导体引线，朝向管芯焊盘延伸并终止于远端靠近模板的端部。导体引线具有在其远端形成的楔形物，并且楔形物的厚度显着小于导体引线的其余部分的厚度。半导体管芯可以被支撑在管芯焊盘上，并且导线可以连接到楔形垫片到半导体管芯上的接合焊盘。封装材料可以封装引线框架，楔形垫片，半导体管芯和导线的一部分。

8. 发明申请

WO2012175226A1 A NOISE SENSOR 审中-公开
标题翻译：噪音传感器
公开(公告)号：WO2012175226A1
公开(公告)日：2012-12-27
申请号：PCT/EP2012/051514
申请日：2012-01-31
申请人： NXP B.V. , STAHL, Juergen , PAWELLEK, Alexander , SCHMID, Markus , DUERBAUM, Thomas , KUEBRICH, Johann , HALBERSTADT, Hans , PANSIER, Frans , GOETTLE, Jens , BLOM, Anton
发明人： STAHL, Juergen , PAWELLEK, Alexander , SCHMID, Markus , DUERBAUM, Thomas , KUEBRICH, Johann , HALBERSTADT, Hans , PANSIER, Frans , GOETTLE, Jens , BLOM, Anton
IPC分类号： G01R31/00
CPC分类号： G01R29/26 , G01R31/001 , G01R31/40
摘要： The present invention relates to a noise sensor for an alternating or direct current power supply. The sensor comprises a noise sensing unit and a noise separator. The noise separator is configured to receive first, second and third input signals and provide a first output signal representative of the common mode noise and a second output signal representative of the differential mode noise. The noise sensing unit comprises a first capacitive element, a second capacitive element, a first resistive element and a second resistive element.
摘要翻译：本发明涉及用于交流或直流电源的噪声传感器。传感器包括噪声感测单元和噪声分离器。噪声分离器被配置为接收第一，第二和第三输入信号并且提供表示共模噪声的第一输出信号和表示差模噪声的第二输出信号。噪声感测单元包括第一电容元件，第二电容元件，第一电阻元件和第二电阻元件。

9. 发明申请

WO2012139665A1 VARIABLE GAIN AMPLIFIER 审中-公开
标题翻译：可变增益放大器
公开(公告)号：WO2012139665A1
公开(公告)日：2012-10-18
申请号：PCT/EP2011/071745
申请日：2011-12-05
申请人： NXP B.V. , NOZAHIC, Franck , LOCOCO, Luca , JAUDARD, Walter
发明人： NOZAHIC, Franck , LOCOCO, Luca , JAUDARD, Walter
IPC分类号： H03G1/00
CPC分类号： H03G1/0088
摘要： A variable gain amplifier such as those used in RF circuits is operable to have a stepped gain change,which gives better signal to noise performance than a continuous gain change. However, changing between gain steps can result in disturbance to the circuitry in the signal path after the variable gain amplifier. Conventional solutions are to fix the gain after an initialization period or to implement a step-killer circuit. A variable gain amplifier (100) is described having a controller (24) which applies a ramp to the field effect transistors (20) in the gain control circuit. This results in a smoother transition between gain steps.
摘要翻译：诸如在RF电路中使用的可变增益放大器可操作以具有阶梯式增益变化，其提供比连续增益变化更好的信噪比性能。然而，在可变增益放大器之后，增益步长之间的变化可能导致信号路径中的电路的干扰。传统的解决方案是在初始化期之后固定增益或者实现一个止步器电路。描述了一种可变增益放大器（100），其具有向增益控制电路中的场效应晶体管（20）施加斜坡的控制器（24）。这导致增益步长之间的平滑过渡。

10. 发明申请

WO2010113090A1 SENSOR DEVICE AND A METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：传感器装置及其制造方法
公开(公告)号：WO2010113090A1
公开(公告)日：2010-10-07
申请号：PCT/IB2010/051317
申请日：2010-03-25
申请人： NXP B.V. , GRIDELET, Evelyne , TELLO, Pablo , VAN DUUREN, Michiel, Jos , AKIL, Nader
发明人： GRIDELET, Evelyne , TELLO, Pablo , VAN DUUREN, Michiel, Jos , AKIL, Nader
IPC分类号： G01N27/26 , G01N33/543
CPC分类号： G01N33/5438 , B81C1/00087 , G01N33/48721
摘要： A sensor device for analyzing fluidic samples is provided, wherein the sensor device comprises a stacked sensing arrangement comprising at least three sensing layers and a multilayer structure, wherein the multilayer structure has a hole formed therein which is adapted to let pass the fluidic sample and wherein the stacked sensing arrangement is formed in the multilayer structure in such a way that the fluidic sample passes the stacked sensing arrangement when the fluidic sample passes the hole.
摘要翻译：提供了一种用于分析流体样品的传感器装置，其中所述传感器装置包括包括至少三个感测层和多层结构的堆叠感测装置，其中所述多层结构具有形成在其中的孔，其适于使所述流体样品通过，并且其中层叠的感测装置形成在多层结构中，使得当流体样品通过孔时，流体样品通过堆叠的感测装置。

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