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    • 5. 发明申请
    • BATTERY MODULE AND METHOD FOR MANUFACTURING THE SAME
    • 电池模块及其制造方法
    • WO2015145517A1
    • 2015-10-01
    • PCT/JP2014/006489
    • 2014-12-26
    • TOYODA GOSEI CO., LTD.
    • TATSUMI, YoshiakiKUSABA, Kosuke
    • H01M2/10
    • H01M2/024H01M2/08H01M2/1077H01M2/206H01M2220/20
    • A technique for sufficiently filling an adhesive between a battery retaining section of a holder and a battery cell in a battery module configured by the battery cell being inserted and adhered in the aperture-shaped battery retaining section provided in the holder is provided. An adhesive layer that adheres a holder 5 and a battery cells 1 in a battery module is formed in a two-layer structure of a holder-side adhesive layer 45 making contact with an inner circumferential surfaces 51 of a battery retaining sections 50 and a cell-side adhesive layer 41 making contact with an outer circumferential surfaces 11 of the battery cells 1, and different types of adhesives are used for an adhesive configuring the holder-side adhesive layer 45 and an adhesive configuring the cell-side adhesive layer 41.
    • 提供了一种用于充分填充由电池单元构成的电池模块中的保持器的电池保持部和电池单元之间的粘合剂的技术,该电池模块被插入并粘附在设置在保持器中的开口状电池保持部中。 将保持器5和电池单元1粘附在电池模块中的粘合剂层形成为与电池保持部50的内周面51和电池单元接触的保持器侧粘合层45的两层结构 与电池单元1的外周面11接触的侧面粘合剂层41,以及构成保持体侧粘合剂层45的粘合剂和构成电池侧粘合剂层41的粘合剂使用不同类型的粘合剂。
    • 10. 发明申请
    • GROUP III-NITRIDE-BASED COMPOUND SEMICONDUCTOR DEVICE
    • 基于III-NITRIDE的化合物半导体器件
    • WO2005029595A1
    • 2005-03-31
    • PCT/JP2004/013082
    • 2004-09-01
    • TOYODA GOSEI CO., LTD.TAKI, Tetsuya
    • TAKI, Tetsuya
    • H01L33/00
    • H01L33/32H01L33/02H01L33/14
    • In a group III-nitride-based compound semiconductor device 100, an intermediate layer 108 is 5 provided between a p-AlGaN layer 107 and a p-GaN layer 109, to each of which an acceptor impurity is added. On this occasion, the intermediate layer 108 is doped with a donor impurity in a concentration, by which holes generated by an acceptor impurity introduced into the intermediate layer 108 during the formation of the p-AlGaN layer 107 are substantially compensated. As a result, the conductivity of the intermediate layer 108 becomes extremely low, and therefore the electrostatic withstand voltage of the group III-nitride-based compound semiconductor device 100 improves significantly.
    • 在III族氮化物类化合物半导体器件100中,在p-AlGaN层107和p-GaN层109之间设置中间层108,其中添加受主杂质。 在这种情况下,中间层108被掺杂有施主杂质,其浓度通过在形成p-AlGaN层107期间由引入到中间层108中的受主杂质产生的空穴被基本上补偿。 结果,中间层108的导电性变得非常低,因此III族氮化物系化合物半导体器件100的静电耐受电压显着提高。