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2. 发明专利

TW200806131A 電子零件對電路基板之安裝構造及安裝方法失效
简体标题：电子零件对电路基板之安装构造及安装方法
公开(公告)号：TW200806131A
公开(公告)日：2008-01-16
申请号：TW095148361
申请日：2006-12-22
申请人：帝國通信工業股份有限公司 TEIKOKU TSUSHIN KOGYO CO., LTD.
发明人：高橋重正 SHIGEMASA TAKAHASHI , 山田高志 TAKASHI YAMADA , 水野伸二 SHINJI MIZUNO , 北原將弘 MASAHIRO KITAHARA , 牧野大介 DAISUKE MAKINO
IPC分类号： H05K
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要：本發明之課題是提供可以將電子零件容易而且確實地有效率安裝在電路基板上之電子零件對電路基板之安裝構造及安裝方法。本發明之解決手段是具備形成有端子連接圖案11、13之軟性電路基板10與設有電極51、53之發光零件50。在軟性電路基板10上裝載發光零件50,同時安裝覆蓋在發光零件50和裝載有該發光零件50之軟性電路基板10之周圍部份並以射出成形構成的合成樹脂製之殼體80,藉此使發光零件50之電極51、53與軟性電路基板10之端子連接圖案11、13接觸而連接。
简体摘要：本发明之课题是提供可以将电子零件容易而且确实地有效率安装在电路基板上之电子零件对电路基板之安装构造及安装方法。本发明之解决手段是具备形成有端子连接图案11、13之软性电路基板10与设有电极51、53之发光零件50。在软性电路基板10上装载发光零件50,同时安装覆盖在发光零件50和装载有该发光零件50之软性电路基板10之周围部份并以射出成形构成的合成树脂制之壳体80,借此使发光零件50之电极51、53与软性电路基板10之端子连接图案11、13接触而连接。

3. 发明专利

TWI252495B 電子零件用基板及其製造方法 SUBSTRATE FOR ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME 失效
简体标题：电子零件用基板及其制造方法 SUBSTRATE FOR ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME
公开(公告)号：TWI252495B
公开(公告)日：2006-04-01
申请号：TW093103295
申请日：2004-02-12
申请人：帝國通信工業股份有限公司 TEIKOKU TSUSHIN KOGYO CO., LTD.
发明人：水野伸二 SHINJI MIZUNO , 三井浩二 KOJI MITSUI , 矢下勝利 KATSUTOSHI YANOSHITA , 鈴木伸一 SHINICHI SUZUKI , 篠木高司 TAKASHI SHINOKI , 中和隆 KAZUTAKA NAKAGOME , 福田直紀 NAOKI FUKUDA , 森田幸三 KOZO MORITA , 牧野大介 DAISUKE MAKINO
IPC分类号： H01C
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要：本發明之電子零件用基板1-1，具備絕緣基台10；及在安裝於上述絕緣基台10上的合成樹脂薄片上設有端子圖案29、29與在其表面滑接有滑動件的導體圖案25而形成的可撓性電路基板20。絕緣基台10係合成樹脂成形品。可撓性電路基板20係嵌入成形於該絕緣基台10。電子零件用基板1-1之製造，係準備可撓性電路基板20及具有形成為電子零件用基板1-1的外形形狀的模穴C1的第1、第2模具41、45在第1、第2模具41、45的模穴C1內收納可撓性電路基板20，在模穴C1內充填融化的成形樹脂，在已充填的成形樹脂固化後取下第1、第2模具41、45。
简体摘要：本发明之电子零件用基板1-1，具备绝缘基台10；及在安装于上述绝缘基台10上的合成树脂薄片上设有端子图案29、29与在其表面滑接有滑动件的导体图案25而形成的可挠性电路基板20。绝缘基台10系合成树脂成形品。可挠性电路基板20系嵌入成形于该绝缘基台10。电子零件用基板1-1之制造，系准备可挠性电路基板20及具有形成为电子零件用基板1-1的外形形状的模穴C1的第1、第2模具41、45在第1、第2模具41、45的模穴C1内收纳可挠性电路基板20，在模穴C1内充填融化的成形树脂，在已充填的成形树脂固化后取下第1、第2模具41、45。

4. 发明专利

TW200419595A 電子零件用基板及其製造方法 SUBSTRATE FOR ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME 失效
简体标题：电子零件用基板及其制造方法 SUBSTRATE FOR ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME
公开(公告)号：TW200419595A
公开(公告)日：2004-10-01
申请号：TW093103295
申请日：2004-02-12
申请人：帝國通信工業股份有限公司 TEIKOKU TSUSHIN KOGYO CO., LTD.
发明人：水野伸二 SHINJI MIZUNO , 三井浩二 KOJI MITSUI , 矢下勝利 KATSUTOSHI YANOSHITA , 鈴木伸一 SHINICHI SUZUKI , 篠木高司 TAKASHI SHINOKI , 中和隆 KAZUTAKA NAKAGOME , 福田直紀 NAOKI FUKUDA , 森田幸三 KOZO MORITA , 牧野大介 DAISUKE MAKINO
IPC分类号： H01C
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要：本發明之電子零件用基板1–1，具備絕緣基台10；及在安裝於上述絕緣基台10上的合成樹脂薄片上設有端子圖案29、29與在其表面滑接有滑動件的導體圖案25而形成的可撓性電路基板20。絕緣基台10係合成樹脂成形品。可撓性電路基板20係嵌入成形於該絕緣基台10。電子零件用基板1–1之製造，係準備可撓性電路基板20及具有形成為電子零件用基板1–1的外形形狀的模穴C1的第1、第2模具41、45，在第1、第2模具41、45的模穴C1內收納可撓性電路基板20，在模穴C1內充填融化的成形樹脂，在已充填的成形樹脂固化後取下第1、第2模具41、45。
简体摘要：本发明之电子零件用基板1–1，具备绝缘基台10；及在安装于上述绝缘基台10上的合成树脂薄片上设有端子图案29、29与在其表面滑接有滑动件的导体图案25而形成的可挠性电路基板20。绝缘基台10系合成树脂成形品。可挠性电路基板20系嵌入成形于该绝缘基台10。电子零件用基板1–1之制造，系准备可挠性电路基板20及具有形成为电子零件用基板1–1的外形形状的模穴C1的第1、第2模具41、45，在第1、第2模具41、45的模穴C1内收纳可挠性电路基板20，在模穴C1内充填融化的成形树脂，在已充填的成形树脂固化后取下第1、第2模具41、45。

5. 发明授权

US08053684B2 Mounting structure and method for mounting electronic component onto circuit board 失效
标题翻译：将电子元件安装到电路板上的安装结构和方法
公开(公告)号：US08053684B2
公开(公告)日：2011-11-08
申请号：US12158904
申请日：2006-12-19
申请人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
发明人： Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
IPC分类号： H01L23/28
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
摘要翻译：电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此，柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。

6. 发明授权

US06958183B2 Key top plate and a method for manufacturing the same 失效
标题翻译：关键顶板及其制造方法
公开(公告)号：US06958183B2
公开(公告)日：2005-10-25
申请号：US10073283
申请日：2002-02-13
申请人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
发明人： Tatsuya Okamura , Kimitane Kimura , Yasuo Kojima , Atsushi Hari , Shinji Mizuno
IPC分类号： H01H13/70 , B32B27/08 , H01H13/14 , B32B27/14 , H01H1/00
CPC分类号： B32B27/08 , B32B27/36 , B32B27/365 , B32B37/15 , B32B2307/412 , B32B2307/414 , H01H13/14 , H01H2219/028 , H01H2219/032 , H01H2229/047 , Y10T428/23 , Y10T428/233 , Y10T428/239 , Y10T428/24339 , Y10T428/24562 , Y10T428/24661 , Y10T428/24802
摘要： A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.
摘要翻译：分别由模具树脂制成的键顶30的上表面和底面分别安装由柔性树脂膜制成的第一薄膜板20和第二薄膜板40，以覆盖键顶30 。第一胶片板20被向上按压以形成凹部23，键顶30被模制在该凹部23内。第二膜片40配置在键顶30的底面上。所有第一薄膜板20，键顶30和第二薄膜40都是透明的。装饰层21和41分别形成在第一膜板20和第二膜板40上。

7. 发明授权

US6023033A Keytop plate and method for producing the same 失效
标题翻译：键盘及其制造方法
公开(公告)号：US6023033A
公开(公告)日：2000-02-08
申请号：US980816
申请日：1997-12-01
申请人： Nobuyuki Yagi , Jiro Inagaki , Tatsuya Okamura
发明人： Nobuyuki Yagi , Jiro Inagaki , Tatsuya Okamura
IPC分类号： B29C45/14 , B29L31/34 , H01H11/00 , H01H13/06 , H01H13/14 , H01H13/702 , H01H13/705 , H01H13/70 , H01H3/12
CPC分类号： H01H13/705 , H01H2219/028 , H01H2219/03 , H01H2219/036 , H01H2221/002 , H01H2221/05 , H01H2223/002 , H01H2229/02 , H01H2229/046 , H01H2229/047 , Y10T29/49105
摘要： A keytop plate comprises keytops (21) formed by integrally molding a molding resin part (25) with a synthetic resin film (23), and a molded elastomer sheet (molded elastomer member) (11) attached to the keytops (21). The molded elastomer sheet (11), other than in the areas to which the keytops (21) are attached, has no through-holes, whereby a water-proof property is provided. The keytops (21) are easily depressed even when the molded elastomer sheet (11) is securely held at its peripheral portion. A hard tactile feeling may be obtained when the keytops (21) are depressed, since the keytops (21) are formed from the synthetic resin film (23) and the molding resin part (25).
摘要翻译：键顶板包括通过将模塑树脂部件（25）与合成树脂薄膜（23）整体模制而形成的键顶（21）和附接到键顶（21）的模制弹性体片（模制弹性体构件）（11）。成型弹性体片（11）除了安装有键顶（21）的区域之外，没有通孔，由此提供防水性。即使当模制的弹性体片（11）被牢固地保持在其周边部分时，键顶（21）也容易被压下。由于键合体（21）由合成树脂薄膜（23）和模塑树脂部件（25）形成，所以当键顶（21）被压下时，可以获得坚硬的触感。

8. 发明授权

US5794766A Rotary switch 失效
标题翻译：旋转开关
公开(公告)号：US5794766A
公开(公告)日：1998-08-18
申请号：US694325
申请日：1996-08-08
申请人： Kozo Morita , Shigeaki Kinoshita , Katsuyuki Tame , Osamu Nomura
发明人： Kozo Morita , Shigeaki Kinoshita , Katsuyuki Tame , Osamu Nomura
IPC分类号： H01H19/00 , H01H19/63 , H01H19/20
CPC分类号： H01H19/63 , H01H19/005 , H01H2019/006
摘要： A rotary switch includes a contact forming member including a switch contact and a land contact and an elastic plate including a base portion mounted on the land contact and an abutment portion disposed above the switch contact. A rotor is disposed above the elastic plate for pivotal movement and includes depresser portions provided in the lower surface of the rotor for depressing the elastic plate. When the rotor is rotated, the depresser portions of the rotor cause the elastic plate to be depressed, so that the abutment portion is engaged with the switch contact. The contact forming member may be constructed by forming the switch contact and the land contact on a circuit substrate. The contact forming member may be constructed by a metal plate on which the switch contact is formed, a metal plate on which the land contact is formed, and a stationary member on which the metal plates are secured.
摘要翻译：旋转开关包括：接触形成构件，其包括开关触点和平台接触;以及弹性板，包括安装在平台触点上的基部和设置在开关触点上方的抵接部。转子设置在弹性板上方用于枢转运动，并且包括设置在转子的下表面中的按压部，用于按压弹性板。当转子旋转时，转子的按压部分使得弹性板被压下，使得抵接部与开关接触接合。触点形成构件可以通过在电路基板上形成开关触点和平台接触而构成。接触形成部件可以由其上形成有开关触点的金属板，形成有焊盘触点的金属板以及金属板固定在其上的固定部件构成。

9. 发明授权

US5280146A Push-button switch, keytop, and method of manufacturing the keytop 失效
公开(公告)号：US5280146A
公开(公告)日：1994-01-18
申请号：US784000
申请日：1991-10-29
申请人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
发明人： Jiroh Inagaki , Atsushi Hari , Nobuyuki Yagi , Yasutoshi Kaku , Takashi Shinoki
IPC分类号： B29C45/14 , H01H11/00 , H01H13/705 , H01H3/12
CPC分类号： H01H13/705 , B29C45/1418 , H01H11/00 , B29L2031/466 , H01H2217/028 , H01H2219/05 , H01H2223/002 , H01H2229/047 , H01H2229/048 , H01H2233/004
摘要： The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.

10. 发明授权

US4935718A Molded resin casing of electronic part incorporating flexible board 失效
标题翻译：带柔性板的电子部件的模制树脂外壳
公开(公告)号：US4935718A
公开(公告)日：1990-06-19
申请号：US234952
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

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