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81. 发明授权

US07492975B2 Optical switch, optical modulator and wavelength variable filter 有权
标题翻译：光开关，光调制器和波长可变滤波器
公开(公告)号：US07492975B2
公开(公告)日：2009-02-17
申请号：US10547493
申请日：2004-03-18
申请人： Seiji Toyoda , Kazuo Fujiura , Masahiro Sasaura , Koji Enbutsu , Makoto Shimokozono , Tadayuki Imai , Akiyuki Tate , Touru Matsuura , Takashi Kurihara , Hiroshi Fushimi
发明人： Seiji Toyoda , Kazuo Fujiura , Masahiro Sasaura , Koji Enbutsu , Makoto Shimokozono , Tadayuki Imai , Akiyuki Tate , Touru Matsuura , Takashi Kurihara , Hiroshi Fushimi
IPC分类号： G02F1/035
CPC分类号： G02F1/3551 , G02B6/12011 , G02B6/12023 , G02B2006/12142 , G02B2006/12145 , G02F1/225 , G02F1/3136 , G02F1/3137 , G02F1/365 , G02F2001/212 , G02F2201/124 , G02F2203/50
摘要： The present invention provides an optical switch, an optical modulator, and a wavelength variable filter each of which has a simple configuration, which requires only a low driving voltage, which is independent of polarization, and which can operate at high speed. An optical switch according to the present invention includes a 3-dB coupler (16) placed on an input, a 3-dB coupler (17) placed on an output, and two optical waveguides connecting the input-side 3-dB coupler and the output-side 3-dB coupler together. The optical switch also includes a phase modulating section (18) that applies electric fields to one or both of the two optical waveguides. At least two optical waveguides are a crystal material including KTaxNb1-xO3 (0
摘要翻译：本发明提供了一种光开关，光调制器和波长可变滤波器，每个滤波器具有简单的结构，其仅需要与极化无关的低驱动电压，并且可以高速运行。根据本发明的光开关包括放置在输入端的3-dB耦合器（16），放置在输出端的3-dB耦合器（17）和连接输入侧3-dB耦合器和输出端3 dB耦合器。光开关还包括对两个光波导中的一个或两个施加电场的相位调制部分（18）。至少两个光波导是包括KTaxNb1-xO3（0

82. 发明申请

US20070290306A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS 有权
标题翻译：配线基板及其制造方法及半导体装置
公开(公告)号：US20070290306A1
公开(公告)日：2007-12-20
申请号：US11763053
申请日：2007-06-14
申请人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
发明人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H05K1/111 , H05K3/108 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , Y02P70/611
摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
摘要翻译：在半导体装置中，将半导体元件安装在布线基板上。布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。其上形成有布线图案的基板的表面被绝缘层覆盖。形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置的绝缘层。连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

83. 发明授权

US06974721B2 Method for manufacturing thin semiconductor chip 失效
标题翻译：薄半导体芯片制造方法
公开(公告)号：US06974721B2
公开(公告)日：2005-12-13
申请号：US10496690
申请日：2003-08-28
申请人： Naoyuki Koizumi , Kei Murayama , Shigeru Mizuno , Takashi Kurihara
发明人： Naoyuki Koizumi , Kei Murayama , Shigeru Mizuno , Takashi Kurihara
IPC分类号： H01L21/301 , H01L21/00 , H01L21/02 , H01L21/68 , H01L21/78 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2224/274 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/12042 , H01L2924/3512 , H01L2924/00
摘要： In manufacturing a thin semiconductor chip, a wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer having a surface thereon is to be processed, a rigid support body is adhered to the other surface of the thin wafer and a ring-shaped frame, encircling an outer periphery of the thin wafer, is adhered to the rigid support body.
摘要翻译：在制造薄的半导体芯片时，晶片在加工过程中被稳定地保持以保持稳定的形状并且避免在晶片上产生裂纹。当要处理其上具有表面的薄晶片时，刚性支撑体粘附到薄晶片的另一个表面，并且围绕薄晶片的外周的环形框架被粘附到刚性支撑体。

84. 发明申请

US20050176169A1 Thin semiconductor chip manufacturing method 失效
标题翻译：薄半导体芯片制造方法
公开(公告)号：US20050176169A1
公开(公告)日：2005-08-11
申请号：US10496690
申请日：2003-08-28
申请人： Naoyuki Koizumi , Kei Murayama , Shigeru Mizuno , Takashi Kurihara
发明人： Naoyuki Koizumi , Kei Murayama , Shigeru Mizuno , Takashi Kurihara
IPC分类号： H01L21/301 , H01L21/00 , H01L21/02 , H01L21/68 , H01L21/78 , H01L21/44
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2224/274 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/12042 , H01L2924/3512 , H01L2924/00
摘要： To provide a method, for manufacturing a thin semiconductor chip, in which the wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer (1) having a surface (1a) thereon is to be processed, the method comprising the steps of: adhering a rigid support body (2) to the other surface (1b) of the thin wafer (1); and adhering a ring-shaped frame (3) encircling an outer periphery of the thin wafer to the rigid support body (2).
摘要翻译：为了提供一种用于制造薄半导体芯片的方法，其中在处理期间晶片被稳定地保持以保持稳定的形状并且避免在晶片上产生裂纹。当要处理其上具有表面（1a）的薄晶片（1）时，该方法包括以下步骤：将刚性支撑体（2）粘附到薄晶片（1）的另一表面（1b） ; 并且将围绕所述薄晶片的外周的环状框架（3）粘附到所述刚性支撑体（2）。

85. 发明申请

US20050117108A1 Lquid crystal display device and fabrication method therefor 失效
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US20050117108A1
公开(公告)日：2005-06-02
申请号：US10980867
申请日：2004-11-04
申请人： Yasuhiro Kume , Noriaki Onishi , Kazuhiko Tamai , Nobukazu Nagae , Hiroaki Kojima , Takashi Kurihara , Nobuaki Yamada
发明人： Yasuhiro Kume , Noriaki Onishi , Kazuhiko Tamai , Nobukazu Nagae , Hiroaki Kojima , Takashi Kurihara , Nobuaki Yamada
IPC分类号： G02F1/1337 , G02B5/30 , G02F1/1333 , G02F1/1335 , G02F1/13363 , G02F1/1339
CPC分类号： G02F1/133707 , G02F1/133371 , G02F1/133377 , G02F1/133555 , G02F2001/133742 , G02F2001/133776
摘要： A liquid crystal display device including a first substrate 110a, a second substrate 110b placed to face the first substrate, a liquid crystal layer 120 interposed between the first and second substrates, a first electrode 111 formed on the first substrate, a second electrode 131 formed on the second substrate, an interlayer insulating film 115a placed between the first electrode and the first substrate, and a wall structure 115b formed integrally with the interlayer insulating film. The liquid crystal display device has a plurality of pixels each including the first electrode, the second electrode and the liquid crystal layer interposed between the first and second electrodes. A shading region surrounds each of the plurality of pixels, and the wall structure is placed regularly in the shading region. A groove structure 415a may be formed in place of the wall structure.
摘要翻译：一种液晶显示装置，包括第一基板110a，与第一基板相对配置的第二基板110b，插入在第一和第二基板之间的液晶层120，形成在第一基板上的第一电极111，第二电极131 形成在第二基板上，设置在第一电极和第一基板之间的层间绝缘膜115a以及与层间绝缘膜一体形成的壁结构115b。液晶显示装置具有多个像素，每个像素包括插在第一和第二电极之间的第一电极，第二电极和液晶层。阴影区域围绕多个像素中的每一个，并且壁结构被规则地放置在阴影区域中。可以形成槽结构415a来代替壁结构。

86. 发明授权

US06795232B2 Wavelength converter 失效
标题翻译：波长转换器
公开(公告)号：US06795232B2
公开(公告)日：2004-09-21
申请号：US10108996
申请日：2002-03-29
申请人： Kazuo Fujiura , Shogo Yagi , Tadayuki Imai , Koji Enbutsu , Masahiro Sasaura , Takashi Kurihara , Makoto Abe , Seiji Toyoda , Eishi Kubota
发明人： Kazuo Fujiura , Shogo Yagi , Tadayuki Imai , Koji Enbutsu , Masahiro Sasaura , Takashi Kurihara , Makoto Abe , Seiji Toyoda , Eishi Kubota
IPC分类号： G02F135
CPC分类号： G02F1/3534 , G02F1/3551 , G02F2001/3548
摘要： A wavelength converter implements high speed, high efficiency, low noise wavelength conversion without performing high voltage poling of a crystal, and enables switching and modulation of converted light in response to an electric field. A KLTN crystal, includes a deposited-gold electrode within its incidence plane, and is connected to a DC power supply via a copper wire. The crystal material is composed of KTa1-xNbxO3 and/or K1-yLiyTa1-xNbxO3. A polarizer controls the polarization of the fundamental wave in the direction parallel to the electric field, and launches it into the electrode of the KLTN crystal. The KLTN crystal, rotating on an axis in the direction of the electric field, launches only part of the generated SHG light with the same polarization direction as that of the incident light into a photo multiplier tube through a polarizer.
摘要翻译：波长转换器实现高速，高效率，低噪声波长转换，而不执行晶体的高电压极化，并且能够响应于电场而转换和调制转换的光。 KLTN晶体在其入射平面内包括沉积金电极，并通过铜线连接到直流电源。晶体材料由KTa1-xNbxO3和/或K1-yLiyTa1-xNbxO3组成。偏振器在平行于电场的方向上控制基波的偏振，并将其发射到KLTN晶体的电极中。沿电场方向在轴上旋转的KLTN晶体仅通过偏振器将仅一部分产生的SHG光与入射光的偏振方向相同地发射到光电倍增管中。

87. 发明授权

US06774467B2 Semiconductor device and process of production of same 有权
标题翻译：半导体器件及其生产工艺相同
公开(公告)号：US06774467B2
公开(公告)日：2004-08-10
申请号：US09812276
申请日：2001-03-20
申请人： Michio Horiuchi , Takashi Kurihara , Tomio Nagaoka , Masao Aoki , Shigeru Mizuno
发明人： Michio Horiuchi , Takashi Kurihara , Tomio Nagaoka , Masao Aoki , Shigeru Mizuno
IPC分类号： H01L23495
CPC分类号： H01L24/81 , H01L21/561 , H01L21/563 , H01L23/24 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/4985 , H01L24/29 , H01L24/97 , H01L25/105 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13339 , H01L2224/13347 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2929 , H01L2224/73203 , H01L2224/81801 , H01L2224/83192 , H01L2224/83856 , H01L2224/97 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15747 , H01L2924/1579 , H01L2924/18161 , H01L2924/19041 , H01L2924/3511 , H01L2224/81 , H01L2924/01083 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
摘要： Thin semiconductor device, especially a thin package, which reduces and achieves uniform mounting height, not requiring mounting of individual chips, improves manufacturing yield, without being affected by variation in chip thickness, enables testing alltogether, and process for producing same, the semiconductor mounted with back surface exposed upward, on top of an insulating substrate having throughholes in thickness direction, the area around semiconductor side surfaces being sealed by a resin layer, metal interconnections on the bottom surface of the substrate define bottom portions of throughholes of the substrate, a solder resist layer having throughholes in the thickness direction covers the bottom surface of metal interconnections and substrate, terminals extending downward from the active surface of the semiconductor are inserted into throughholes of the substrate, conductive filler fills gaps between the terminals and the throughholes of the substrate, and connection terminal and interconnections are electrically connected.
摘要翻译：薄型半导体器件，特别是薄封装，其减少并实现均匀的安装高度，而不需要安装单个芯片，提高了制造成品率，而不受芯片厚度变化的影响，能够进行全面测试，以及制造工艺，半导体安装背面向上露出，在厚度方向上具有通孔的绝缘基板的顶部，半导体侧面的周围的区域被树脂层密封，在基板的底面上的金属互连限定了基板的通孔的底部，在厚度方向上具有通孔的阻焊层覆盖金属互连和基板的底面，从半导体的有源表面向下延伸的端子插入到基板的通孔中，导电填料填充端子之间的间隙和基板的通孔，连接终端并且互连电连接。

88. 发明授权

US06469260B2 Wiring boards, semiconductor devices and their production processes 有权
标题翻译：接线板，半导体器件及其生产工艺
公开(公告)号：US06469260B2
公开(公告)日：2002-10-22
申请号：US09792991
申请日：2001-02-24
申请人： Michio Horiuchi , Takashi Kurihara
发明人： Michio Horiuchi , Takashi Kurihara
IPC分类号： H01R909
CPC分类号： H01L21/568 , H01L21/4832 , H01L21/4885 , H01L21/6835 , H01L23/13 , H01L23/4952 , H01L23/49541 , H01L23/49816 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/13111 , H01L2224/16225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45565 , H01L2224/45572 , H01L2224/45599 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/49 , H01L2224/81801 , H01L2224/85444 , H01L2224/8592 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/3011 , H01L2924/30111 , H05K3/20 , H05K2201/10287 , H05K2201/10977 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring board comprising a substrate having applied on the same side surface thereof one or more terminals for connecting a semiconductor element and one or more terminals for external connection, in which the terminals for connecting the semiconductor element and the terminals for external connection are electrically connected, by a wire, with each other in the interior of the wiring board, and a semiconductor device comprising the wiring board having packaged thereon semiconductor elements. Processes for the production of the wiring board and the semiconductor device are also disclosed.
摘要翻译：一种布线基板，其特征在于，具有与上述半导体元件连接的半导体元件的一个或多个端子和一个以上的外部连接端子连接的半导体元件用端子和外部连接端子电连接的同一侧面的基板通过导线彼此连接在布线板的内部，以及半导体器件，包括其上封装有半导体元件的布线板。还公开了用于制造布线板和半导体器件的工艺。

89. 发明授权

US6067141A Liquid crystal display device with reduced viewing angle dependency 失效
标题翻译：具有降低视角依赖性的液晶显示装置
公开(公告)号：US6067141A
公开(公告)日：2000-05-23
申请号：US220885
申请日：1998-12-28
申请人： Nobuaki Yamada , Toshikazu Hirata , Takashi Kurihara , Masato Imai , Kazuyuki Endo
发明人： Nobuaki Yamada , Toshikazu Hirata , Takashi Kurihara , Masato Imai , Kazuyuki Endo
IPC分类号： G02F1/1337 , G02F1/1333 , G02F1/1339 , G02F1/139
CPC分类号： G02F1/13394 , G02F1/133753 , G02F1/1393 , G02F1/133707
摘要： The liquid crystal display device of this invention includes a pair of substrates and a liquid crystal layer including liquid crystal molecules having a negative dielectric anisotropy interposed between the pair of substrates, vertical alignment layers being formed on surfaces of the pair of substrates in contact with the liquid crystal layer, a voltage being applied across the liquid crystal layer by voltage application means formed on the pair of substrates, the liquid crystal molecules being oriented substantially vertical to the pair of substrate when no voltage is applied, wherein a plurality of column structures are provided so as to be at least partly in contact with the pair of substrates, and the liquid crystal layer has a plurality of liquid crystal domains in a direction in the plane of the substrates, and, when a voltage is applied, orientation directions of the liquid crystal molecules are continuous in each of the liquid crystal domains, while the orientation directions of liquid crystal molecules are random among the liquid crystal domains.
摘要翻译：本发明的液晶显示装置包括一对基板和液晶层，液晶层包括介于该一对基板之间的具有负的介电各向异性的液晶分子，垂直取向层形成在与该一对基板接触的一对基板的表面上液晶层，通过形成在所述一对基板上的电压施加装置施加在所述液晶层上的电压，当没有施加电压时，所述液晶分子的取向基本上垂直于所述一对基板，其中，多个列结构为被设置为与所述一对基板至少部分地接触，并且所述液晶层在所述基板的平面中的方向上具有多个液晶畴，并且当施加电压时，所述液晶层的取向方向液晶分子在每个液晶畴中是连续的，而取向方向o f液晶分子在液晶畴之间是随机的。

90. 发明授权

US4875542A Hydraulic system for variable assist power steering system 失效
标题翻译：可变辅助动力转向系统液压系统
公开(公告)号：US4875542A
公开(公告)日：1989-10-24
申请号：US213022
申请日：1988-06-29
申请人： Koh Uchida , Takashi Kurihara , Makoto Miyoshi
发明人： Koh Uchida , Takashi Kurihara , Makoto Miyoshi
IPC分类号： B62D6/02 , B62D6/00
CPC分类号： B62D6/00
摘要： A variable assist power steering system employing a fluid distributor circuit of the open center type is disclosed. The fluid distributor circuit includes two parallel fluid flow paths connected to both chambers of a power cylinder respectively to produce a pressure differential between the both cylinder chambers in response to steering torque. For modulating the valve characteristics, two additional variable flow restrictors are arranged in series with two main variable flow restrictors and two bypass paths are arranged to bypass the main variable flow restrictors, respectively. The bypass paths are provided with variable flow orifice valves, respectively, which valves are controlled in response to a turning direction of a steering wheel and also to some external signal, such as vehicle speed.
摘要翻译：公开了一种采用开放式中心型流体分配器电路的可变辅助动力转向系统。流体分配器电路包括分别连接到动力缸的两个腔室的两个平行的流体流动路径，以响应于转向扭矩而在两个气缸室之间产生压力差。为了调节阀门特性，两个附加的可变流量限制器与两个主要可变流量限制器串联布置，并且两个旁路路径分别布置成绕过主要可变流量限制器。旁通路径分别设置有可变流量节流阀，其响应于方向盘的转向方向以及诸如车辆速度的某些外部信号而被控制。

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