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    • 81. 发明授权
    • Insulated gate field effect transistor having specific dielectric
structures
    • 具有特定电介质结构的绝缘栅场效应晶体管
    • US5917225A
    • 1999-06-29
    • US721052
    • 1996-09-26
    • Shunpei YamazakiHongyong ZhangYasuhiko Takemura
    • Shunpei YamazakiHongyong ZhangYasuhiko Takemura
    • H01L21/336H01L29/78H01L29/786H01L31/0392
    • H01L29/78636H01L27/1218H01L29/4908H01L29/78603H01L29/04
    • In a thin-film insulated gate type field effect transistor having a metal gate in which the surface of the gate electrode is subjected to anodic oxidation, a silicon nitride film is provided so as to be interposed between the gate electrode and the gate insulating film to prevent invasion of movable ions into a channel, and also to prevent the breakdown of the gate insulating film due to a potential difference between the gate electrode and the channel region. By coating a specific portion of the gate electrode with metal material such as chrome or the like for the anodic oxidation, and then removing only the metal material such as chrome or the like together with the anodic oxide of the metal material such as chrome or the like, an exposed portion of metal gate (e.g. aluminum) is formed, and an upper wiring is connected to the exposed portion. Further, an aluminum oxide or silicon nitride is formed as an etching stopper between the gate electrode and the gate insulating film or between the substrate and the layer on the substrate, so that the over-etching can be prevented and the flatness of the element can be improved. In addition, a contact is formed in no consideration of the concept "contact hole".
    • 在具有金属栅极的薄膜绝缘栅型场效应晶体管中,栅电极的表面进行阳极氧化,设置氮化硅膜以便插入在栅电极和栅绝缘膜之间, 防止可移动离子侵入通道,并且还防止由于栅极电极和沟道区域之间的电位差导致的栅极绝缘膜的击穿。 通过用阳极氧化等金属材料如铬等涂覆栅电极的特定部分,然后仅将金属材料如铬等与金属材料的阳极氧化物如铬或 形成金属栅极(例如铝)的暴露部分,并且上部布线连接到暴露部分。 此外,在栅电极和栅极绝缘膜之间或衬底和衬底上的层之间形成氧化铝或氮化硅作为蚀刻阻挡层,从而可以防止过蚀刻,并且元件的平坦度可以 要改进 另外,不考虑概念“接触孔”形成接触。
    • 85. 发明授权
    • Method for manufacturing a thin film transistor device
    • 制造薄膜晶体管器件的方法
    • US07622335B2
    • 2009-11-24
    • US10926059
    • 2004-08-26
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/00
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。