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    • 3. 发明授权
    • Method for forming a semiconductor device
    • 半导体器件形成方法
    • US06323071B1
    • 2001-11-27
    • US09233146
    • 1999-01-19
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L2100
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 4. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08062935B2
    • 2011-11-22
    • US12579642
    • 2009-10-15
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/00
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film an a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过选择性地形成覆盖膜来形成具有薄膜晶体管的动态电路,同时获得漏电流低的晶体管和迁移率高的晶体管,即将成为有源层的半导体层 晶体管,然后通过其热结晶。
    • 5. 发明授权
    • Method of manufacturing a thin film transistor device
    • 制造薄膜晶体管器件的方法
    • US06806125B2
    • 2004-10-19
    • US09993492
    • 2001-11-27
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L2100
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 6. 发明授权
    • Thin film transistor
    • 薄膜晶体管
    • US5563426A
    • 1996-10-08
    • US341106
    • 1994-11-18
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/20H01L21/336H01L21/77H01L21/84H01L29/76H01L27/108H01L29/04
    • H01L29/66757H01L21/2022H01L27/1277G09G2300/0408
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 7. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5403772A
    • 1995-04-04
    • US160908
    • 1993-12-03
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/20H01L21/336H01L21/77H01L21/84
    • H01L29/66757H01L21/2022H01L27/1277G09G2300/0408
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜的上方或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下退火进行其结晶化 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。