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    • 82. 发明申请
    • High voltage mosfet having Si/SiGe heterojunction structure and method of manufacturing the same
    • 具有Si / SiGe异质结结构的高电压mosfet及其制造方法
    • US20060105528A1
    • 2006-05-18
    • US11182671
    • 2005-07-15
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • H01L21/8234
    • H01L29/7835H01L21/823807H01L29/1054H01L29/66659
    • Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.
    • 提供了具有Si / SiGe异质结结构的高压金属氧化物半导体场效应晶体管(HVMOSFET)及其制造方法。 在该方法中,层叠有Si层,弛豫SiGe外延层,SiGe外延层和Si外延层的基板或其上具有阱区的Si层,SiGe外延层和 Si外延层被形成。 对于具有异质结结构的器件,通过势阱的导电载流子数量和载流子的迁移率增加,以降低导通电阻,从而增加饱和电流。 此外,垂直电场的强度降低,使得击穿电压可以保持在非常高的水平。 此外,由于异质结构造成的垂直电场的减少导致跨导增益(Gm),结果是热电子效应被抑制,并且器件的可靠性增强。
    • 83. 发明授权
    • Method for fabricating power semiconductor device having trench gate structure
    • US06852597B2
    • 2005-02-08
    • US10071127
    • 2002-02-08
    • Il-Yong ParkJong Dae KimSang Gi KimJin Gun KooDae Woo LeeRoh Tae MoonYang Yil Suk
    • Il-Yong ParkJong Dae KimSang Gi KimJin Gun KooDae Woo LeeRoh Tae MoonYang Yil Suk
    • H01L21/336H01L29/417H01L29/78
    • H01L29/7813H01L29/41766H01L29/41775H01L29/7802
    • A method for fabricating a power semiconductor device having a trench gate structure is provided. An epitaxial layer of a first conductivity type having a low concentration and a body region of a second conductivity type are sequentially formed on a semiconductor substrate of the first conductivity type having a high concentration. An oxide layer pattern is formed on the body region. A first trench is formed using the oxide layer pattern as an etching mask to perforate a predetermined portion of the body region having a first thickness. A body contact region of the second conductivity type having a high concentration is formed to surround the first trench by impurity ion implantation using the oxide layer pattern as an ion implantation mask. First spacer layers are formed to cover the sidewalls of the first trench and the sidewalls of the oxide layer pattern. A second trench is formed using the oxide layer pattern and the first spacer layers as etching masks to perforate a predetermined portion of the body region having a second thickness greater than the first thickness. A source region of the first conductivity type having a high concentration is formed to surround the second trench by impurity ion implantation using the oxide layer pattern and the first spacer layers as ion implantation masks. Second spacer layers are formed to cover the sidewalls of the second trench and the sidewalls of the first spacer layers. A third trench is formed to a predetermined depth of the epitaxial layer using the oxide layer pattern, the first spacer layers, and the second spacer layers as etching masks. A gate insulating layer is formed in the third trench. A gate conductive pattern is formed in the gate insulating layer. An oxide layer is formed on the gate conductive layer pattern. The first and second spacer layers are removed. A first metal electrode layer is formed to be electrically connected to the source region and the body contact region. A second metal electrode layer is formed to be electrically connected to the gate conductive layer pattern. A third metal electrode layer is formed to be electrically connected to the semiconductor substrate.
    • 84. 发明授权
    • Driving circuit of a liquid crystal display device
    • 液晶显示装置的驱动电路
    • US06731259B2
    • 2004-05-04
    • US10029196
    • 2001-12-28
    • Jung Taeck YerSin Ho KangJong Dae Kim
    • Jung Taeck YerSin Ho KangJong Dae Kim
    • G09G336
    • G09G3/3696G09G2320/0673G09G2360/144
    • A driving circuit of an LCD device compensates a gamma voltage according to a peripheral environment so that exact picture images can be displayed. The driving circuit of the LCD device includes a memory dividing the peripheral environment into a plurality of modes and storing information of each mode, an environment sensor sensing variation of the peripheral environment, a controller selecting information of a mode corresponding to the resultant value sensed by the environment sensor, a digital variable resistor adjusting a resistance value to correspond to mode information selected by the controller, and a gamma voltage outputting unit outputting a plurality of gamma voltages corresponding to the adjusted resistance value.
    • LCD装置的驱动电路根据外围环境补偿伽马电压,从而可以显示精确的图像图像。 LCD装置的驱动电路包括将外围环境分解为多种模式并存储每种模式的信息的存储器,感测周边环境的变化的环境传感器,控制器选择与由 环境传感器,调整与由控制器选择的模式信息相对应的电阻值的数字可变电阻器;以及伽马电压输出单元,输出对应于调整后的电阻值的多个伽马电压。