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    • 82. 发明申请
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法相同
    • US20090020815A1
    • 2009-01-22
    • US12219027
    • 2008-07-15
    • Hiromichi Godo
    • Hiromichi Godo
    • H01L29/00H01L21/425
    • H01L27/1266H01L21/84H01L27/1214H01L29/04H01L29/78606H01L29/78621H01L29/78696
    • An object of the present invention is to provide a semiconductor device having a structure which can realize not only suppressing a punch-through current but also reusing a silicon wafer which is used for bonding, in manufacturing a semiconductor device using an SOI technique, and a manufacturing method thereof. The semiconductor device can suppress the punch-through current by forming a semiconductor film in which an impurity imparting a conductivity type opposite to that of a source region and a drain region is implanted over a substrate having an insulating surface, and forming a channel formation region using a semiconductor film of stacked layers obtained by bonding a single crystal semiconductor film to the semiconductor film by an SOI technique.
    • 本发明的目的是提供一种半导体器件,其具有不仅可以实现穿通电流的抑制,而且可以实现在使用SOI技术的半导体器件的制造中重新使用用于接合的硅晶片的结构,以及 其制造方法。 半导体器件可以通过形成半导体膜来抑制穿通电流,其中将具有与源极区和漏极区相反的导电类型的杂质注入到具有绝缘表面的衬底上,并且形成沟道形成区 使用通过SOI技术将单晶半导体膜接合到半导体膜而获得的堆叠层的半导体膜。
    • 83. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20080220570A1
    • 2008-09-11
    • US12073618
    • 2008-03-07
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • Hideto OhnumaAtsuo IsobeHiromichi Godo
    • H01L21/84
    • H01L29/78696H01L21/0237H01L21/02675H01L21/02691H01L27/1281
    • A semiconductor device having a highly responsive thin film transistor (TFT) with low subthreshold swing and suppressed decrease in the on-state current and a manufacturing method thereof are demonstrated. The THF of the present invention is characterized by its semiconductor layer where the thickness of the source region or the drain region is larger than that of the channel formation region. Manufacture of the TFT is readily achieved by the formation of an amorphous semiconductor layer on a projection portion and a depression portion, which is followed by subjecting the melting process of the semiconductor layer, resulting in the formation of a crystalline semiconductor layer having different thicknesses. Selective addition of impurity to the thick portion of the semiconductor layer provides a semiconductor layer in which the channel formation region is thinner than the source or drain region.
    • 示出了具有低亚阈值摆动和抑制导通电流下降的高响应性薄膜晶体管(TFT)的半导体器件及其制造方法。 本发明的THF的特征在于其源区域或漏极区域的厚度大于沟道形成区域的厚度的半导体层。 通过在突起部分和凹陷部分上形成非晶半导体层来容易地实现TFT的制造,随后对半导体层进行熔化处理,形成具有不同厚度的晶体半导体层。 选择性地向半导体层的厚部分添加杂质提供了沟道形成区域比源区或漏区更薄的半导体层。
    • 84. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体器件及其制造方法
    • US20070210379A1
    • 2007-09-13
    • US11713620
    • 2007-03-05
    • Hiromichi Godo
    • Hiromichi Godo
    • H01L29/76
    • H01L29/66757H01L27/1255H01L29/78675
    • It is an object to reduce the effect of a characteristic of the edge portion of a channel forming region in a semiconductor film, on a transistor characteristic. An island-like semiconductor film is formed over a substrate, and a conductive film forming a gate electrode provided over the island-like semiconductor film with a gate insulating film interposed therebetween, is formed over the semiconductor film. In the semiconductor film, a channel forming region, a first impurity region forming a source or drain region, and a second impurity region are provided. The channel forming region is provided in a region which overlaps with the gate electrode crossing the island-like semiconductor film, the first impurity region is provided so as to be adjacent to the channel forming region, and the second impurity region is provided so as to be adjacent to the channel forming region and the first impurity region. The first impurity region and the second impurity region are provided so as to have different conductivity, and the second impurity region and the channel forming region are made to have different conductivity or to have different concentration of an impurity element contained in the second impurity region and the channel forming region in a case of having the same conductivity.
    • 本发明的目的是减小半导体膜中的沟道形成区域的边缘部分的特性对晶体管特性的影响。 在衬底上形成岛状半导体膜,并且在半导体膜上形成形成设置在岛状半导体膜上的栅极的导电膜,其间插入有栅极绝缘膜。 在半导体膜中,设置沟道形成区域,形成源区或漏区的第一杂质区和第二杂质区。 通道形成区域设置在与栅极电极交叠的区域中,与岛状半导体膜交叉,第一杂质区域设置成与沟道形成区域相邻,并且第二杂质区域被设置为 与沟道形成区域和第一杂质区域相邻。 第一杂质区域和第二杂质区域被设置为具有不同的导电性,并且使第二杂质区域和沟道形成区域具有不同的导电性或者使第二杂质区域中包含的杂质元素的浓度不同,以及 在具有相同导电性的情况下的沟道形成区域。
    • 87. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08916866B2
    • 2014-12-23
    • US13279868
    • 2011-10-24
    • Hiromichi GodoSatoshi Kobayashi
    • Hiromichi GodoSatoshi Kobayashi
    • H01L29/786H01L21/00
    • H01L29/7869H01L29/78648
    • A semiconductor device includes a first gate electrode; a gate insulating layer covering the first gate electrode; an oxide semiconductor layer that overlaps with the first gate electrode; oxide semiconductor layers having high carrier density covering end portions of the oxide semiconductor layer; a source electrode and a drain electrode in contact with the oxide semiconductor layers having high carrier density; an insulating layer covering the source electrode, the drain electrode, and the oxide semiconductor layer; and a second gate electrode that is in contact with the insulating layer. Each of the oxide semiconductor layers is in contact with part of each of an upper surface, a lower surface, and a side surface of one of the end portions of the oxide semiconductor layer and part of an upper surface of the gate insulating layer.
    • 半导体器件包括第一栅电极; 覆盖所述第一栅电极的栅极绝缘层; 与所述第一栅电极重叠的氧化物半导体层; 具有覆盖氧化物半导体层的端部的高载流子密度的氧化物半导体层; 与具有高载流子密度的氧化物半导体层接触的源电极和漏电极; 覆盖源电极,漏电极和氧化物半导体层的绝缘层; 以及与绝缘层接触的第二栅电极。 每个氧化物半导体层与氧化物半导体层的一个端部和栅极绝缘层的上表面的一部分的上表面,下表面和侧表面的一部分接触。
    • 88. 发明授权
    • Light-emitting display device
    • 发光显示装置
    • US08704267B2
    • 2014-04-22
    • US12579486
    • 2009-10-15
    • Hiromichi Godo
    • Hiromichi Godo
    • H01L33/00
    • H01L29/7869H01L27/1225
    • The light-emitting display device comprises first and second thin film transistors. The first thin film transistor includes a first gate electrode; a first oxide semiconductor film; and a first electrode and a second electrode which are electrically connected to the first oxide semiconductor film. The second thin film transistor includes a second gate electrode electrically connected to the second electrode; a second oxide semiconductor film; a third electrode; a light-emitting layer and a fourth electrode over the second oxide semiconductor film. A work function of the second oxide semiconductor film is higher than a work function of the fourth electrode.
    • 发光显示装置包括第一和第二薄膜晶体管。 第一薄膜晶体管包括第一栅电极; 第一氧化物半导体膜; 以及与第一氧化物半导体膜电连接的第一电极和第二电极。 第二薄膜晶体管包括与第二电极电连接的第二栅电极; 第二氧化物半导体膜; 第三电极; 第二氧化物半导体膜上的发光层和第四电极。 第二氧化物半导体膜的功函数高于第四电极的功函数。