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81. 发明授权

US5182351A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5182351A
公开(公告)日：1993-01-26
申请号：US580668
申请日：1990-09-11
申请人： Toshio Shiobara , Hisashi Shimizu
发明人： Toshio Shiobara , Hisashi Shimizu
IPC分类号： C08F222/40 , C08F20/52 , C08F30/08 , C08F230/08 , C08F290/00 , C08F299/00 , C08F299/08 , C08G59/20 , C08G59/30 , C08G59/40 , C08G73/12 , C08K5/3415 , C08L79/08 , C08L83/04 , C08L83/07
CPC分类号： C08L79/08 , C08F299/08 , C08F30/08 , C08G73/12 , C08G73/125 , C08G73/126 , C08G73/127 , C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/70
摘要： A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.
摘要翻译：包含其分子中具有至少一个N-取代的马来酰亚胺基团的马来酰亚胺和具有共轭双键的硅化合物的热固性树脂组合物易于加工，并产生具有改善的耐热性的固化产物。

82. 发明授权

US08237189B2 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same 有权
标题翻译：可热固化的有机硅树脂 - 环氧树脂组合物，以及由其模制的预成型包装
公开(公告)号：US08237189B2
公开(公告)日：2012-08-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译：作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D）固化促进剂。该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

83. 发明授权

US07737194B2 Silicone lens and silicone resin composition for molding lens 有权
标题翻译：硅胶透镜和用于成型镜片的硅树脂组合物
公开(公告)号：US07737194B2
公开(公告)日：2010-06-15
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译：通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜，其包含（A）具有包含R1SiO1.5单元，R22SiO单元和R3aR4bSiO（4-ab）/ 2单元的树脂结构的有机聚硅氧烷，其中R1，R2和R3为乙基，丙基，环己基或苯基，R4为乙烯基或烯丙基，a为0,1或2，b为1或2，a + b为2或3，以及其中R22SiO单元的重复数为5〜300，（B）具有包含R1SiO1.5单元，R22SiO单元和R3cHdSiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，其中c为0,1或 2，d为1或2，c + d为2或3，R22SiO单元的重复数为5〜300，该成分为（C）铂族催化剂。提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。

84. 发明申请

US20100104794A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：热固性环氧树脂组合物和半导体器件
公开(公告)号：US20100104794A1
公开(公告)日：2010-04-29
申请号：US11997831
申请日：2006-07-28
申请人： Takayuki Aoki , Toshio Shiobara
发明人： Takayuki Aoki , Toshio Shiobara
IPC分类号： B32B1/06 , C08L63/10 , C08G69/00 , C08G59/20
CPC分类号： C08G59/42 , C08G59/3245 , C08L63/00 , H01L23/293 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , Y10T428/239 , H01L2924/00014 , H01L2924/00
摘要： A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.
摘要翻译：一种热固性环氧树脂组合物，其特征在于，作为树脂成分含有将三嗪衍生物/环氧树脂与酸酐反应得到的固体成分与环氧基的量为0.6〜2.0当量的比例相对于酸酐基团。

85. 发明申请

US20080308828A1 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US20080308828A1
公开(公告)日：2008-12-18
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

86. 发明授权

US07244495B2 Dicing/die bonding adhesion tape 失效
标题翻译：切割/芯片粘合胶带
公开(公告)号：US07244495B2
公开(公告)日：2007-07-17
申请号：US10829150
申请日：2004-04-22
申请人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C09J7/02 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/31663 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
摘要翻译：切割/贴合粘合带包括基底，硅氧烷粘合剂层和粘合层。在硅胶粘合剂层和粘合层之间产生0.2-2.0N / 25mm的粘着强度。接合层由包含（A）聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂的粘合组合物形成。

87. 发明申请

US20060270808A1 Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开
标题翻译：环氧硅酮类混合树脂组合物，其固化物，发光半导体装置
公开(公告)号：US20060270808A1
公开(公告)日：2006-11-30
申请号：US11438444
申请日：2006-05-23
申请人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
发明人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
IPC分类号： C08L83/05 , C08L63/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L63/00 , C08L83/00 , C08L2666/14 , C08K5/56 , C08K5/0091
摘要： An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要翻译：一种环氧硅树脂混合树脂组合物，其包含（A）具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷，（B）具有至少一个环氧基的有机树脂，（C）有机氢聚硅氧烷，（D）铂族金属类催化剂（E）铝化合物和（F）0.1-15％重量的有机脱模剂在金属模具中成型并固化成透明产品，其可以从模子。固化产品对金属框架具有令人满意的粘合强度，并保持耐热性。 LED器件可以通过连续机械成型制造。

88. 发明申请

US20060264583A1 Lens-forming silicone resin composition and silicone lens 审中-公开
标题翻译：透镜成型硅树脂组合物和硅胶透镜
公开(公告)号：US20060264583A1
公开(公告)日：2006-11-23
申请号：US11437664
申请日：2006-05-22
申请人： Tsutomu Kashiwagi , Toshio Shiobara , Katsuyuki Imazawa
发明人： Tsutomu Kashiwagi , Toshio Shiobara , Katsuyuki Imazawa
IPC分类号： C08L83/04
CPC分类号： G02B1/041 , C08G77/12 , C08G77/20 , C08L83/04 , C08L83/00
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要翻译：硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键并且在25℃下具有100-1,000,000mPa.s粘度的有机聚硅氧烷，（B）具有至少三个与硅键合的氢原子的有机氢聚硅氧烷（SiH基）），和（C）铂族金属碱催化剂固化成无色透明部分，这是有用的透镜。

89. 发明申请

US20060229408A1 Curable resin composition for sealing LED element 审中-公开
标题翻译：用于密封LED元件的可固化树脂组合物
公开(公告)号：US20060229408A1
公开(公告)日：2006-10-12
申请号：US11399434
申请日：2006-04-07
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/06 , C08G77/08
CPC分类号： H01L23/293 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , C08L2666/52 , C08L2666/54 , H01L2924/00
摘要： A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.
摘要翻译：提供一种用于密封LED元件的可固化树脂组合物。组合物包括（i）聚苯乙烯当量重均分子量为至少5×10 3的有机聚硅氧烷，（ii）缩合催化剂，（iii）溶剂和（iv）细粉末状无机物填料。适合于形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘合性的涂膜等，并且是诸如LED元件的密封等应用的理想选择。

90. 发明授权

US07056772B2 Method for sealing semiconductor component 有权
标题翻译：密封半导体元件的方法
公开(公告)号：US07056772B2
公开(公告)日：2006-06-06
申请号：US10885678
申请日：2004-07-08
申请人： Toshio Shiobara , Tsutomu Kashiwagi
发明人： Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： H01L21/48
CPC分类号： H01L23/3157 , H01L21/56 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In connection with a semiconductor component having a circuit region and electrodes formed on a substrate surface, the circuit region is sealed by (1) applying a resist material onto the substrate surface to form a resist layer, (2) selectively exposing the resist layer to radiation and developing the resist with a liquid developer for thereby removing only the portion of the resist layer which overlies the circuit region, (3) applying a resin sealant onto the circuit region and curing the resin sealant into a cured resin layer that covers the circuit region, and (4) removing the residual resist layer using a solvent.
摘要翻译：结合具有电路区域和形成在基板表面上的电极的半导体部件，通过（1）在基板表面上施加抗蚀剂材料以形成抗蚀剂层来密封电路区域，（2）将抗蚀剂层选择性地暴露于辐射并用液体显影剂显影抗蚀剂，从而仅去除覆盖电路区域的抗蚀剂层的部分，（3）将树脂密封剂施加到电路区域上并将树脂密封剂固化成覆盖电路的固化树脂层区域，（4）使用溶剂除去残留抗蚀剂层。

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