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81. 发明授权

US06713318B2 Flip chip interconnection using no-clean flux 有权
公开(公告)号：US06713318B2
公开(公告)日：2004-03-30
申请号：US09820547
申请日：2001-03-28
申请人： Michihisa Maeda , Kenji Takahashi
发明人： Michihisa Maeda , Kenji Takahashi
IPC分类号： H01L2144
CPC分类号： H01L24/81 , B23K35/262 , B23K35/3618 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/13147 , H01L2224/75 , H01L2224/75252 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15312 , H05K3/3436 , H05K3/3489 , H01L2924/00014
摘要： A flip chip method of joining a chip and a substrate is described. A thermo-compression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps on the substrate against metal bumps on the chip. The chip is rapidly heated from its non-native side by a pulse heater in the head of the bonder until the re-flow temperature of the solder bumps is reached. Proximate with reaching the re-flow temperature at the solder bumps, the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions and joining. A no-clean flux that has a volatilization temperature below the melting point of the solder bumps is utilized to minimize or eliminate the need for a post interconnection de-flux operation.

82. 发明授权

US06536108B2 Method of and apparatus for producing rear holder-attached connector 有权
标题翻译：制造后保持器连接器的方法和装置
公开(公告)号：US06536108B2
公开(公告)日：2003-03-25
申请号：US09739324
申请日：2000-12-19
申请人： Norio Kawamura , Hiroshi Murashita , Junichi Hamamoto , Takashi Masuda , Toshimi Nakashima , Kazuhiko Hiraguchi , Kenji Takahashi
发明人： Norio Kawamura , Hiroshi Murashita , Junichi Hamamoto , Takashi Masuda , Toshimi Nakashima , Kazuhiko Hiraguchi , Kenji Takahashi
IPC分类号： H01R4300
CPC分类号： H01R43/18 , B29C45/006 , B29C2045/0063 , H01R13/4361 , H01R43/20 , Y10T29/49169 , Y10T29/49176 , Y10T29/4922 , Y10T29/53209
摘要： In a production apparatus (1), after rear holders (7a, 7b) and a housing body (8) are molded by molding die cavities, slides (11a, 11b) are moved apart from the housing body (8). Then, cylinders (16a, 16b) are driven to move the rear holders (7a, 7b), holders (13a, 13b) and the slides (11a, 11b) together with slide plates (14a, 14b), so that the rear holders (7a, 7b) are located in opposed relation to the housing body (8). Then, cylinders (19a, 19b) are driven to move the rear holders (7a, 7b) toward the housing body (8), thereby provisionally retaining the rear holders (7a, 7b) on the housing body (8). Therefore, the amount of movement of the slides (11a, 11b) is small, and it is not necessary to provide any space for holding the slides (11a, 11b), moved into their respective stand-by positions, and therefore the small-size design of the production apparatus can be achieved, and also the production efficiency can be enhanced.
摘要翻译：在制造装置（1）中，通过成形模腔成型后后保持件（7a，7b）和壳体（8）之后，使滑动体（11a，11b）离开壳体（8）。然后，驱动气缸（16a，16b），将滑动板（14a，14b）与后挡块（7a，7b），保持架（13a，13b）和滑块（11a，11b）一起移动，（7a，7b）相对于壳体（8）相对设置。然后，驱动气缸（19a，19b）使后保持架（7a，7b）朝向壳体（8）移动，从而将后保持架（7a，7b）暂时保持在壳体（8）上。因此，滑块（11a，11b）的移动量小，不需要设置用于保持移动到其各自待机位置的滑块（11a，11b）的空间，可以实现生产装置的尺寸设计，并且还可以提高生产效率。

83. 发明授权

US06439447B1 Bump joining judging device and method, and semiconductor component production device and method 失效
标题翻译：凸块接合判断装置和方法，以及半导体部件生产装置和方法
公开(公告)号：US06439447B1
公开(公告)日：2002-08-27
申请号：US09763959
申请日：2001-02-28
申请人： Shozo Minamitani , Kazushi Higashi , Kenji Takahashi , Shinji Kanayama , Hiroshi Wada , Takafumi Tsujisawa , Makoto Akita , Kenji Okamoto , Shinzo Eguchi , Yasuhiro Kametani
发明人： Shozo Minamitani , Kazushi Higashi , Kenji Takahashi , Shinji Kanayama , Hiroshi Wada , Takafumi Tsujisawa , Makoto Akita , Kenji Okamoto , Shinzo Eguchi , Yasuhiro Kametani
IPC分类号： B23K106
CPC分类号： H01L22/12 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/75 , H01L2224/759 , H01L2224/81801 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2924/00014
摘要： When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.
摘要翻译：当电子部件上的电极和电路板上的电极部分上的电极通过凸块与电子部件和电路板分别振动时，减振检测装置和判定装置检测由连接件凸起和电极部分，然后基于振动的阻尼确定接合的良好或有缺陷。此外，关于超声波振荡器的阻抗，喷嘴的移动量或向VCM供给的电流，将这些接合期间的这些波形与良好接合的波形进行比较，然后确定良好或有缺陷。根据上述结构，可以在接合期间确定电子部件和电路板之间的接合的良好或有缺陷。此外，当接合期间接合状态变得错误时，可以改变接合状态。因此，防止缺陷成分的产生，并且可以提高成品率。

84. 发明授权

US06385249B1 Data converting apparatus, method thereof, and recording medium 失效
标题翻译：数据转换装置，方法和记录介质
公开(公告)号：US06385249B1
公开(公告)日：2002-05-07
申请号：US09572260
申请日：2000-05-17
申请人： Tetsujiro Kondo , Kenji Takahashi , Naoki Kobayashi , Yoshinori Watanabe
发明人： Tetsujiro Kondo , Kenji Takahashi , Naoki Kobayashi , Yoshinori Watanabe
IPC分类号： H04N712
CPC分类号： G06T3/40 , H04N19/50
摘要： A picture reducing circuit 1 reduces a supplied original picture. A higher picture memory 2 stores an input higher picture. A predictive tap extracting circuit 3 extracts predictive taps from the higher picture stored in the higher picture memory 2 and outputs the extracted predictive taps to a mapping circuit 4, predictive coefficient generating circuit 5, and pixel value updating circuit 8. The mapping circuit 4 calculates a linear combination of predictive taps and predictive coefficients and obtains a predictive picture. The predictive picture is output to an error calculating circuit 6. The error calculating circuit 6 calculates an error (S/N ratio) between pixel value of the predictive picture and that of the original picture. A comparing and determining circuit 7 controls a non-linear processing circuit 9 corresponding to the difference of the errors. The non-linear processing circuit 9 adds or subtracts a predetermined value to/from the pixel value of each pixel of the updated higher picture corresponding to the variation amount of pixel value updated by the pixel value updating circuit 8.
摘要翻译：图像缩小电路1减少所提供的原始图像。较高的图像存储器2存储输入较高的图像。预测抽头提取电路3从存储在较高画面存储器2中的较高画面提取预测抽头，并将所提取的预测抽头输出到映射电路4，预测系数产生电路5和像素值更新电路8.映射电路4计算预测抽头和预测系数的线性组合，并获得预测图像。预测图像被输出到误差计算电路6.误差计算电路6计算预测图像的像素值与原始图像的像素值之间的误差（S / N比）。比较和确定电路7控制对应于错误差异的非线性处理电路9。非线性处理电路9对与由像素值更新电路8更新的像素值的变化量相对应的更新后的高级图像的每个像素的像素值加上或减去预定值。

85. 发明授权

US06361714B1 Method of preparing barium fluorohalide phosphor 失效
标题翻译：制备卤化砷鎓荧光粉的方法
公开(公告)号：US06361714B1
公开(公告)日：2002-03-26
申请号：US09586595
申请日：2000-06-02
申请人： Yasuo Iwabuchi , Chiyuki Umemoto , Kenji Takahashi , Kazuhiro Hasegawa
发明人： Yasuo Iwabuchi , Chiyuki Umemoto , Kenji Takahashi , Kazuhiro Hasegawa
IPC分类号： C09K1100
CPC分类号： C09K11/7706 , C09K11/7705
摘要： A method of preparing a barium fluorohalide phosphor including a mixing step in which phosphor materials are mixed, a firing step in which a resulting mixture of phosphor materials is fired, an annealing step, and a cooling step in which the mixture of phosphor materials is cooled to the ordinary temperature. In the firing step, after the mixture of phosphor materials has been fired at a constant temperature, an atmosphere at the time of the firing is removed while the constant temperature is maintained, and is replaced with an atmosphere different from the atmosphere at the time of the firing, and thereafter, annealing is carried out. In the cooling step, the atmosphere at the time of the firing is removed and replaced with a first different atmosphere, and then first cooling is carried out. Further, the first atmosphere is removed and replaced with a second atmosphere, and then second cooling is carried out. Alternatively, in the cooling step, the atmosphere at the time of the firing is removed and replaced with vacuum or a neutral gas atmosphere, and then cooling is carried out.
摘要翻译：一种制备包括混合荧光体材料的混合步骤的卤化钡荧光粉的方法，煅烧所得的荧光体材料混合物的烧制步骤，退火步骤和冷却步骤，其中将荧光体材料的混合物冷却达到常温。在烧成工序中，将荧光体材料的混合物在恒定温度下烧成后，在保持恒温的同时除去烧成时的气氛，并且在不同于大气的气氛进行烧成，然后进行退火。在冷却步骤中，除去烧成时的气氛并用第一不同的气氛代替，然后进行第一次冷却。此外，除去第一气氛并用第二气氛替换，然后进行第二冷却。或者，在冷却步骤中，除去烧成时的气氛，用真空或中性气体气体置换，然后进行冷却。

86. 发明授权

US06290873B1 Phosphor preparation method 失效
标题翻译：荧光粉制备方法
公开(公告)号：US06290873B1
公开(公告)日：2001-09-18
申请号：US09471113
申请日：1999-12-23
申请人： Kenji Takahashi , Chiyuki Umemoto , Makoto Funabashi , Yuji Isoda
发明人： Kenji Takahashi , Chiyuki Umemoto , Makoto Funabashi , Yuji Isoda
IPC分类号： C09K1161
CPC分类号： C09K11/7757 , C09K11/7703 , C09K11/7706 , C09K11/7718 , C09K11/7721 , C09K11/7731 , C09K11/7734 , C09K11/7746 , C09K11/7749 , C09K11/7758 , C09K11/7761 , C09K11/7764
摘要： There is provided a method for preparing a highly accelerated-phosphorescent phosphor whose erasability and after-image characteristic are both improved. Phosphor materials are mixed together to obtain a mixture, and the mixture of phosphor materials is fired in a furnace having a firing region whose capacity is 2 to 500 L per kilogram of the mixture, at a temperature of 550 to 1000° C. while introducing 1 to 200 ml of oxygen in volume at room temperature per liter capacity of the firing region in the furnace, to thereby prepare a phosphor represented by the following compositional formula (I): (Ba1−a, MIIa)FX.bMI.cMIII.dA:xLn (I) wherein, MIIa is alkaline earth metal such as Sr, Ca or Mg; MI is alkali metal such as Li, Na or K; MIII is Al, Ga or In; X is Cl, Br or I; Ln is rare earth element such as Ce, Eu or the like; A is a metallic oxide such as Al2O3; and a, b, c, d and x are numerical values within the ranges of 0≦a≦0.3, 0
摘要翻译：提供了一种制备高加速磷光体荧光体的方法，其可擦除性和后图像特性均得到改善。将荧光体材料混合在一起以获得混合物，并将荧光体材料的混合物在550-1000℃的温度下在具有每千克混合物的容量为2至500L的烧制区域的炉中焙烧，同时引入在室温下每升容量的烧制区域的体积为1〜200ml的氧气，由此制备由以下组成式（I）表示的荧光体：其中，MIIa是诸如Sr，Ca的碱土金属或镁 MI是碱金属如Li，Na或K; MIII是Al，Ga或In; X是Cl，Br或I; Ln是Ce，Eu等稀土类元素; A是金属氧化物，如Al2O3; 并且a，b，c，d和x是0≤a≤0.3,0

87. 发明授权

US06236541B1 Disc cartridge 失效
标题翻译：光盘盒
公开(公告)号：US06236541B1
公开(公告)日：2001-05-22
申请号：US09298220
申请日：1999-04-23
申请人： Kenji Takahashi
发明人： Kenji Takahashi
IPC分类号： G11B2303
CPC分类号： G11B23/0308
摘要： A disc cartridge is provided which comprises a cartridge body having spinnably encased therein a disc and having also formed therein read/write openings through which radially extending portions of main surfaces of the disc are exposed, a shutter member coupled movably to the cartridge body, and a locking member. The shutter member is kept locked to close the read/write openings with a bent engagement lug formed on a sliding guide portion being engaged on the locking member. To reinforce the base portion of the engagement lug, the shutter member has provided thereon a reinforcement portion formed by bending from the sliding guide portion integrally with the engagement lug. Thus, the engagement lug can be prevent from being deformed under a shock, if any, applied to the disc cartridge and the shutter member can positively keep closing the read/write openings.
摘要翻译：提供了一种盘盒，其包括可旋转地封装在盘中的盒体，并且还在其中形成有读/写开口，盘的主表面的径向延伸部分通过该开口露出;可移动地联接到盒体的活门构件，以及锁定构件。活门构件保持锁定，以便在形成在与锁定构件接合的滑动导向部分上的弯曲接合凸耳上闭合读/写开口。为了加强接合凸耳的基部，挡板部件上设有加强部分，该加强部分由滑动导向部分与接合凸块一体地弯曲形成。因此，可以防止接合凸耳在施加到盘盒和挡板构件的冲击下（如果有的话）变形以能够正确地保持关闭读/写开口。

88. 发明授权

US06206146B1 Disc brake assembly 失效
标题翻译：盘式制动器总成
公开(公告)号：US06206146B1
公开(公告)日：2001-03-27
申请号：US08411202
申请日：1995-03-27
申请人： Kiyotaka Murai , Kenji Takahashi
发明人： Kiyotaka Murai , Kenji Takahashi
IPC分类号： F16D6538
CPC分类号： F16D65/0006 , F16D65/092 , F16D2065/026
摘要： A disc brake assembly having a pair of brake shoes to be pressed into contact with a disc rotor secured for rotation with a road wheel of an automotive vehicle, wherein the brake shoes each are provided with a pair of laterally spaced friction pad members respectively formed in a trapezoid configuration the outer sides of which are formed as hypotenuse, and wherein a distance between upper opposite ends of each pair of the friction pad members is determined to be less than about {fraction (1/12)} of the circumferential length of said disc rotor.
摘要翻译：一种盘式制动器组件，其具有一对制动蹄，所述制动蹄与被固定成与机动车辆的车轮一起转动的盘式转子压接，其中，所述制动蹄各自设置有一对横向间隔开的摩擦垫构件，梯形构造，其外侧形成为斜边，并且其中每对摩擦垫构件的上部相对端之间的距离被确定为小于所述第一摩擦垫构件的圆周长度的约{分数（1/12）} 圆盘转子。

89. 发明授权

US6160845A Picture encoding device, picture encoding method, picture decoding device, picture decoding method, and recording medium 有权
标题翻译：图像编码装置，图像编码方法，图像解码装置，图像解码方法以及记录介质
公开(公告)号：US6160845A
公开(公告)日：2000-12-12
申请号：US136148
申请日：1998-08-18
申请人： Tetsujiro Kondo , Kenji Takahashi
发明人： Tetsujiro Kondo , Kenji Takahashi
IPC分类号： G06T9/00 , H04N7/26 , H04N7/32 , H04N7/34 , H04N7/46 , H04B1/66
CPC分类号： H04N19/59 , H04N19/186 , H04N19/50 , H04N19/593
摘要： A compressed picture signal having a number of pixels smaller than the number of pixels of an original picture signal is generated, and plural patterns of prediction pixels are formed by using neighboring pixels of as notable pixel which is one of pixels constituting the compressed picture signal. The original picture signal is predicted from each of the plural patterns of prediction pixels and a predetermined prediction coefficient, and each of prediction values with respect to the plural patterns of prediction pixels is outputted. A prediction error of each of the prediction values of the plural patterns of prediction pixels with respect to the original picture signal is calculated, and a pattern code corresponding to a prediction pixel with which a minimum prediction error is obtained, among the plural patterns of prediction pixels, is appended to the pixel value of the notable pixel.
摘要翻译：产生具有小于原始图像信号的像素数量的像素数的压缩图像信号，并且通过使用作为构成压缩图像信号的像素之一的显着像素的相邻像素来形成多个图案的预测像素。从预测像素的多个模式中的每一个预测原始图像信号和预定预测系数，并输出关于多个图案的预测像素的各个预测值。针对原始图像信号计算预测像素的多个模式的每个预测值的预测误差，并且在多个预测模式中计算与获得最小预测误差的预测像素对应的模式码像素，附加到显着像素的像素值。

90. 发明授权

US6129203A IC discarding apparatus for flip chip mounting facility 失效
标题翻译：用于倒装芯片安装设备的IC废弃设备
公开(公告)号：US6129203A
公开(公告)日：2000-10-10
申请号：US29391
申请日：1998-02-27
申请人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
发明人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
IPC分类号： H01L21/60 , H05K13/04 , H05K13/08 , B65G23/00
CPC分类号： H05K13/0486
摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.
摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除连续排列而不会在表面上划伤而不会导致静电破坏。此外，该器件允许容易地目视检查IC的目的是重新使用。该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1）从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

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