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81. 发明申请

US20080047341A1 Thermal Gas Flow Sensor and Control Device for Internal-Combustion Engine Using the Same 失效
标题翻译：用于内燃机的热气流量传感器和控制装置
公开(公告)号：US20080047341A1
公开(公告)日：2008-02-28
申请号：US11781569
申请日：2007-07-23
申请人： Yasuhiro KANAMARU , Keiji Hanzawa
发明人： Yasuhiro KANAMARU , Keiji Hanzawa
IPC分类号： G01F1/692
CPC分类号： G01F1/6845 , G01F1/688 , G01F15/006
摘要： An object of the invention is to realize a thermal gas flow sensor capable of reducing time fluctuation of a heating resistor. A heating resistor 3 and thermometric resistors 4 and 14 are formed on a surface of a thin-wall portion 2. Electrode drawn wires 18 to 23 and pad portions 8 to 13 are formed so as to draw signal lines from the heating resistor 3 and the thermometric resistors 4 and 14. Contact portions 24 to 29 are formed to come in contact with the heating resistor 3, the thermometric resistors 4 and 14, and the electrode drawn wires 18 to 23. The heating resistor 3 and the thermometric resistors 4 and 14 are covered with protective films 30a, 30b, and 31a and insulating films 31b and 30c. The protective films 31a and 31b are formed of a dense film formed of nitride or the like. A part coming in contact with a drawn wire portion 34 and the heating resistor 3 is covered with a contact barrier metal film 36 (titanium-based electrical conductor such as titanium nitride, titanium tungsten, and titanium). The titanium-based electrical conductor is a dense film and resistant to hydrogen. Therefore, it is possible to reduce a time fluctuation of the heating resistor.
摘要翻译：本发明的目的是实现能够减少加热电阻器的时间波动的热气流量传感器。在薄壁部分2的表面上形成一个加热电阻器3和测温电阻器4和14。形成电极拉丝18〜23以及焊盘部8〜13，从加热电阻体3和测温电阻体4,14取出信号线。形成接触部分24至29与加热电阻器3，测温电阻器4和14以及电极拉丝18至23接触。加热电阻器3和温度测量电阻器4和14被保护膜30a，30b和31a以及绝缘膜31b和30c覆盖。保护膜31a和31b由氮化物等形成的致密膜形成。与拉丝部分34和加热电阻器3接触的部分被接触阻挡金属膜36（钛基电导体，例如氮化钛，钛钨和钛）覆盖。钛基电导体是致密膜并且耐氢。因此，可以减少加热电阻器的时间波动。

82. 发明授权

US09784605B2 Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench 有权
公开(公告)号：US09784605B2
公开(公告)日：2017-10-10
申请号：US14407730
申请日：2012-06-15
申请人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
发明人： Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Takeshi Morino , Ryosuke Doi , Akira Uenodan
IPC分类号： G01F1/68 , G01F1/684 , G01F1/696 , G01F15/14
CPC分类号： G01F1/684 , G01F1/6842 , G01F1/6845 , G01F1/6965 , G01F15/14
摘要： The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

83. 发明授权

US08640538B2 Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same 有权
标题翻译：流量传感器及其制造方法和流量传感器模块及其制造方法相同
公开(公告)号：US08640538B2
公开(公告)日：2014-02-04
申请号：US13393155
申请日：2011-09-13
申请人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
发明人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
IPC分类号： G01F1/68
CPC分类号： G01F1/383 , G01F1/34 , G01F1/6845 , G01F1/692 , G01F1/698 , G01F5/00 , H01L2224/48227 , H01L2224/73265 , H01L2924/10157 , H01L2924/15151 , H01L2924/15153
摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
摘要翻译：提供了抑制每个流量传感器的性能变化的技术。在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

84. 发明申请

US20130192388A1 Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 有权
标题翻译：流量传感器及其制造方法及其流程传感器模块及其制造方法
公开(公告)号：US20130192388A1
公开(公告)日：2013-08-01
申请号：US13393155
申请日：2011-09-13
申请人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
发明人： Tsutomu Kono , Keiji Hanzawa , Takeshi Morino , Yuki Okamoto , Noboru Tokuyasu , Shinobu Tashiro
IPC分类号： G01F1/34
CPC分类号： G01F1/383 , G01F1/34 , G01F1/6845 , G01F1/692 , G01F1/698 , G01F5/00 , H01L2224/48227 , H01L2224/73265 , H01L2924/10157 , H01L2924/15151 , H01L2924/15153
摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
摘要翻译：提供了抑制每个流量传感器的性能变化的技术。在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

85. 外观设计

USD674303S1 Physical amount sensor for air 有权
公开(公告)号：USD674303S1
公开(公告)日：2013-01-15
申请号：US29411773
申请日：2012-01-26
申请人： Takayuki Saito , Keiji Hanzawa , Takayuki Yogo
设计人： Takayuki Saito , Keiji Hanzawa , Takayuki Yogo

86. 发明申请

US20110072897A1 Heating Resistance Type Air Flow Rate Measuring Device 审中-公开
标题翻译：加热电阻型空气流量测量装置
公开(公告)号：US20110072897A1
公开(公告)日：2011-03-31
申请号：US12829105
申请日：2010-07-01
申请人： Rintaro MINAMITANI , Keiji Hanzawa , Akio Yasukawa , Yasuo Onose
发明人： Rintaro MINAMITANI , Keiji Hanzawa , Akio Yasukawa , Yasuo Onose
IPC分类号： G01F1/692
CPC分类号： G01F1/692 , G01F1/6845 , G01F15/006 , G01F15/12
摘要： A temperature of the heating resistor is set at a temperature equal to or higher than a temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Alternatively, when a heating resistance type air flow rate measuring device starts to operate or stops operating, the temperature of the heating resistor may be set at a temperature equal to or higher than the temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Moreover, a water-repellent and oil-repellent protective coating may be provided on the surface of the heating resistor.
摘要翻译：加热电阻器的温度被设定为等于或高于与加热电阻器的表面接触的液滴蒸发并通过薄膜沸腾而消失的温度。或者，当加热电阻型空气流量测量装置开始运行或停止运行时，加热电阻器的温度可以设定在等于或高于液滴接触加热电阻器的表面的温度通过薄膜沸腾蒸发并消失。此外，可以在加热电阻器的表面上设置防水和防油涂层。

87. 发明授权

US07472591B2 Thermal gas flow and control device for internal-combustion engine using the same 失效
标题翻译：内燃机用热气流量控制装置
公开(公告)号：US07472591B2
公开(公告)日：2009-01-06
申请号：US11781569
申请日：2007-07-23
申请人： Yasuhiro Kanamaru , Keiji Hanzawa
发明人： Yasuhiro Kanamaru , Keiji Hanzawa
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/688 , G01F15/006
摘要： An object of the invention is to realize a thermal gas flow sensor capable of reducing time fluctuation of a heating resistor. A heating resistor 3 and thermometric resistors 4 and 14 are formed on a surface of a thin-wall portion 2. Electrode drawn wires 18 to 23 and pad portions 8 to 13 are formed so as to draw signal lines from the heating resistor 3 and the thermometric resistors 4 and 14. Contact portions 24 to 29 are formed to come in contact with the heating resistor 3, the thermometric resistors 4 and 14, and the electrode drawn wires 18 to 23. The heating resistor 3 and the thermometric resistors 4 and 14 are covered with protective films 30a, 30b, and 31a and insulating films 31b and 30c. The protective films 31a and 31b are formed of a dense film formed of nitride or the like. A part coming in contact with a drawn wire portion 34 and the heating resistor 3 is covered with a contact barrier metal film 36 (titanium-based electrical conductor such as titanium nitride, titanium tungsten, and titanium). The titanium-based electrical conductor is a dense film and resistant to hydrogen. Therefore, it is possible to reduce a time fluctuation of the heating resistor.
摘要翻译：本发明的目的是实现能够减少加热电阻器的时间波动的热气流量传感器。在薄壁部分2的表面上形成加热电阻器3和温度测量电阻器4和14.形成电极拉丝18至23和焊盘部分8至13，以便从加热电阻器3和形成温度计电阻器4和14.接触部分24至29与加热电阻器3，测温电阻器4和14以及电极拉丝18至23接触。加热电阻器3和测温电阻器4和14 覆盖有保护膜30a，30b和31a以及绝缘膜31b和30c。保护膜31a和31b由氮化物等形成的致密膜形成。与拉丝部分34和加热电阻器3接触的部分被接触阻挡金属膜36（钛基电导体，例如氮化钛，钛钨和钛）覆盖。钛基电导体是致密膜并且耐氢。因此，可以减少加热电阻器的时间波动。

88. 发明申请

US20050072225A1 Thermal flow meter and control system 有权
标题翻译：热流量计和控制系统
公开(公告)号：US20050072225A1
公开(公告)日：2005-04-07
申请号：US10953608
申请日：2004-09-30
申请人： Atsushi Kanke , Izumi Watanabe , Keiji Hanzawa
发明人： Atsushi Kanke , Izumi Watanabe , Keiji Hanzawa
IPC分类号： G01F1/698 , G01F1/68 , G01F1/684 , G01F1/696 , F01P7/14
CPC分类号： G01F1/696 , G01F1/6845
摘要： In regard to an output of an intake flow meter for an internal combustion engine, a pulsation error can be reduced and dispersion in correction at the time of correction of response delay (a recovering of response delay) is reduced. A digital device is used for pre-processing of a control unit for inputting a flow rate measuring signal. An output voltage of the flow sensor is converted into a digital value, the digital value is converted into a flow rate and adds a response delay. The control unit detects a degree of response delay in reference to dispersion in a clock signal so as to perform response delay recovering and reduce dispersion of the response delay.
摘要翻译：关于用于内燃机的进气流量计的输出，可以减小脉动误差，并且在响应延迟校正时（响应延迟的恢复）减小时的校正偏差。数字装置用于预处理用于输入流量测量信号的控制单元。流量传感器的输出电压被转换为数字值，数字值被转换为流量并增加响应延迟。控制单元根据时钟信号中的色散来检测响应延迟的程度，以便执行响应延迟恢复并减少响应延迟的偏差。

89. 发明申请

US20140284753A1 Thermal Air Flow Sensor 有权
标题翻译：热空气流量传感器
公开(公告)号：US20140284753A1
公开(公告)日：2014-09-25
申请号：US14355104
申请日：2011-11-28
申请人： Norio Ishitsuka , Keiji Hanzawa , Yasuo Onose , Noriyuki Sakuma
发明人： Norio Ishitsuka , Keiji Hanzawa , Yasuo Onose , Noriyuki Sakuma
IPC分类号： G01F1/69
CPC分类号： G01F1/69 , G01F1/692
摘要： A thermal air flow sensor that produces less measurement error is provided. The thermal air flow sensor includes: a semiconductor substrate; a heating resistor, resistance temperature detectors, and an electrical insulator that includes a silicon oxide film, wherein the heating resistor, the resistance temperature detectors, and the electrical insulator are formed on the semiconductor substrate; and a diaphragm portion formed by removing a portion of the semiconductor substrate. The heating resistor and the resistance temperature detectors are formed on the diaphragm portion. The thermal air flow sensor further includes a silicon nitride film formed as the electrical insulator above the heating resistor and the resistance temperature detectors. The silicon nitride film has steps conforming to the patterns of the heating resistor and the resistance temperature detectors. The silicon nitride film has a multilayer structure.
摘要翻译：提供了产生较少测量误差的热空气流量传感器。热空气流量传感器包括：半导体衬底; 加热电阻器，电阻温度检测器和包括氧化硅膜的电绝缘体，其中在半导体衬底上形成有加热电阻器，电阻温度检测器和电绝缘体; 以及通过去除半导体衬底的一部分而形成的膜片部分。加热电阻器和电阻温度检测器形成在隔膜部分上。热空气流量传感器还包括形成为加热电阻器上方的电绝缘体的电阻温度检测器的氮化硅膜。氮化硅膜具有符合加热电阻器和电阻温度检测器的图案的步骤。氮化硅膜具有多层结构。

90. 发明申请

US20140216146A1 AIR PHYSICAL QUANTITY SENSING DEVICE 审中-公开
标题翻译：空气物理量传感装置
公开(公告)号：US20140216146A1
公开(公告)日：2014-08-07
申请号：US14240946
申请日：2012-07-31
申请人： Takayuki Yogo , Takayuki Saito , Keiji Hanzawa
发明人： Takayuki Yogo , Takayuki Saito , Keiji Hanzawa
IPC分类号： F02M35/10
CPC分类号： F02M35/10373 , F02D41/187 , F02M35/10393 , G01F1/684 , G01F15/14
摘要： To prevent dew condensation on a sensor element, an air physical quantity sensing device which has a housing structural component integrally provided with a connector and a connector terminal member that perform input and output with the outside, an electronic circuit board mounted on the housing structural component, and an air physical quantity sensing element provided on the electronic circuit board and capable of detecting physical quantity of air. The housing structural component formed with a communication hole which allows the inside and outside of the main air flow passage to communicate with each other. The electronic circuit board has the communication hole separated into two and the surface on the side where the air physical quantity sensing element is provided faces the main air flow passage side.
摘要翻译：为了防止传感器元件上的结露，具有一体地设置有连接器的壳体结构部件和与外部进行输入和输出的连接器端子部件的空气物理量检测装置，安装在壳体结构部件上的电子电路板以及设置在电子电路板上并且能够检测空气的物理量的空气物理量感测元件。壳体结构部件形成有连通孔，其允许主空气流动通道的内部和外部彼此连通。电子电路板具有分离为两个的连通孔，并且设置有空气物理感测元件的一侧的表面面向主空气流动通道侧。

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