会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 86. 发明授权
    • Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereof
    • 将易失性和非易失性存储单元集成在同一衬底上的方法及其半导体存储器件
    • US06670234B2
    • 2003-12-30
    • US09887403
    • 2001-06-22
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • H01L2100
    • H01L27/11526H01L27/105H01L27/1052H01L27/10861H01L27/10894H01L27/11546
    • A method for fabricating DRAM and flash memory cells on a single chip includes providing a silicon substrate, forming a trench capacitor for each of the DRAM cells in the silicon substrate, forming isolation regions in the silicon substrate which are electrically isolated from each other, forming first type wells for DRAM and flash memory cells at first predetermined regions of the silicon substrate by implanting a first type impurity in the first predetermined regions, forming second type wells for DRAM and flash memory cells at second predetermined regions in the first type wells by implanting a second type impurity in the second predetermined regions, forming oxide layers for DRAM and flash memory cells on the second type wells, forming gate electrodes for DRAM and flash memory cells on the oxide layers for DRAM and flash memory cells, and forming source and drain regions for DRAM and flash memory cells in the respective second type wells for DRAM and flash memory cells, in which the source and drain regions are associated with each of the gate electrodes for DRAM and flash memory cells.
    • 在单个芯片上制造DRAM和闪存单元的方法包括提供硅衬底,为硅衬底中的每个DRAM单元形成沟槽电容器,形成硅衬底中彼此电隔离的隔离区域,形成 通过在第一预定区域中注入第一种类型的杂质,在第一种类型的阱中的第二预定区域形成用于DRAM和闪速存储单元的第二类型阱,通过植入 在第二预定区域中形成第二类型杂质,在第二类型阱上形成用于DRAM和闪存单元的氧化物层,在DRAM和闪存单元的氧化物层上形成用于DRAM的闪存存储单元的栅电极,以及形成源极和漏极 用于DRAM和闪速存储器单元的相应的第二类型阱中的用于DRAM和闪存单元的区域 e源极和漏极区域与用于DRAM和闪存单元的每个栅电极相关联。
    • 88. 发明授权
    • Patterning microelectronic features without using photoresists
    • 图案化微电子特征,而不使用光致抗蚀剂
    • US06452110B1
    • 2002-09-17
    • US09897889
    • 2001-07-05
    • Lawrence A. ClevengerLouis L. HsuCarl J. RadensLi-Kong WangKeith Kwong Hon Wong
    • Lawrence A. ClevengerLouis L. HsuCarl J. RadensLi-Kong WangKeith Kwong Hon Wong
    • H05K109
    • H05K3/02H01L21/288H01L21/32134H01L21/76885Y10T29/49155Y10T29/49156
    • A method and structure for producing metallic polymer conductor lines comprising of an alternative methodology to a traditional damascene approach, called a cloisonne or inverse damascene approach. The cloisonne approach comprises the steps of coating a photosensitive polymer such as pyrrole or aniline with a silver salt on a semiconductor substrate. Using standard photolithography and resist developing techniques, the conducting polymer is exposed to a wet chemical developer, removing a portion of the exposed conducting polymer region, leaving only conducting polymer lines on top of the substrate. Next, an insulating dielectric layer is deposited over the entire structure and a chemical mechanical polish planarization of the insulator is performed creating the conducting polymer lines. Included in another aspect of the invention is a method and structure for a self-planarizing interconnect material comprising a conductive polymer thereby reducing the number of processing steps relative to the prior art.
    • 一种用于生产金属聚合物导体线的方法和结构,其包括传统大马士革方法的替代方法,称为景泰蓝或逆大马士革方法。 景泰蓝方法包括在半导体衬底上用银盐将光敏聚合物如吡咯或苯胺涂覆的步骤。 使用标准光刻和抗蚀显影技术,将导电聚合物暴露于湿化学显影剂,除去暴露的导电聚合物区域的一部分,仅在基底顶部留下导电聚合物线。 接下来,在整个结构上沉积绝缘电介质层,并进行绝缘体的化学机械抛光平面化,产生导电聚合物线。 包括在本发明的另一方面中的是一种用于自平坦化互连材料的方法和结构,其包括导电聚合物,从而减少相对于现有技术的加工步骤的数量。