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    • 85. 发明授权
    • Poly(trimethylene terephthalate) modified cross-section yarn
    • 聚(对苯二甲酸丙二醇酯)改性横截面纱
    • US06620505B1
    • 2003-09-16
    • US10069373
    • 2002-02-25
    • Takao AbeYoichiro AzumaTadashi Koyanagi
    • Takao AbeYoichiro AzumaTadashi Koyanagi
    • D01F600
    • D01F6/62D01D5/253Y10T428/2913Y10T428/2969Y10T428/2973
    • The present invention is to provide a polytrimethylene terephthalate fiber having a trilobal type modified cross-section, composed of 95 mol % or more of trimethylene terephthalate repeating units and 5 mol % or less of other ester repeating units to have an intrinsic viscosity in a range from 0.7 to 1.3 (dl/g), wherein the outer periphery of the trilobal type cross-section consists of outwardly convex sections or of outwardly convex section and straight sections. According to the inventive method, it is possible to produce the above-mentioned fiber of the modified cross-section in an industrially stable manner while minimizing the adhesion of polymer scum to the spinning orifice or the contamination thereof to suppress the generation of fluff or yarn breakage.
    • 本发明提供一种具有三叶形改性截面的聚对苯二甲酸丙二醇酯纤维,其组成为95摩尔%以上的三亚甲基对苯二甲酸酯重复单元和5摩尔%以下的其它酯重复单元,其特性粘度在一定范围内 从0.7到1.3(dl / g),其中三叶形横截面的外周由向外的凸部或向外凸的部分和直的部分组成。 根据本发明的方法,可以以工业上稳定的方式制造上述改性截面的纤维,同时最小化聚合物浮渣对纺丝孔的粘附或其污染,以抑制绒毛或纱线的产生 破损。
    • 86. 发明授权
    • Production method for silicon wafer and silicon wafer
    • 硅晶片和硅晶片的生产方法
    • US06544656B1
    • 2003-04-08
    • US09674841
    • 2000-11-07
    • Takao AbeKen AiharaShoji AkiyamaTetsuya IgarashiWeifeng QuYoshinori HayamizuShigeru Saito
    • Takao AbeKen AiharaShoji AkiyamaTetsuya IgarashiWeifeng QuYoshinori HayamizuShigeru Saito
    • C30B2906
    • C30B29/06C30B15/00H01L21/3225Y10T428/21
    • A silicon wafer is produced by growing a silicon single crystal ingot having a resistivity of 100 &OHgr;·cm or more and an initial interstitial oxygen concentration of 10 to 25 ppma by the Czochralski method, processing the silicon single crystal ingot into a wafer, and subjecting the wafer to an oxygen precipitation heat treatment so that a residual interstitial oxygen concentration in the wafer should become 8 ppma or less. A silicon wafer produced as described above shows little decrease in resistivity even after a heat treatment in device production etc. Further, if a silicon wafer is produced and heat-treated so that the wafer should have the above-defined initial interstitial oxygen concentration and residual interstitial oxygen concentration, slip dislocations in a subsequent heat treatment process are prevented irrespective of resistivity. Furthermore, by forming an epitaxial layer on a surface of a silicon wafer of the present invention, a high resistivity epitaxial wafer can be produced, which is free from slip dislocations etc. and can be used for various devices.
    • 通过使用Czochralski法生长电阻率为100欧姆·厘米或更高的初始间隙氧浓度为10〜25ppma的硅单晶锭,将硅单晶锭加工成晶片,生产硅晶片, 晶片进行氧析出热处理,使得晶片中的残留间隙氧浓度应变为8ppma以下。 如上所述制造的硅晶片即使在器件制造等中进行热处理之后也几乎没有电阻降低。此外,如果制造硅晶片并进行热处理,使得晶片应具有上述初始间隙氧浓度和残留量 间隙氧浓度,随后的热处理过程中的滑移位错被阻止,而与电阻率无关。 此外,通过在本发明的硅晶片的表面上形成外延层,可以制造不含滑移位错等的高电阻率外延晶片,并可用于各种器件。
    • 87. 发明授权
    • Digital signal processing apparatus
    • 数字信号处理装置
    • US06473822B1
    • 2002-10-29
    • US09309433
    • 1999-05-11
    • Akira NakamatsuTakao AbeNobuo Nakamura
    • Akira NakamatsuTakao AbeNobuo Nakamura
    • G06F1300
    • H04N21/4143H04N7/24
    • A digital signal processing apparatus for processing a plurality of video signals and a plurality of audio signals is provided, and comprises a computer comprising a system bus and a main CPU connected to the system bus and an extension processor comprising a plurality of signal processing circuits for processing the plurality of video signals and/or the plurality of audio signals, and a local CPU for controlling the plurality of signal processing circuits so as to allow for the processing of the video signals and audio signals in real time. The extension processor further comprises an extension system bus extended from the system bus, a digital audio video (DAV) bus for transmitting the plurality of video signals and the plurality of audio signals between the plurality of signal processing circuits and a local CPU bus for transmitting control signals outputted from the local CPU. Each processing circuit has a common interface which is capable of being connected to the extension system bus, the DAV bus and the local CPU bus in any position, thereby allowing for the processing of the video signals and audio signals regardless of the mounting positions of the processing circuits.
    • 提供了一种用于处理多个视频信号和多个音频信号的数字信号处理装置,包括一个计算机,该计算机包括连接到系统总线的系统总线和主CPU,以及一个扩展处理器,包括多个信号处理电路, 处理多个视频信号和/或多个音频信号;以及本地CPU,用于控制多个信号处理电路,以便实时地处理视频信号和音频信号。 扩展处理器还包括从系统总线延伸的扩展系统总线,用于在多个信号处理电路之间传输多个视频信号和多个音频信号的数字音频视频(DAV)总线和用于发送的本地CPU总线 从本地CPU输出的控制信号。 每个处理电路具有能够连接到扩展系统总线,DAV总线和本地CPU总线在任何位置的公共接口,从而允许对视频信号和音频信号的处理,而不管安装位置如何 处理电路。
    • 89. 发明授权
    • Method of manufacturing silicon monocrystal, and seed crystal used in
the method
    • 制造硅单晶的方法和用于该方法的晶种
    • US5911822A
    • 1999-06-15
    • US7614
    • 1998-01-15
    • Takao AbeMasanori Kimura
    • Takao AbeMasanori Kimura
    • C30B15/00C30B15/36C30B29/06H01L21/208C30B15/32
    • C30B29/06C30B15/36Y10S117/911
    • In a method of manufacturing a silicon monocrystal using the Czochralski method, there is used a seed crystal whose tip end has a sharp-pointed shape or a truncation thereof. The tip end of the seed crystal is gently brought into contact with the silicon melt, and the seed crystal is then lowered at a low speed in order to melt the tip end portion of the seed crystal until the size of the tip portion increases to a desired value. Subsequently, the seed crystal is slowly pulled upwardly in order to grow a silicon monocrystalline ingot having a desired diameter without performing necking operation. This method enables a heavy silicon monocrystal to be pulled quite simply without performance of necking operation, while eliminating the necessity of using a complicated apparatus such as a crystal holding mechanism.
    • 在使用Czochralski法制造硅单晶的方法中,使用尖端具有尖锐形状或截短的晶种。 晶种的尖端与硅熔体轻轻地接触,然后以低速将晶种降低,以熔化晶种的末端部分,直到尖端部分的尺寸增加到 所需值。 随后,将晶种向上缓慢地向上拉,以便生长具有期望直径的硅单晶锭,而不进行颈缩操作。 这种方法使得重硅单晶可以非常简单地拉伸而不进行颈缩操作,而不需要使用诸如晶体保持机构的复杂装置。