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    • 83. 发明申请
    • PERMANENT MAGNET ELECTRIC MOTOR
    • 永磁电机
    • US20110175478A1
    • 2011-07-21
    • US13000227
    • 2009-06-19
    • Kazuto SakaiYutaka HashibaYosuke OtsuboYusuke MatsuokaNorio TakahashiTadashi Tokumasu
    • Kazuto SakaiYutaka HashibaYosuke OtsuboYusuke MatsuokaNorio TakahashiTadashi Tokumasu
    • H02K21/12
    • H02K1/2766H02K21/028H02K21/04
    • An increase of the magnetization current can be restrained during demagnetization and magnetization, and a variable speed operation can be achieved at a high power output over a wide range of from a low speed to a high speed. A rotor 1 is configured by a rotor core 2, permanent magnets 3 having a small value as the product of the coercivity and the thickness in the magnetization direction thereof, and permanent magnets 4 having a large value as the product. When reducing a flux linkage of the permanent magnets 3, a magnetic field directed to the reverse direction of the magnetization direction of the permanent magnets 3 due to a current of an armature coil is caused to act on them. When increasing a flux linkage of the permanent magnets 3, a magnetic field directed to the same direction as the magnetization direction of the permanent magnets 3 due to a current of an armature coil is caused to act on them. A short circuit coil 8 is located in a magnetic path part of each permanent magnet 4 other than the permanent magnets 3. A magnetic field due to a magnetization current induces an induced current to generate a magnetic field on the periphery of the short circuit coil 8. The generated magnetic field and the magnetization current generate a magnetic field to magnetize the permanent magnets 3.
    • 在退磁和磁化期间可以抑制磁化电流的增加,并且可以在从低速到高速的宽范围内的高功率输出下实现可变速度操作。 转子1由转子铁心2构成,永久磁铁3的矫顽力与其磁化方向的厚度的乘积小,永久磁铁4的值大的值为乘积。 当减少永久磁铁3的磁链时,导致由于电枢线圈的电流而导致永久磁铁3的磁化方向的相反方向的磁场作用于它们。 当增加永磁体3的磁通量时,引起由于电枢线圈的电流而导致与永磁体3的磁化方向相同方向的磁场的作用。 短路线圈8位于永磁体3以外的永久磁铁4的磁路部分。由于磁化电流而产生的磁场引起感应电流,从而在短路线圈8的周围产生磁场 所产生的磁场和磁化电流产生磁场以磁化永磁体3。
    • 84. 发明申请
    • SPRING PRODUCT MANUFACTURING LINE
    • 弹簧制品生产线
    • US20100212134A1
    • 2010-08-26
    • US12678604
    • 2008-09-18
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • Kazuhiro KohnoYasuhiro AdachiHiroki WatanabeNorio Takahashi
    • B21B15/00
    • B21D11/10
    • The invention provides a spring product manufacturing line comprising: a manufacturing area 2 at which a formation device 50 attached to a base mount 52 plastically processes a spring material into a spring product; a formation device switching area 3 at which one formation device 50 is removed from the mount 52 and switched with another forming device 50; and a formation device transport line 4 that conveys a formation device 50 attached to a base mount 52 at the device switching area 3 to a manufacturing area 2; wherein the formation device 50 is provided with a plurality of formation units 54 that perform a bending process on the spring material by fluid pressure; the base mount 52 is provided with a pressure fluid line 62 that supplies pressure fluid to the formation units 54 provided at the formation device 50, and that is removably connected to each of the formation units 54; and the attachment or removal of the pressure fluid line 62 with respect to the formation device 50 is performed at the device switching area 3.
    • 本发明提供了一种弹簧制品生产线,包括:制造区域2,附接到基座52的成形装置50将弹簧材料塑性地加工成弹簧产品; 形成装置切换区域3,其中一个形成装置50从安装件52移除并与另一成形装置50切换; 以及将装置切换区域3上安装有基座52的地层装置50输送到制造区域2的地层装置输送路线4; 其中,形成装置50设置有多个形成单元54,其通过流体压力对弹簧材料进行弯曲加工; 基座52设置有压力流体管线62,其将压力流体供应到设置在形成装置50处的形成单元54,并且可移除地连接到每个形成单元54; 并且在设备切换区域3处执行压力流体管线62相对于形成装置50的附接或移除。
    • 88. 发明申请
    • Fluid temperature control device
    • 流体温度控制装置
    • US20080212642A1
    • 2008-09-04
    • US12011296
    • 2008-01-25
    • Norio Takahashi
    • Norio Takahashi
    • G01K13/02
    • G05D23/1919H01L21/67109
    • A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.
    • 一种流体温度控制装置,包括:具有形成在其表面中的通道的主体块; 导热板,设置在主体块的表面上,并且覆盖通道以形成用于使待温度控制的流体通过的通道; 温度控制装置,其通过导热板进行热交换(加热/冷却),流体通过通道,其中与导热板相邻的通道连接流体入口和形成的流体出口 在主体块中,并且是具有在其整个长度上具有近似恒定的通道横截面面积的单个通道。
    • 89. 发明授权
    • Semiconductor chip package and manufacturing method thereof
    • 半导体芯片封装及其制造方法
    • US07294927B2
    • 2007-11-13
    • US11387690
    • 2006-03-24
    • Norio Takahashi
    • Norio Takahashi
    • H01L23/34
    • B81C1/0023B81C2203/0154H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/1461H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
    • An acceleration sensor chip package comprises a frame section, a first semiconductor chip corresponding to an MEMS chip having a plurality of first bumps, a second semiconductor chip having a plurality of second bumps, a substrate on which the first and second semiconductor chips are mounted in parallel with each other and which has a plurality of electrode pads directly connected to the first or second bumps in opposing relationship to the first or second bumps, and external terminals respectively connected to the electrode pads, a closed ring-shaped first sealing section which seals a space defined between the frame section and the substrate so as to surround arrangements of the plurality of first bumps, and a second sealing section which covers the first semiconductor chip, the second semiconductor chip and the first sealing section to seal them.
    • 加速度传感器芯片封装包括框架部分,对应于具有多个第一凸块的MEMS芯片的第一半导体芯片,具有多个第二凸块的第二半导体芯片,安装有第一和第二半导体芯片的基板 彼此平行并且具有与第一或第二凸起相对的第一或第二凸块直接连接的多个电极焊盘以及分别连接到电极焊盘的外部端子,密封的环状的第一密封部分 限定在所述框架部分和所述基板之间以围绕所述多个第一凸块的布置的空间;以及覆盖所述第一半导体芯片,所述第二半导体芯片和所述第一密封部分以将其密封的第二密封部。