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    • 87. 发明授权
    • Nitride-based semiconductor element and method of forming nitride-based semiconductor
    • 基于氮化物的半导体元件和形成氮化物基半导体的方法
    • US07829900B2
    • 2010-11-09
    • US12071978
    • 2008-02-28
    • Masayuki HataTatsuya KunisatoNobuhiko Hayashi
    • Masayuki HataTatsuya KunisatoNobuhiko Hayashi
    • H01L27/15
    • B82Y20/00H01L21/0237H01L21/02378H01L21/02381H01L21/0242H01L21/02433H01L21/0254H01L21/02576H01L21/02639H01L21/02647H01L33/007H01S5/0207H01S5/22H01S5/2214H01S5/227H01S5/34333H01S2304/12
    • A nitride-based semiconductor element having superior mass productivity and excellent element characteristics is obtained. This nitride-based semiconductor element comprises a substrate comprising a surface having projection portions, a mask layer formed to be in contact with only the projection portions of the surface of the substrate, a first nitride-based semiconductor layer formed on recess portions of the substrate and the mask layer and a nitride-based semiconductor element layer, formed on the first nitride-based semiconductor layer, having an element region. Thus, the first nitride-based semiconductor layer having low dislocation density is readily formed on the projection portions of the substrate and the mask layer through the mask layer serving for selective growth. When the nitride-based semiconductor element layer having the element region is grown on the first nitride-based semiconductor layer having low dislocation density, a nitride-based semiconductor element having excellent element characteristics can be readily obtained. The first nitride-based semiconductor layer is formed through only single growth on the substrate, whereby a nitride-based semiconductor element having excellent mass productivity is obtained.
    • 获得具有优异的质量生产率和优异的元件特性的氮化物基半导体元件。 该氮化物系半导体元件包括基板,该基板包括具有突出部的表面,形成为仅与基板的表面的突出部接触的掩模层,形成在基板的凹部的第一氮化物系半导体层 以及形成在具有元件区域的第一氮化物系半导体层上的掩模层和氮化物系半导体元件层。 因此,具有低位错密度的第一氮化物基半导体层通过用于选择生长的掩模层容易地形成在衬底和掩模层的突出部分上。 当在具有低位错密度的第一氮化物基半导体层上生长具有元素区域的氮化物基半导体元件层时,可以容易地获得具有优异元素特性的氮化物基半导体元件。 第一氮化物基半导体层仅通过基板上的单一生长形成,从而获得具有优异的批量生产率的氮化物基半导体元件。
    • 88. 发明申请
    • SEMICONDUCTOR LASER APPARATUS AND METHOD OF MANUFACTURING THE SAME
    • 半导体激光装置及其制造方法
    • US20090097523A1
    • 2009-04-16
    • US12333764
    • 2008-12-12
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • H01S5/00
    • H01S5/4025H01S5/4087
    • Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
    • 第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。 第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。 焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。 红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上,其中夹有相应的焊料膜。 红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上,其中夹有相应的焊料膜。 第二和第三p侧焊盘电极彼此分开地形成,使得第四和第五p侧焊盘电极彼此电隔离。