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    • 1. 发明授权
    • Semiconductor laser device and method of manufacturing the same
    • 半导体激光器件及其制造方法
    • US07903709B2
    • 2011-03-08
    • US12357282
    • 2009-01-21
    • Ryoji HiroyamaDaijiro InoueYasuyuki BesshoMasayuki Hata
    • Ryoji HiroyamaDaijiro InoueYasuyuki BesshoMasayuki Hata
    • H01S5/00
    • H01S5/34333B82Y20/00H01S5/0201H01S5/0202H01S5/0203H01S5/0425H01S5/16H01S5/22H01S5/2201
    • A semiconductor laser device includes a substrate and a semiconductor layer formed on a surface of the substrate and having a waveguide extending in a first direction parallel to the surface, wherein the waveguide is formed on a region approaching a first side from a center of the semiconductor laser device in a second direction parallel to the surface and intersecting with the first direction, a first region separated from the waveguide on a side opposite to the first side of the waveguide and extending parallel to the first direction and a first recess portion separated from the waveguide on an extension of a facet of the waveguide, intersecting with the first region and extending in the second direction are formed on an upper surface of the semiconductor laser device, and a thickness of the semiconductor layer on the first region is smaller than a thickness of the semiconductor layer on a region other than the first region.
    • 半导体激光器件包括衬底和形成在衬底的表面上的半导体层,并且具有沿平行于表面的第一方向延伸的波导,其中波导形成在从半导体的中心接近第一侧的区域 激光装置在与第一方向平行的第二方向上与第一方向相交的第一区域,与波导的与波导的第一侧相反的一侧并且平行于第一方向延伸的第一凹部, 在半导体激光器件的上表面上形成有与第一区域交叉且沿第二方向延伸的波导的小平面的延伸的波导,并且第一区域上的半导体层的厚度小于厚度 的第一区域以外的区域。
    • 2. 发明授权
    • Semiconductor laser apparatus and fabrication method thereof
    • 半导体激光装置及其制造方法
    • US07773654B2
    • 2010-08-10
    • US11092947
    • 2005-03-30
    • Yasuyuki BesshoMasayuki HataDaijiro InoueTsutomu Yamaguchi
    • Yasuyuki BesshoMasayuki HataDaijiro InoueTsutomu Yamaguchi
    • H01S5/00
    • H01S5/4025H01L2224/32245H01L2224/48463H01L2224/73265H01S5/4087
    • A blue-violet semiconductor laser device has a first p-electrode formed on its upper surface and a first n-electrode formed on its lower surface. A red semiconductor laser device has a second n-electrode formed on its upper surface and a second p-electrode formed on its lower surface. An infrared semiconductor laser device has a third n-electrode formed on its upper surface and a third p-electrode formed on its lower surface. Solder films are partially formed on the upper surface of the first p-electrode in the blue-violet semiconductor laser device. Two of the solder films are formed with a predetermined distance between them on the upper surface of the first p-electrode. This results in a portion of the first p-electrode being exposed. The first, second and third p-electrodes of the blue-violet semiconductor laser device, red semiconductor laser device, and infrared semiconductor laser device are common electrodes.
    • 蓝紫色半导体激光器件具有在其上表面上形成的第一p电极和形成在其下表面上的第一n电极。 红色半导体激光器件具有在其上表面上形成的第二n电极和形成在其下表面上的第二p电极。 红外半导体激光器件具有在其上表面上形成的第三n电极和形成在其下表面上的第三p电极。 在蓝紫色半导体激光器件中的第一p电极的上表面部分地形成焊料膜。 两个焊料膜在第一p电极的上表面之间以它们之间的预定距离形成。 这导致第一p电极的一部分被暴露。 蓝紫色半导体激光器件的第一,第二和第三p电极,红色半导体激光器件和红外半导体激光器件是公共电极。
    • 6. 发明申请
    • SEMICONDUCTOR LASER APPARATUS AND METHOD OF MANUFACTURING THE SAME
    • 半导体激光装置及其制造方法
    • US20090097523A1
    • 2009-04-16
    • US12333764
    • 2008-12-12
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • H01S5/00
    • H01S5/4025H01S5/4087
    • Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
    • 第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。 第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。 焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。 红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上,其中夹有相应的焊料膜。 红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上,其中夹有相应的焊料膜。 第二和第三p侧焊盘电极彼此分开地形成,使得第四和第五p侧焊盘电极彼此电隔离。
    • 8. 发明申请
    • Semiconductor laser element and semiconductor laser device
    • 半导体激光元件和半导体激光器件
    • US20070274360A1
    • 2007-11-29
    • US11710922
    • 2007-02-27
    • Daijiro InoueYasuyuki BesshoMasayuki Hata
    • Daijiro InoueYasuyuki BesshoMasayuki Hata
    • H01S5/00
    • H01S5/2231H01S5/2223
    • A semiconductor laser element includes a semiconductor layer, an insulating layer and an electrode. The semiconductor layer is formed on a substrate, and includes a raised portion extending along a predetermined direction and flat portions provided on outer sides in a width direction of the raised portion. The insulating layer is formed on upper surfaces of the flat portions and side surfaces of the raised portion. The electrode includes a first portion provided along the predetermined direction on the raised portion and a second portion including a plurality of protruding portions protruding outward from the first portion in the width direction of the raised portion. A gap through which the insulating layer is exposed is provided between each adjacent two of the plurality of protruding portions.
    • 半导体激光元件包括半导体层,绝缘层和电极。 半导体层形成在基板上,并且包括沿着预定方向延伸的凸起部分和设置在凸起部分的宽度方向上的外侧的平坦部分。 绝缘层形成在凸起部分的平坦部分和侧表面的上表面上。 电极包括沿着预定方向设置在凸起部分上的第一部分和第二部分,其包括从凸起部分的宽度方向上的第一部分向外突出的多个突出部分。 在相邻的两个突出部分之间设置有绝缘层暴露的间隙。