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81. 发明申请

US20080110233A1 SUBSTRATE PROCESSING APPARATUS AND ANALYSIS METHOD THEREFOR 有权
标题翻译：基板加工设备及其分析方法
公开(公告)号：US20080110233A1
公开(公告)日：2008-05-15
申请号：US11931145
申请日：2007-10-31
申请人： Hideki Tanaka , Susumu Saito
发明人： Hideki Tanaka , Susumu Saito
IPC分类号： G12B13/00 , G01P21/00
CPC分类号： H01L22/26
摘要： An analysis method for a substrate processing apparatus capable of accurately detecting a state in a housing chamber. Emission intensities of processing gas before being introduced into the chamber and processing gas having passed therethrough are measured before an inter-chamber part is replaced. If an emission intensity measured after the replacement coincides with that measured before the replacement, an emission intensity of the processing gas having passed through the chamber is measured, and a variation between the emission intensities of the processing gas having passed through the chamber measured before and after the replacement is calculated. After start of plasma processing on wafers, an emission intensity of the processing gas having passed through the chamber is measured and the variation is removed therefrom to calculate an emission intensity really representing a state in the chamber, thus detecting an end point of plasma processing therefrom.
摘要翻译：一种能够精确地检测收纳室内的状态的基板处理装置的分析方法。在更换腔室间部分之前，测量在引入室内的处理气体的排放强度和处理通过其中的气体之前。如果在更换之后测量的发射强度与更换之前测量的发射强度一致，则测量已经通过室的处理气体的发射强度，并且测量了之前经过腔室的处理气体的发射强度之间的变化，更换后计算。在开始对晶片进行等离子体处理之后，测量已经通过室的处理气体的发射强度，并从其中去除变化，从而计算出真实表示室内状态的发射强度，从而检测等离子体处理的终点。

82. 发明申请

US20080097150A1 Medical image processing apparatus and medical image processing method 有权
标题翻译：医学图像处理设备及医学图像处理方法
公开(公告)号：US20080097150A1
公开(公告)日：2008-04-24
申请号：US11821898
申请日：2007-06-26
申请人： Jun Hasegawa , Hirokazu Nishimura , Hideki Tanaka , Ryoko Inoue
发明人： Jun Hasegawa , Hirokazu Nishimura , Hideki Tanaka , Ryoko Inoue
IPC分类号： A61B1/04 , A61B1/05
CPC分类号： G06T5/006 , A61B1/0005 , A61B1/042 , G06T3/00
摘要： An image conversion section performs geometric conversion on a medical image resulting from the pickup of a tubular part in vivo, and a developed-view output section outputs the converted image obtained by the image conversion section to a display device as an image of a developed view.
摘要翻译：图像转换部分对由体内的管状部件的拾取产生的医用图像执行几何转换，并且显影视图输出部分将由图像转换部分获得的转换图像作为显影视图的图像输出到显示装置。

83. 发明授权

US07330167B2 Method for driving a display panel 失效
标题翻译：驱动显示面板的方法
公开(公告)号：US07330167B2
公开(公告)日：2008-02-12
申请号：US10893219
申请日：2004-07-19
申请人： Kazuaki Sakata , Hideto Nakamura , Hideki Tanaka , Yoshichika Sato , Tsutomu Tokunaga , Mitsushi Kitagawa
发明人： Kazuaki Sakata , Hideto Nakamura , Hideki Tanaka , Yoshichika Sato , Tsutomu Tokunaga , Mitsushi Kitagawa
IPC分类号： G09G5/00
CPC分类号： G09G3/2965 , G09G3/2932 , G09G2330/025
摘要： In order to provide a method for driving a display panel capable of improving durability of a driving device for driving a display panel, when a scan pulse is applied in superposition with a base pulse to one of row electrodes of one row electrode pair among row electrode pairs while the base pulse is applied to one of the row electrodes of all the row electrode pairs in the display panel and a pixel data pulse corresponding to an image signal is applied to the row electrode at the same timing as that of the scan pulse to set discharge cells to either one of a light-on mode and a light-off mode, a change ratio of a voltage value in a fall period in the base pulse is smaller than a change ratio of a voltage value in a fall period in the scan pulse.
摘要翻译：为了提供一种用于驱动能够提高用于驱动显示面板的驱动装置的耐久性的显示面板的方法，当扫描脉冲以基本脉冲叠加施加到行电极中的一个行电极对的行电极中的一个同时将基本脉冲施加到显示面板中的所有行电极对的行电极中的一个并且与图像信号对应的像素数据脉冲以与扫描脉冲相同的定时施加到行电极，将放电单元设置为点亮模式和点亮模式中的任一种，基本脉冲的下降周期中的电压值的变化率小于在基准脉冲的下降周期中的电压值的变化率扫描脉冲。

84. 外观设计

USD553514S1 Time recorder 有权
公开(公告)号：USD553514S1
公开(公告)日：2007-10-23
申请号：US29265209
申请日：2006-08-28
申请人： Hideki Tanaka , Yoshikazu Jimenji
设计人： Hideki Tanaka , Yoshikazu Jimenji

85. 发明申请

US20070188174A1 NMR solenoidal coil for RF field homogeneity 有权
标题翻译：用于RF场均匀性的NMR螺线管线圈
公开(公告)号：US20070188174A1
公开(公告)日：2007-08-16
申请号：US11655208
申请日：2007-01-19
申请人： Hideki Tanaka , Tsuyoshi Wakuda
发明人： Hideki Tanaka , Tsuyoshi Wakuda
IPC分类号： G01V3/00
CPC分类号： G01R33/34046 , G01R33/34053 , G01R33/5659
摘要： An NMR signal acquisition device that can increase the magnetic field homogeneity in a high frequency magnetic field by one of the following. (a) Current paths each having a different inductance are provided to adjust the diversion ratio of the current, (b) A current path branch point is provided in an intermediate part of the winding of a solenoidal coil so that there are more current paths in the intermediate part of the winding than in the current paths connected to the feeding points at both ends, (c) The radiuses of current paths are adjusted, (d) Winding pitches in the axis direction are adjusted, (e) Current path widths are adjusted, and (f) The solenoidal coil has both positive direction current paths and negative direction current paths.
摘要翻译： NMR信号采集装置，其可以通过以下之一增加高频磁场中的磁场均匀性。（a）提供各自具有不同电感的电流路径以调节电流的转向比，（b）电流路径分支点设置在螺线管线圈的绕组的中间部分中，使得存在更多的电流路径（c）调整电流路径的半径，（d）调整轴向的绕组间距，（e）电流路径宽度为（f）螺线管线圈具有正向电流路径和负向电流路径。

86. 发明授权

US07234239B2 Hair removing device with a lotion applicator 失效
标题翻译：带洗剂涂抹器的脱毛装置
公开(公告)号：US07234239B2
公开(公告)日：2007-06-26
申请号：US10504166
申请日：2003-02-12
申请人： Atsuhiro Saito , Hirokazu Kato , Jyuzaemon Iwasaki , Hideki Tanaka , Koutarou Yanagi , Yasunori Ueda , Toshiyuki Tsushio , Masanobu Yamasaki , Youji Urano , Harunori Kitahara
发明人： Atsuhiro Saito , Hirokazu Kato , Jyuzaemon Iwasaki , Hideki Tanaka , Koutarou Yanagi , Yasunori Ueda , Toshiyuki Tsushio , Masanobu Yamasaki , Youji Urano , Harunori Kitahara
IPC分类号： B26B19/40
CPC分类号： A45D26/0028 , A45D34/041 , A45D2026/009 , A45D2026/0095 , B26B19/40
摘要： A hair removing device with a lotion applicator includes a housing, a hair removing head mounted to the housing and adapted to be held against a user's skin for hair depilation or hair epilation, an applicator which dispenses a lotion on the user's skin, a tank holding the lotion and a lotion supply mechanism for supplying the lotion from the tank to the applicator. The lotion supply mechanism includes a regulating device, which regulates an amount of the lotion being dispensed from the applicator. The lotion supply mechanism includes a powered pump for expelling the lotion from the tank to the applicator. The regulating device includes a handle for varying pump capacity of the powered pump. The applicator is incorporated into a head frame forming a part of the hair removing head with the head frame being detachable from the housing.
摘要翻译：具有洗剂涂抹器的脱毛装置包括外壳，头发去除头，其安装到外壳上并且适于被保持抵靠使用者的皮肤以进行毛发脱毛或脱毛，将使用者皮肤上的洗剂分配的涂抹器，洗剂和洗剂供应机构，用于将洗剂从罐供应到涂抹器。洗剂供给机构包括调节装置，其调节从涂抹器分配的洗剂量。洗剂供应机构包括用于将洗剂从罐排出到施用器的动力泵。调节装置包括用于改变动力泵的泵容量的手柄。所述施用器被结合到形成所述脱毛头的一部分的头部框架中，所述头部框架可与所述外壳分离。

87. 发明授权

US07201961B2 Coating film tape end structure 有权
标题翻译：涂膜胶带端面结构
公开(公告)号：US07201961B2
公开(公告)日：2007-04-10
申请号：US11181127
申请日：2005-07-14
申请人： Kenichi Narimatsu , Hideki Tanaka
发明人： Kenichi Narimatsu , Hideki Tanaka
IPC分类号： B32B7/12 , B32B15/04 , B65H37/00 , B44C7/00
CPC分类号： B65H37/007 , B65H2511/114 , Y10T156/1705 , Y10T156/1795 , Y10T428/28 , Y10T428/2848
摘要： In a the structure of end tape for revealing impending exhausting of a coating film tape supply, the end tape is connected to the core by a first single-sided adhesive tape, and to the coating film tape by a second single-sided adhesive tape, both adhesive tapes having a thickness of not more than 25μ. The thickness of the second single-sided adhesive tape is 20% to 70% of the total thickness of the adhered section where the second single-sided adhesive tape, the end tape and the coating film tape overlap, and at least 30% of the thickness of the adhered section where the second adhesive tape is adhered directly to the coating film tape. The thickness of the first adhesive tape is 30% to 70% of the total thickness of the adhered section, where the first adhesive tape and the end tape overlap.
摘要翻译：在用于揭示涂膜带供应的即将消耗的端带的结构中，端带通过第一单面胶带与芯连接，并通过第二单面胶带与涂膜带连接，两个胶带的厚度不超过25mu。第二单面胶带的厚度是第二单面胶带，端胶带和涂膜胶带重叠的粘合部分的总厚度的20％至70％，并且至少30％第二胶带直接粘附在涂膜带上的粘接部分的厚度。第一粘合带的厚度为第一胶带和端带重叠的粘合部的总厚度的30％至70％。

88. 发明授权

US07135246B2 Electronic apparatus having energy-saving cooling system 失效
标题翻译：具有节能冷却系统的电子设备
公开(公告)号：US07135246B2
公开(公告)日：2006-11-14
申请号：US10623530
申请日：2003-07-22
申请人： Hideyuki Motoyama , Hideki Tanaka , Hiroshi Yamada
发明人： Hideyuki Motoyama , Hideki Tanaka , Hiroshi Yamada
IPC分类号： H01M8/04 , H01M10/50 , F28D21/00 , F04B45/06
CPC分类号： G06F1/203 , G06F2200/201
摘要： An electronic apparatus includes a component to which a pressure is applied or which provides vibration, a heat absorbing member, a heat dissipating member, an elastomer bag which receives a pressure or the vibration from the component, a first check valve connected to a port of the elastomer bag, a second check valve connected to another port of the elastomer bag, and a coolant which flows passing through the heat absorbing member, the first check valve, the elastomer bag, the second check valve, and said heat dissipating member.
摘要翻译：电子设备包括施加压力或提供振动的部件，吸热构件，散热构件，接收来自部件的压力或振动的弹性体袋，连接到端口的第一止回阀所述弹性体袋，连接到所述弹性体袋的另一个端口的第二止回阀以及流过所述吸热件，所述第一止回阀，所述弹性体袋，所述第二止回阀和所述散热构件的冷却剂。

89. 发明申请

US20060214088A1 Method for manufacturing photoelectric transducer, and electronic apparatus 失效
公开(公告)号：US20060214088A1
公开(公告)日：2006-09-28
申请号：US11374119
申请日：2006-03-14
申请人： Masahiro Furusawa , Ichio Yudasaka , Hideki Tanaka , Tsutomu Miyamoto , Hideo Shimamura
发明人： Masahiro Furusawa , Ichio Yudasaka , Hideki Tanaka , Tsutomu Miyamoto , Hideo Shimamura
IPC分类号： G01J1/42
CPC分类号： H01L31/077 , H01L31/1872 , H01L31/202 , Y02E10/50 , Y02P70/521
摘要： A method for manufacturing a photoelectric transducer, comprising: forming a first electrode on a substrate; forming a first conductivity-type semiconductor layer on the first electrode; forming an I type semiconductor layer on the first conductivity-type semiconductor layer; forming on the I type semiconductor layer a second conductivity-type semiconductor layer that is different from the first conductivity-type; and forming a second electrode on the second conductivity-type semiconductor layer, wherein the forming of the I type semiconductor layer includes: forming a precursor film of the I type semiconductor layer on the first conductivity-type semiconductor layer by arranging droplets containing a silicon compound in an island shape; and converting the precursor film into the I type semiconductor layer by carrying out heat treatment or photoirradiation treatment to the precursor film.

90. 发明授权

US07091620B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

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