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    • 81. 发明申请
    • Recessed transistor and method of manufacturing the same
    • 嵌入式晶体管及其制造方法
    • US20080185641A1
    • 2008-08-07
    • US12068179
    • 2008-02-04
    • Keun-Nam KimMakoto YoshidaChul LeeDong-Gun ParkWoun-Suck Yang
    • Keun-Nam KimMakoto YoshidaChul LeeDong-Gun ParkWoun-Suck Yang
    • H01L29/78H01L21/336
    • H01L29/66795H01L29/66621H01L29/7834H01L29/7851
    • A recessed transistor and a method of manufacturing the same are provided. The recessed transistor may include a substrate, an active pin, a gate pattern and source and drain regions. The substrate may include an isolation layer that establishes an active region and a field region of the substrate. The substrate may include a recessed structure having an upper recess formed in the active region and a lower recess in communication with the upper recess. An active pin may be formed in a region between side surfaces of the isolation layer and the lower recess and an interface between the active region and the field region. The gate pattern may include a gate insulation layer formed on an inner surface of the recessed structure and a gate electrode formed on the gate insulation layer in the recessed structure. The source/drain regions may be formed adjacent to the active region and the gate electrode.
    • 提供凹陷晶体管及其制造方法。 凹陷的晶体管可以包括衬底,有源引脚,栅极图案以及源极和漏极区域。 衬底可以包括建立衬底的有源区和场区的隔离层。 衬底可以包括具有形成在有源区域中的上凹部的凹陷结构和与上凹部连通的下凹部。 有源销可以形成在隔离层和下凹部的侧表面之间的区域中以及有源区域和场区域之间的界面。 栅极图案可以包括形成在凹陷结构的内表面上的栅极绝缘层和形成在凹陷结构中的栅极绝缘层上的栅电极。 源/漏区可以与有源区和栅电极相邻形成。
    • 84. 发明授权
    • Method of forming fin field effect transistor
    • 形成鳍式场效应晶体管的方法
    • US07056781B2
    • 2006-06-06
    • US11014212
    • 2004-12-15
    • Jae-Man YoonGyo-Young JinHee-Soo KangDong-Gun Park
    • Jae-Man YoonGyo-Young JinHee-Soo KangDong-Gun Park
    • H01L21/336
    • H01L29/785H01L21/84H01L27/1203H01L29/66795H01L29/7854H01L29/78609
    • According to some embodiments, a fin type active region is formed under an exposure state of sidewalls on a semiconductor substrate. A gate insulation layer is formed on an upper part of the active region and on the sidewalls, and a device isolation film surrounds the active region to an upper height of the active region. The sidewalls are partially exposed by an opening part formed on the device isolation film. The opening part is filled with a conductive layer that partially covers the upper part of the active region, forming a gate electrode. Source and drain regions are on a portion of the active region where the gate electrode is not. The gate electrode may be easily separated and problems causable by etch by-product can be substantially reduced, and a leakage current of channel region and an electric field concentration onto an edge portion can be prevented.
    • 根据一些实施例,在半导体衬底上的侧壁的曝光状态下形成鳍型有源区。 在有源区的上部和侧壁上形成栅极绝缘层,并且器件隔离膜将活性区域包围到有源区的上部高度。 侧壁由形成在器件隔离膜上的开口部分部分露出。 开口部分填充有部分覆盖有源区的上部的导电层,形成栅电极。 源极和漏极区域在栅电极不是的有源区域的一部分上。 可以容易地分离栅极电极,并且可以显着地减少由蚀刻副产物引起的问题,并且可以防止沟道区域的漏电流和电场集中在边缘部分上。
    • 86. 发明授权
    • Double gate MOS transistors
    • 双栅MOS晶体管
    • US06940129B2
    • 2005-09-06
    • US10715664
    • 2003-11-18
    • Sung-Min KimDong-Gun ParkChang-Sub LeeJeong-Dong ChoeShin-Ae LeeSeong-Ho Kim
    • Sung-Min KimDong-Gun ParkChang-Sub LeeJeong-Dong ChoeShin-Ae LeeSeong-Ho Kim
    • H01L29/78H01L21/336H01L21/84H01L27/12H01L29/786
    • H01L29/66772H01L21/84H01L27/1203H01L29/78621H01L29/78645H01L29/78648H01L29/78654
    • A double gate MOS transistor includes a substrate active region defined in a semiconductor substrate and a transistor active region located over the substrate active region and overlapped with the substrate active region. At least one semiconductor pillar penetrates the transistor active region and is in contact with the substrate active region. The semiconductor pillar supports the transistor active region so that the transistor active region is spaced apart from the substrate active region. At least one bottom gate electrode fills a space between the transistor active region and the substrate active region. The bottom gate electrode is insulated from the substrate active region, the transistor active region and the semiconductor pillar. At least one top gate electrode crosses over the transistor active region and has at least one end that is in contact with a sidewall of the bottom gate electrode. The top gate electrode overlaps with the bottom gate electrode and is insulated from the transistor active region. Methods of fabricating such transistors are also provided.
    • 双栅MOS晶体管包括限定在半导体衬底中的衬底有源区和位于衬底有源区上方并与衬底有源区重叠的晶体管有源区。 至少一个半导体柱穿透晶体管有源区并与衬底有源区接触。 半导体柱支撑晶体管有源区,使得晶体管有源区与衬底有源区间隔开。 至少一个底栅电极填充晶体管有源区和衬底有源区之间的空间。 底栅电极与衬底有源区,晶体管有源区和半导体柱绝缘。 至少一个顶栅电极跨越晶体管有源区,并且具有与底栅电极的侧壁接触的至少一个端。 顶栅电极与底栅电极重叠并与晶体管有源区绝缘。 还提供制造这种晶体管的方法。
    • 89. 发明授权
    • Recessed transistor and method of manufacturing the same
    • 嵌入式晶体管及其制造方法
    • US09012982B2
    • 2015-04-21
    • US12068179
    • 2008-02-04
    • Keun-Nam KimMakoto YoshidaChul LeeDong-Gun ParkWoun-Suck Yang
    • Keun-Nam KimMakoto YoshidaChul LeeDong-Gun ParkWoun-Suck Yang
    • H01L29/66H01L29/78
    • H01L29/66795H01L29/66621H01L29/7834H01L29/7851
    • A recessed transistor and a method of manufacturing the same are provided. The recessed transistor may include a substrate, an active pin, a gate pattern and source and drain regions. The substrate may include an isolation layer that establishes an active region and a field region of the substrate. The substrate may include a recessed structure having an upper recess formed in the active region and a lower recess in communication with the upper recess. An active pin may be formed in a region between side surfaces of the isolation layer and the lower recess and an interface between the active region and the field region. The gate pattern may include a gate insulation layer formed on an inner surface of the recessed structure and a gate electrode formed on the gate insulation layer in the recessed structure. The source/drain regions may be formed adjacent to the active region and the gate electrode.
    • 提供凹陷晶体管及其制造方法。 凹陷的晶体管可以包括衬底,有源引脚,栅极图案以及源极和漏极区域。 衬底可以包括建立衬底的有源区和场区的隔离层。 衬底可以包括具有形成在有源区域中的上凹部的凹陷结构和与上凹部连通的下凹部。 有源销可以形成在隔离层和下凹部的侧表面之间的区域中以及有源区域和场区域之间的界面。 栅极图案可以包括形成在凹陷结构的内表面上的栅极绝缘层和形成在凹陷结构中的栅极绝缘层上的栅电极。 源/漏区可以与有源区和栅电极相邻形成。
    • 90. 发明授权
    • Semiconductor device having vertical transistor and method of fabricating the same
    • 具有垂直晶体管的半导体器件及其制造方法
    • US08174065B2
    • 2012-05-08
    • US12840599
    • 2010-07-21
    • Bong-Soo KimKang-Yoon LeeDong-Gun ParkJae-Man YoonSeong-Goo KimHyeoung-Won Seo
    • Bong-Soo KimKang-Yoon LeeDong-Gun ParkJae-Man YoonSeong-Goo KimHyeoung-Won Seo
    • H01L29/66
    • H01L27/10894H01L27/10876H01L29/66666H01L29/7827
    • There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.
    • 提供了具有垂直晶体管的半导体器件及其制造方法。 该方法包括制备具有单元区域和外围电路区域的半导体衬底。 在单元区域的基板上形成沿行方向和列方向二维排列的岛状的垂直栅极结构。 每个垂直栅极结构包括半导体柱和围绕半导体柱的中心部分的栅电极。 在垂直栅极结构之间的间隙区域的下方,在半导体衬底的内部形成有位线分离沟槽,并且在外围电路区域的半导体衬底的内部形成限制外围电路有源区的外围电路沟道。 位线分离沟槽与垂直栅极结构的列方向平行地形成。 位线分离绝缘层和外围电路隔离层分别形成在位线分离沟槽和外围电路沟槽内部。