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    • 6. 发明授权
    • Fin field effect transistor device and method of fabricating the same
    • Fin场效应晶体管器件及其制造方法
    • US07323375B2
    • 2008-01-29
    • US11091457
    • 2005-03-28
    • Jae-Man YoonDong-Gun ParkChoong-Ho LeeChul Lee
    • Jae-Man YoonDong-Gun ParkChoong-Ho LeeChul Lee
    • H01L21/00
    • H01L29/7851H01L21/84H01L29/66795
    • Methods of forming field effect transistors (FETs) having fin-shaped active regions include patterning a semiconductor substrate to define a fin-shaped semiconductor active region therein, which is surrounded by a trench. At least an upper portion of the fin-shaped semiconductor active region is covered with a sacrificial layer. This sacrificial layer is selectively etched-back to define sacrificial spacers on sidewalls of the fin-shaped semiconductor active region. The electrically insulating region is formed on the sacrificial spacers. The sacrificial spacers are then removed by selectively etching the sacrificial spacers using the electrically insulating region as an etching mask. An insulated gate electrode is then formed on the sidewalls of the fin-shaped semiconductor active region.
    • 形成具有鳍状有源区的场效应晶体管(FET)的方法包括图案化半导体衬底以在其中限定由沟槽包围的鳍状半导体有源区。 鳍形半导体有源区域的至少上部被牺牲层覆盖。 该牺牲层被有选择地回蚀刻以在鳍状半导体有源区域的侧壁上限定牺牲隔离物。 电绝缘区域形成在牺牲间隔物上。 然后通过使用电绝缘区域作为蚀刻掩模选择性地蚀刻牺牲隔离物来去除牺牲间隔物。 然后在鳍状半导体有源区的侧壁上形成绝缘栅电极。