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81. 发明申请

US20100166238A1 Surround sound virtualization apparatus and method 有权
标题翻译：环绕声虚拟化设备及方法
公开(公告)号：US20100166238A1
公开(公告)日：2010-07-01
申请号：US12458028
申请日：2009-06-29
申请人： Kang Eun Lee , Do-Hyung Kim , Chang Yong Son
发明人： Kang Eun Lee , Do-Hyung Kim , Chang Yong Son
IPC分类号： H04R5/033
CPC分类号： H04S3/00
摘要： A surround sound virtualization apparatus and method. The surround sound virtualization apparatus may include an audio decoder to perform head-related transfer function (HRTF) filtering, and a time delay unit to provide a time delay to a plurality of output signals of the audio decoder.
摘要翻译：环绕声虚拟化设备和方法。环绕声虚拟化装置可以包括用于执行头相关传送功能（HRTF）滤波的音频解码器，以及为音频解码器的多个输出信号提供时间延迟的时间延迟单元。

82. 发明申请

US20080279152A1 METHOD AND APPARATUS FOR PERFORMING POWER CONSUMPTION BASED HANDOVER BETWEEN HYBRID NETWORKS 审中-公开
标题翻译：用于在混合网络之间执行基于功耗的切换的方法和装置
公开(公告)号：US20080279152A1
公开(公告)日：2008-11-13
申请号：US12047444
申请日：2008-03-13
申请人： Won-Tae Kim , Sun Ja Kim , Do-Hyung Kim , Hwan-Gu Lee , Jae-Pyeong Kim , Inwhee Joe
发明人： Won-Tae Kim , Sun Ja Kim , Do-Hyung Kim , Hwan-Gu Lee , Jae-Pyeong Kim , Inwhee Joe
IPC分类号： H04Q7/00
CPC分类号： H04W36/04 , H04W52/0232 , H04W88/06 , Y02D70/142
摘要： Provided are a method and apparatus for performing power consumption based handover between hybrid networks. The method includes listing candidate networks based on a traffic class and terminal power consumption expected for each of the hybrid networks, and selecting a network for the handover according to the traffic class and a user preference from among the listed candidate networks. Accordingly, power can be saved, and simultaneously a network can be effectively selected.
摘要翻译：提供了一种用于在混合网络之间进行基于功率消耗的切换的方法和装置。该方法包括基于每个混合网络预期的业务类别和终端功率消耗列出候选网络，以及根据所列出的候选网络中的业务类别和用户偏好来选择用于切换的网络。因此，可以节省功率，同时可以有效地选择网络。

83. 发明授权

US07276786B2 Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted 失效
标题翻译：具有镜像结构和双列直插存储器模块的堆叠板上芯片封装，其上安装有堆叠板上芯片封装
公开(公告)号：US07276786B2
公开(公告)日：2007-10-02
申请号：US11177736
申请日：2005-07-08
申请人： Jeong-Hyeon Cho , Jung-Joon Lee , Do-Hyung Kim , Byung-Se So
发明人： Jeong-Hyeon Cho , Jung-Joon Lee , Do-Hyung Kim , Byung-Se So
IPC分类号： H01L23/42 , H01L23/58 , H01L29/40
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/16 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/00014
摘要： Embodiments of the invention include a stacked board-on-chip (BOC) package having a mirroring structure and a dual inline memory module (DIMM) on which the stacked BOC package is mounted. A bottom surface of a first semiconductor chip faces a bottom surface of a second semiconductor chip. An interposer electrically connects first and second packages, respectively comprising the first and second semiconductor chips, to each other. The DIMM is obtained by electrically connecting BOC packages to each other on upper and lower substrates of a printed circuit board. Since a height of the stacked BOC packages is greater than a height of a conventional stacked BOC package, the DIMM has a minimum stub length and an optimal topology. Hence, the DIMM can have a signal with excellent fidelity by reducing a load upon a signal line, and installation or wiring of components within the DIMM 300 requires less effort.
摘要翻译：本发明的实施例包括具有镜像结构的堆叠板上芯片（BOC）封装和其上安装有堆叠的BOC封装的双列直插存储器模块（DIMM）。第一半导体芯片的底面朝向第二半导体芯片的底面。插入器将分别包括第一和第二半导体芯片的第一和第二封装彼此电连接。通过在印刷电路板的上下基板上将BOC封装彼此电连接来获得DIMM。由于堆叠的BOC封装的高度大于常规堆叠BOC封装的高度，所以DIMM具有最小的短截线长度和最佳拓扑。因此，通过减少信号线上的负载，DIMM可以具有出色的保真度的信号，并且DIMM 300内的组件的安装或接线需要较少的努力。

84. 发明授权

US07239718B2 Apparatus and method for high-speed marker-free motion capture 有权
标题翻译：用于高速无标记运动捕获的装置和方法
公开(公告)号：US07239718B2
公开(公告)日：2007-07-03
申请号：US10445825
申请日：2003-05-28
申请人： Chang Joon Park , Ji Hyung Lee , Do-Hyung Kim , Seung Woo Nam , Seong Min Baek , In Ho Lee
发明人： Chang Joon Park , Ji Hyung Lee , Do-Hyung Kim , Seung Woo Nam , Seong Min Baek , In Ho Lee
IPC分类号： G06T7/00
CPC分类号： G06T7/251 , G06T7/579 , G06T2207/10016 , G06T2207/10024 , G06T2207/30196 , G06T2207/30204
摘要： A high-speed marker-free motion capture, which is capable of powerfully detecting a body's feature points corresponding to a body's end portions such as a head, hands, feet, trunk, arms and legs at a high speed in an illumination change or background or noises of cameras. The extracted feature points of the body can be directly tracked stably in a 3-dimensional space. The position errors of the feature points due to the change of the illumination conditions or a shadow can be automatically corrected and the feature points can be stably tracked with respect to overlapping and disappearance of the feature points. Further, when coordinates of the middle joints are estimated using 3-dimensional coordinates of the extracted feature points of the body, the present invention restores a human model by estimating the positions of the middle joints of the actor with high accuracy without using a motion database, thereby securing the stability and reality of the 3-dimensional motion data required in the motion capture.
摘要翻译：一种高速无标记运动捕捉，能够在照明变化或背景中以高速度强力检测对应于身体的端部（例如头部，手部，脚部，躯干，手臂和腿部）的身体的特征点或相机的噪音。身体的提取特征点可以在三维空间中稳定地直接跟踪。可以自动地校正由于照明条件或阴影的改变引起的特征点的位置误差，并且可以相对于特征点的重叠和消失来稳定跟踪特征点。此外，当使用提取的身体的特征点的三维坐标来估计中间关节的坐标时，本发明通过以高精度估计运动员的中间关节的位置而不使用运动数据库来恢复人体模型从而确保运动捕捉中所需的三维运动数据的稳定性和现实性。

85. 发明申请

US20070009936A1 mTOR kinase-associated proteins 有权
标题翻译： mTOR激酶相关蛋白
公开(公告)号：US20070009936A1
公开(公告)日：2007-01-11
申请号：US11436394
申请日：2006-05-17
申请人： David Sabatini , Do-Hyung Kim , Dos Sarbassov
发明人： David Sabatini , Do-Hyung Kim , Dos Sarbassov
IPC分类号： C12Q1/68 , C07H21/04 , C12P21/06 , C07K14/705
CPC分类号： C07K14/4703 , A01K2217/05 , A61K38/00 , C07K14/4705
摘要： The invention describes isolated mTOR-associated proteins (“mTOR-APs”) as well as isolated variants and fragments thereof and the isolated nucleic acids encoding them. The invention also describes vectors and host cells containing nucleic acid encoding an mTOR-AP polypeptide and methods for producing an mTOR-AP polypeptide. Also described are methods for screening for compounds which modulate mTOR-AP activity and methods for treating or preventing a disorder that is responsive to mTOR-AP modulation.
摘要翻译：本发明描述了分离的mTOR相关蛋白（“mTOR-AP”）以及其分离的变体和片段以及编码它们的分离的核酸。本发明还描述了含有编码mTOR-AP多肽的核酸和产生mTOR-AP多肽的方法的载体和宿主细胞。还描述了筛选调节mTOR-AP活性的化合物的方法和用于治疗或预防对mTOR-AP调节有反应的病症的方法。

86. 发明申请

US20070001204A1 Capacitor with single crystal tantalum oxide layer and method for fabricating the same 失效
标题翻译：具有单晶钽氧化物层的电容器及其制造方法
公开(公告)号：US20070001204A1
公开(公告)日：2007-01-04
申请号：US11411568
申请日：2006-04-25
申请人： Do-Hyung Kim
发明人： Do-Hyung Kim
IPC分类号： H01L29/94 , H01L27/108 , H01L29/76 , H01L31/119
CPC分类号： H01L28/40 , H01L21/02183 , H01L21/02266 , H01L21/0228 , H01L21/31637
摘要： A capacitor and a method for fabricating the same are provided. The capacitor includes: a substrate; an inter-layer insulation layer formed over the substrate and including a contact hole; a storage node formed over the inter-layer insulation layer and filled into the contact hole; a tantalum oxide layer of single crystal formed over the storage node; and a plate formed over the tantalum oxide layer.
摘要翻译：提供一种电容器及其制造方法。电容器包括：基板; 形成在所述基板上并且包括接触孔的层间绝缘层; 存储节点，形成在所述层间绝缘层上并填充到所述接触孔中; 在存储节点上形成单晶的氧化钽层; 以及形成在氧化钽层上的板。

87. 发明申请

US20060207788A1 Memory module and signal line arrangement method thereof 有权
标题翻译：存储模块及其信号线排列方法
公开(公告)号：US20060207788A1
公开(公告)日：2006-09-21
申请号：US11357500
申请日：2006-02-17
申请人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
发明人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
IPC分类号： H05K7/06
CPC分类号： H05K1/181 , G11C5/025 , G11C5/04 , H05K1/112 , H05K2201/10159 , H05K2201/10545 , Y02P70/611 , Y10T29/49128 , Y10T29/49155
摘要： In a memory module and a signal line arrangement method thereof, the memory module comprises: memory chips mounted on both sides of the module in a mirrored configuration; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sides in contact with same signal applying balls of the memory chips in the mirrored configuration, the PCB including a via at a location proximal to the same signal applying contact pad of one side of the PCB among the same signal applying contact pads arranged on both sides in the mirrored configuration, the via connecting an other side of the PCB to the one side of the PCB, and a contact junction connected to the same signal applying contact pad of the other side of the PCB, the contact junction being connected to the via of the other side of the PCB, and the via of the one side of the PCB being connected to the same signal applying contact pad of the one side of the PCB, the contact junction connected to a signal terminal from the other side of the PCB.
摘要翻译：在存储器模块及其信号线布置方法中，存储器模块包括：以镜像配置安装在模块两侧的存储器芯片; 以及具有相同信号的印刷电路板（PCB），其施加布置在两侧的接触焊盘，以与镜像配置中的存储器芯片的相同信号施加球接触，PCB包括位于相邻信号施加接触垫在布置在镜面配置两侧的相同信号施加接触垫中的PCB的一侧，通孔将PCB的另一侧连接到PCB的一侧，以及连接到相同信号的接触点施加接触 PCB的另一侧的焊盘，接触点连接到PCB的另一侧的通孔，并且PCB的一侧的通孔连接到施加与该PCB的一侧的接触焊盘相同的信号 PCB，接触点从PCB的另一侧连接到信号端子。

88. 发明申请

US20060120569A1 User authentication system and method thereof 有权
公开(公告)号：US20060120569A1
公开(公告)日：2006-06-08
申请号：US11291607
申请日：2005-11-30
申请人： Do-Hyung Kim , Jae-Yeon Lee , Su-Young Chi , Ho-Sub Yoon , Kye-Kyung Kim , Soo-Hyun Cho , Hye-Jin Kim , Young-Jo Cho
发明人： Do-Hyung Kim , Jae-Yeon Lee , Su-Young Chi , Ho-Sub Yoon , Kye-Kyung Kim , Soo-Hyun Cho , Hye-Jin Kim , Young-Jo Cho
IPC分类号： G06K9/00 , G06K9/46
CPC分类号： G06K9/00362
摘要： A user recognizing system and method is provided. According to the user recognizing system and method, user ID and predetermined user feature information are stored, first and second user feature information are extracted from the user image data transmitted from the image input unit, and first and second probabilities that the extracted first and second user feature information determine the predetermined user are respectively generated based on the information stored at the user information database, the first user feature information being absolutely unique biometric information and the second user feature information being unique semibiometric information under a predetermined condition, and ID of the input image is finally determined by combining the first probability and the second probability. According to the user recognizing system and method, a user identity can be authenticated even when the user freely moves.

89. 发明申请

US20060055017A1 Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip package are mounted 失效
标题翻译：堆叠的片上芯片封装，具有镜像结构和双列直插存储器模块，其上安装有堆叠的片上芯片封装
公开(公告)号：US20060055017A1
公开(公告)日：2006-03-16
申请号：US11177736
申请日：2005-07-08
申请人： Jeong-Hyeon Cho , Jung-Joon Lee , Do-Hyung Kim , Byung-Se So
发明人： Jeong-Hyeon Cho , Jung-Joon Lee , Do-Hyung Kim , Byung-Se So
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/16 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/00014
摘要： Embodiments of the invention include a stacked board-on-chip (BOC) package having a mirroring structure and a dual inline memory module (DIMM) on which the stacked BOC package is mounted. A bottom surface of a first semiconductor chip faces a bottom surface of a second semiconductor chip. An interposer electrically connects first and second packages, respectively comprising the first and second semiconductor chips, to each other. The DIMM is obtained by electrically connecting BOC packages to each other on upper and lower substrates of a printed circuit board. Since a height of the stacked BOC packages is greater than a height of a conventional stacked BOC package, the DIMM has a minimum stub length and an optimal topology. Hence, the DIMM can have a signal with excellent fidelity by reducing a load upon a signal line, and installation or wiring of components within the DIMM 300 requires less effort.
摘要翻译：本发明的实施例包括具有镜像结构的堆叠板上芯片（BOC）封装和其上安装有堆叠的BOC封装的双列直插存储器模块（DIMM）。第一半导体芯片的底面朝向第二半导体芯片的底面。插入器将分别包括第一和第二半导体芯片的第一和第二封装彼此电连接。通过在印刷电路板的上下基板上将BOC封装彼此电连接来获得DIMM。由于堆叠的BOC封装的高度大于常规堆叠BOC封装的高度，所以DIMM具有最小的短截线长度和最佳拓扑。因此，通过减少信号线上的负载，DIMM可以具有出色的保真度的信号，并且DIMM 300内的组件的安装或接线需要较少的努力。

90. 发明申请

US20050208725A1 Semiconductor device having shared contact and fabrication method thereof 有权
公开(公告)号：US20050208725A1
公开(公告)日：2005-09-22
申请号：US11143194
申请日：2005-06-01
申请人： Do-Hyung Kim , Jung-In Hong
发明人： Do-Hyung Kim , Jung-In Hong
IPC分类号： H01L21/28 , H01L21/768 , H01L21/8234 , H01L21/3205 , H01L21/336 , H01L21/4763
CPC分类号： H01L21/823425 , H01L21/76895 , H01L21/823475 , Y10S257/90 , Y10S257/903
摘要： Semiconductor devices and methods of fabrication. A device includes a semiconductor substrate, a gate electrode insulated from the semiconductor substrate by a gate insulation layer, LDD-type source/drain regions formed at both sides of the gate electrode, an interlayer insulation layer formed over the gate electrode and the substrate, and a shared contact piercing the interlayer insulation layer and contacting the gate electrode and one of the LDD-type source/drain regions including at least a part of a lightly doped drain region. Multiple-layer spacers are formed on both sides of the gate structure and used as a mask in forming the LDD-type regions. At least one layer of the spacer is removed in the contact opening to widen the opening to receive a contact plug.

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