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    • 81. 发明授权
    • Method for integrating a non-volatile memory (NVM)
    • 用于集成非易失性存储器(NVM)的方法
    • US08431471B2
    • 2013-04-30
    • US12951862
    • 2010-11-22
    • Jane A. YaterSung-Taeg KangMehul D. Shroff
    • Jane A. YaterSung-Taeg KangMehul D. Shroff
    • H01L21/3205H01L21/4763
    • H01L27/105H01L27/11531H01L27/11548H01L27/11573H01L27/11575H01L29/42328H01L29/42332H01L29/42344H01L29/42348H01L29/788H01L29/792
    • A feature is formed in the NVM isolation region during the patterning and etching of an NVM device and a logic device such that the feature is of substantially equal height to the logic device and is well-defined so that it does not cause defect signals. A first conductive layer is formed over a substrate. The first conductive layer is patterned to expose at least a portion of the substrate in an NVM region and at least a portion of an isolation region. An NVM dielectric stack is formed over the first conductive layer, the exposed substrate, and the exposed isolation region, and a second conductive layer is formed over the NVM dielectric stack. The first and second conductive layers and the NVM dielectric stack are patterned to form a first gate and a second gate of an NVM cell in the NVM region and a feature over the isolation region. The feature comprises a portion of the first conductive layer, a portion of the NVM dielectric stack adjacent a first sidewall of the portion of the first conductive layer, and a portion of the second conductive layer adjacent the portion of the NVM dielectric stack.
    • 在NVM器件和逻辑器件的图案化和蚀刻期间,在NVM隔离区域中形成特征,使得该特征与逻辑器件的高度基本相等,并且被明确地限定,使得其不会引起缺陷信号。 第一导电层形成在衬底上。 图案化第一导电层以在NVM区域和隔离区域的至少一部分中露出衬底的至少一部分。 在第一导电层,暴露的衬底和暴露的隔离区上方形成NVM电介质堆叠,并且在NVM电介质叠层上形成第二导电层。 图案化第一和第二导电层和NVM电介质叠层以形成NVM区域中的NVM单元的第一栅极和第二栅极以及隔离区域上的特征。 该特征包括第一导电层的一部分,与第一导电层的该部分的第一侧壁相邻的NVM电介质堆叠的一部分以及邻近NVM电介质叠层部分的第二导电层的一部分。
    • 82. 发明授权
    • Method for forming a split-gate memory cell
    • 形成分裂栅极存储单元的方法
    • US08372699B2
    • 2013-02-12
    • US12710111
    • 2010-02-22
    • Sung-Taeg KangJane A. Yater
    • Sung-Taeg KangJane A. Yater
    • H01L21/336H01L21/3205
    • H01L21/28282H01L29/42348H01L29/792
    • A method for forming a semiconductor device includes forming a first semiconductor layer over a substrate, forming a first photoresist layer over the first semiconductor layer, and using only a first single mask patterning the first photoresist layer to form a first patterned photoresist layer. The method further includes using the first patterned photoresist layer etching the first semiconductor layer to form a select gate and forming a charge storage layer over the select gate and a portion of the substrate. The method further includes forming a second semiconductor layer over the charge storage layer, forming a second photoresist layer over the second semiconductor layer, and using only a second single mask patterning the second photoresist layer to form a second patterned photoresist layer. The method further includes forming a control gate by anisotropically etching the second semiconductor layer and then subsequently isotropically etching the second semiconductor layer.
    • 一种用于形成半导体器件的方法包括在衬底上形成第一半导体层,在第一半导体层上形成第一光致抗蚀剂层,并且仅使用图案化第一光致抗蚀剂层的第一单掩模形成第一图案化光致抗蚀剂层。 该方法还包括使用蚀刻第一半导体层的第一图案化光刻胶层形成选择栅极并在选择栅极和衬底的一部分上形成电荷存储层。 该方法还包括在电荷存储层上形成第二半导体层,在第二半导体层上形成第二光致抗蚀剂层,并且仅使用图案化第二光致抗蚀剂层的第二单掩模形成第二图案化光致抗蚀剂层。 该方法还包括通过各向异性蚀刻第二半导体层然后随后各向同性蚀刻第二半导体层来形成控制栅极。
    • 85. 发明授权
    • Nanocrystal memory with differential energy bands and method of formation
    • 具有差分能带的纳米晶体记忆和形成方法
    • US07871886B2
    • 2011-01-18
    • US12436558
    • 2009-05-06
    • Cheong Min HongSung-Taeg Kang
    • Cheong Min HongSung-Taeg Kang
    • H01L21/336
    • H01L21/28273B82Y10/00H01L21/02488H01L21/02532H01L21/02576H01L21/02579H01L21/02601H01L29/42328H01L29/42332H01L29/7881
    • A method of making a semiconductor device using a semiconductor substrate includes forming a first insulating layer having a first band energy over the semiconductor substrate. A first semiconductor layer having a second band energy is formed on the first insulating layer. The first semiconductor layer is annealed to form a plurality of first charge retainer globules from the first semiconductor layer. A first protective film is formed over each charge retainer globule of the plurality of first charge retainer globules. A second semiconductor layer is formed having a third band energy over the plurality of first charge retainer globules. The second semiconductor layer is annealed to form a plurality of storage globules from the second semiconductor layer over the plurality of first charge retainer globules. A magnitude of the second band energy is between a magnitude of the first band energy and a magnitude of the third band energy.
    • 使用半导体衬底制造半导体器件的方法包括在半导体衬底上形成具有第一带能的第一绝缘层。 具有第二带能的第一半导体层形成在第一绝缘层上。 第一半导体层被退火以从第一半导体层形成多个第一电荷保持器球。 在多个第一电荷保持器球的每个电荷保持器球上形成第一保护膜。 在多个第一电荷保持器球上形成具有第三带能的第二半导体层。 第二半导体层被退火以在多个第一电荷保持器球上从第二半导体层形成多个存储小球。 第二带能量的大小在第一带能量的大小和第三带能量的大小之间。
    • 87. 发明申请
    • SELF-ALIGNED IN-LAID SPLIT GATE MEMORY AND METHOD OF MAKING
    • 自对准的内部分离器存储器及其制造方法
    • US20100029052A1
    • 2010-02-04
    • US12181766
    • 2008-07-29
    • Sung-Taeg KangJane A. Yater
    • Sung-Taeg KangJane A. Yater
    • H01L21/336
    • H01L21/28273B82Y10/00H01L21/28282H01L21/84H01L27/11521H01L27/11568H01L29/42328H01L29/42332H01L29/42344H01L29/7881H01L29/792
    • A method includes forming a silicon nitride layer and patterning it to form a first opening and a second opening separated by a first portion of silicon nitride. Gate material is deposited in the first and second openings to form first and second select gate structures in the first and second openings. Second and third portions of silicon nitride layer are removed adjacent to the first and second gate structures, respectively. A charge storage layer is formed over the semiconductor device after removing the second and third portions. First and second sidewall spacers of gate material are formed on the charge storage layer and adjacent to the first and second gate structures. The charge storage layer is etched using the first and second sidewall spacers as masks. The first portion is removed. A drain region is formed in the semiconductor layer between the first and second gate structures.
    • 一种方法包括形成氮化硅层并将其图案化以形成由氮化硅的第一部分分开的第一开口和第二开口。 栅极材料沉积在第一和第二开口中以在第一和第二开口中形成第一和第二选择栅极结构。 氮化硅层的第二和第三部分分别与第一和第二栅极结构相邻地去除。 在去除第二和第三部分之后,在半导体器件上形成电荷存储层。 栅极材料的第一和第二侧壁间隔物形成在电荷存储层上并与第一和第二栅极结构相邻。 使用第一和第二侧壁间隔物作为掩模蚀刻电荷存储层。 第一部分被删除。 在第一和第二栅极结构之间的半导体层中形成漏极区。
    • 88. 发明授权
    • Semiconductor device having multi-bit nonvolatile memory cell and methods of fabricating the same
    • 具有多位非易失性存储单元的半导体器件及其制造方法
    • US07521750B2
    • 2009-04-21
    • US12017239
    • 2008-01-21
    • Bo-Young SeoHee-Seog JeonSung-Taeg Kang
    • Bo-Young SeoHee-Seog JeonSung-Taeg Kang
    • H01L29/76
    • G11C16/0475G11C11/5621G11C11/5692G11C16/0458H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • A nonvolatile semiconductor device includes a pair of multi-bit nonvolatile memory unit cells. Each unit cell includes a grid type semiconductor body in which a plurality of parallel semiconductor bodies extend in a first direction and a plurality of parallel semiconductor bodies extend in a second direction perpendicular to the first direction, a channel region formed in a partial region of the semiconductor body along circumferences of the semiconductor bodies that extend in the first direction, a charge storage region formed on the channel region, a plurality of control gates, which are formed on the charge storage region and wherein each of the plurality of control gates is adapted to receive separate control voltages. Each unit cell further includes source and drain regions aligned on both sides of the plurality of control gates and formed in the semiconductor bodies, wherein the pair of unit cells share the source region, and the source region is formed at a cross point of the grid.
    • 非易失性半导体器件包括一对多位非易失性存储单元。 每个单电池包括栅格型半导体本体,其中多个平行的半导体本体在第一方向上延伸,并且多个平行的半导体本体在垂直于第一方向的第二方向上延伸,沟道区形成在 半导体本体沿着在第一方向上延伸的半导体本体的周边,形成在沟道区上的电荷存储区域,形成在电荷存储区域上的多个控制栅极,并且其中多个控制栅极中的每一个被适配 以接收单独的控制电压。 每个单元还包括在多个控制栅极的两侧对准并形成在半导体主体中的源极和漏极区域,其中该对单元电池共享源极区域,并且源极区域形成在栅极的交叉点处 。