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81. 发明申请

US20100224303A1 METHOD TO BUILD ROBUST MECHANICAL STRUCTURES ON SUBSTRATE SURFACES 失效
标题翻译：在基板表面上建立稳定的机械结构的方法
公开(公告)号：US20100224303A1
公开(公告)日：2010-09-09
申请号：US12783967
申请日：2010-05-20
申请人： Gary W. Grube , Gaetan L. Mathieu , Benjamin N. Eldridge , Chadwick D. Sofield
发明人： Gary W. Grube , Gaetan L. Mathieu , Benjamin N. Eldridge , Chadwick D. Sofield
IPC分类号： B29C65/52
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译：提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。然后可以在镀覆的基础上构造诸如弹簧探针的组件。粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

82. 发明申请

US20090263986A1 SPRING INTERCONNECT STRUCTURES 有权
标题翻译：弹簧互连结构
公开(公告)号：US20090263986A1
公开(公告)日：2009-10-22
申请号：US12495405
申请日：2009-06-30
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
摘要翻译：包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。在一个方面，互连具有适于直接接触半导体器件的尺寸。可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

83. 发明授权

US07553165B2 Spring interconnect structures 有权
标题翻译：弹簧互连结构
公开(公告)号：US07553165B2
公开(公告)日：2009-06-30
申请号：US12120112
申请日：2008-05-13
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
摘要翻译：包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。在一个方面，互连具有适于直接接触半导体器件的尺寸。可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

84. 发明申请

US20080115353A1 LITHOGRAPHIC CONTACT ELEMENTS 有权
标题翻译： LITHOGRAPHIC联系元素
公开(公告)号：US20080115353A1
公开(公告)日：2008-05-22
申请号：US11929510
申请日：2007-10-30
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： H05K3/10
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06744 , G01R1/06761 , H01L21/6835 , H01L23/49811 , H01L24/16 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1147 , H01L2224/11902 , H01L2224/13012 , H01L2224/13017 , H01L2224/13019 , H01L2224/1308 , H01L2224/13099 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K3/326 , H05K3/4092 , Y10S438/977 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
摘要翻译：通过光刻技术形成包括弹簧接触元件的互连的方法。在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料）并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

85. 发明授权

US06791176B2 Lithographic contact elements 有权
标题翻译：光刻接触元件
公开(公告)号：US06791176B2
公开(公告)日：2004-09-14
申请号：US09777348
申请日：2001-02-05
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： H01L2348
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06744 , G01R1/06761 , H01L21/6835 , H01L23/49811 , H01L24/16 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1147 , H01L2224/11902 , H01L2224/13012 , H01L2224/13017 , H01L2224/13019 , H01L2224/1308 , H01L2224/13099 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K3/326 , H05K3/4092 , Y10S438/977 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
摘要翻译：通过光刻技术形成包括弹簧接触元件的互连的方法。在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料）并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

86. 发明授权

US06483328B1 Probe card for probing wafers with raised contact elements 失效
标题翻译：用于探测具有凸起接触元件的晶片的探针卡
公开(公告)号：US06483328B1
公开(公告)日：2002-11-19
申请号：US09204740
申请日：1998-12-02
申请人： Benjamin N. Eldridge , Gary W. Grube , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： G01R3126
CPC分类号： B23K20/004 , B23K2101/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
摘要： A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
摘要翻译：提供探针卡用于使电子部件与凸起的接触元件接触。特别地，本发明对于使半导体晶片与诸如弹簧的弹性接触元件接触是有用的。探针卡被设计成具有与晶片上的接触元件配合的端子。在优选实施例中，终端是帖子。在优选实施例中，端子包括适于重复接触的接触材料。在一个特别优选的实施例中，空间变压器被制备成具有一侧的接触柱和相对侧上的端子。具有弹簧触点的插入件将空间变压器的相对侧上的触点连接到探针卡上的对应端子，该端子又连接到可连接到诸如常规测试器的测试装置的端子。

87. 发明授权

US06255126B1 Lithographic contact elements 有权
公开(公告)号：US06255126B1
公开(公告)日：2001-07-03
申请号：US09205023
申请日：1998-12-02
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： G01R3126
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06744 , G01R1/06761 , H01L21/6835 , H01L23/49811 , H01L24/16 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1147 , H01L2224/11902 , H01L2224/13012 , H01L2224/13017 , H01L2224/13019 , H01L2224/1308 , H01L2224/13099 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K3/326 , H05K3/4092 , Y10S438/977 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

88. 发明申请

US20100000080A1 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：US20100000080A1
公开(公告)日：2010-01-07
申请号：US12477748
申请日：2009-06-03
申请人： Benjamin N. Eldridge , Gary W. Grube , Eric D. Hobbs , Gaetan L. Mathieu , Makarand S. Shinde , Alexander H. Slocum , A. Nicholas Sporck , Thomas N. Watson
发明人： Benjamin N. Eldridge , Gary W. Grube , Eric D. Hobbs , Gaetan L. Mathieu , Makarand S. Shinde , Alexander H. Slocum , A. Nicholas Sporck , Thomas N. Watson
IPC分类号： H05K13/04
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

89. 发明授权

US07371072B2 Spring interconnect structures 有权
标题翻译：弹簧互连结构
公开(公告)号：US07371072B2
公开(公告)日：2008-05-13
申请号：US10750355
申请日：2003-12-29
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
IPC分类号： H01R12/00
CPC分类号： H01L24/72 , G01R1/06727 , G01R1/06733 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01H1/0036 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/30105 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
摘要翻译：包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。在一个方面，互连具有适于直接接触半导体器件的尺寸。可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

90. 发明授权

US07312618B2 Method and system for compensating thermally induced motion of probe cards 失效
标题翻译：用于补偿探针卡热诱导运动的方法和系统
公开(公告)号：US07312618B2
公开(公告)日：2007-12-25
申请号：US11428423
申请日：2006-07-03
申请人： Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand S. Shinde , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand S. Shinde , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/07342 , G01R1/44 , G01R31/2886
摘要： A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
摘要翻译：公开了一种用于补偿在晶片上测试模具中使用的探针卡的热诱导运动的方法和系统。公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。公开了用于允许探针卡的径向膨胀以防止热诱导的探针卡的移动的各种装置。还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

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