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81. 发明授权

US6014018A Voltage-reducing device with low power dissipation 有权
标题翻译：具有低功耗的降压装置
公开(公告)号：US6014018A
公开(公告)日：2000-01-11
申请号：US177205
申请日：1998-10-22
申请人： Te-Sun Wu , Hui-Fang Tsai , Tsun-Zu Lin
发明人： Te-Sun Wu , Hui-Fang Tsai , Tsun-Zu Lin
IPC分类号： G05F3/24 , G05F1/40
CPC分类号： G05F3/242
摘要： A voltage-reducing device of low power dissipation is provided, including a plurality of transistors, which are self-connected as diode equivalent. These transistors are then cascaded in series in the same direction and coupled to a voltage source. Since every transistor has a threshold voltage, the voltage at the end of the forward-biased cascaded transistors will be lowered than the voltage source so as to provide a reduced voltage source. Furthermore, since the voltage adjustment of the device is based on the threshold voltage, there is hardly any power dissipation. In addition, we can use different threshold voltages from various transistors to provide different combinations of these threshold voltages to obtain the desired voltage drop.
摘要翻译：提供低功耗的降压装置，包括多个晶体管，它们作为二极管等效自连接。然后将这些晶体管以相同的方向串联级联并耦合到电压源。由于每个晶体管都具有阈值电压，所以正向偏置级联晶体管末端的电压将比电压源降低，从而提供一个降低的电压源。此外，由于器件的电压调整基于阈值电压，因此几乎不存在功率消耗。此外，我们可以使用不同晶体管的不同阈值电压来提供这些阈值电压的不同组合，以获得所需的电压降。

82. 发明授权

US4688339A No leak steam iron 失效
标题翻译：无泄漏蒸汽熨斗
公开(公告)号：US4688339A
公开(公告)日：1987-08-25
申请号：US934266
申请日：1986-11-24
申请人： Hui-Fang Tsai
发明人： Hui-Fang Tsai
IPC分类号： D06F75/14 , D06F75/18 , D06F79/02 , D06F75/28 , D06F75/34 , D06F75/40
CPC分类号： D06F79/02 , D06F75/14 , D06F75/18 , D06F79/026
摘要： A stream iron includes a support base, a handle, a reservoir portion which has an elbow-like water entry tube for preventing water stored inside the reservoir portion from spilling out when the steam iron is tilted forward, and an ironing plate having a bi-metallic plate. A related arrangement prevents water from flowing out of the ironing plate and getting clothes being ironed wet after the steam button has been pressed if the temperature of the ironing plate is lower than a certain minimum value.
摘要翻译：流铁包括支撑基座，手柄，储存器部分，其具有肘形的入水管，用于防止储存部分中储存的水在蒸汽熨斗向前倾斜时溢出;以及熨烫板，金属板。如果熨烫板的温度低于一定的最小值，则在按压蒸汽按钮之后，防止水从熨烫板流出并使得熨烫的衣服变湿。

83. 发明授权

US08812667B1 CIFS proxies for scanning protection 有权
标题翻译： CIFS代理扫描保护
公开(公告)号：US08812667B1
公开(公告)日：2014-08-19
申请号：US11315727
申请日：2005-12-21
申请人： Chang-Wei Chung , Ming-Fang Tsai
发明人： Chang-Wei Chung , Ming-Fang Tsai
IPC分类号： G06F15/173 , G06F15/16 , H04L29/06
CPC分类号： H04L63/145 , H04L63/0281 , H04L63/10 , H04L63/12
摘要： Methods and apparatus for transparently processing files that are manipulated between a server computer and a client computer using the CIFS protocol. The transparent processing employs an in-line CIFS proxy and may include virus scanning, content scanning, and/or security policy implementation.
摘要翻译：用于透明地处理使用CIFS协议在服务器计算机和客户端计算机之间操纵的文件的方法和装置。透明处理采用直接CIFS代理，并且可以包括病毒扫描，内容扫描和/或安全策略实现。

84. 发明授权

US08651245B1 Bicycle brake unit 有权
标题翻译：自行车制动单元
公开(公告)号：US08651245B1
公开(公告)日：2014-02-18
申请号：US13571339
申请日：2012-08-09
申请人： Szu-Fang Tsai
发明人： Szu-Fang Tsai
IPC分类号： B62L3/00
CPC分类号： B62L1/16 , B62L1/06
摘要： A bicycle brake unit includes a first arm, a second arm and a connector, when the brake cable is pulled, the first and second cable connectors on the two arms are moved toward each other to pivot the first and second arms. The first rail on the first arm and the second rail on the second arm are moved relative to each other via the rotation of the pivot. The pivot is movable in the elongate slot in the connector which is pivotably connected to the first and second arms. The first and second arms are pivoted toward each other to brake the wheel by the brake pads on the two arms. The first and second arms apply even forces to the two brake pads.
摘要翻译：自行车制动单元包括第一臂，第二臂和连接器，当拉动制动缆索时，两个臂上的第一和第二缆线连接器彼此相对移动以枢转第一和第二臂。第一臂上的第一轨道和第二臂上的第二轨道经由枢轴的旋转相对于彼此移动。枢轴可在连接器中的细长槽中移动，其可枢转地连接到第一和第二臂。第一和第二臂彼此枢转以通过两个臂上的制动片来制动车轮。第一和第二臂对两个刹车片施加均匀的力。

85. 发明授权

US08608354B2 Remote control for bicycle headlight and rear light 有权
标题翻译：自行车头灯和后灯的遥控器
公开(公告)号：US08608354B2
公开(公告)日：2013-12-17
申请号：US13448361
申请日：2012-04-16
申请人： Szu-Fang Tsai
发明人： Szu-Fang Tsai
IPC分类号： B62J6/00 , F21V33/00
CPC分类号： B62J6/16 , B62J2006/008
摘要： A remote control for bicycle headlight and rear light is provided a dome including an opening; an actuation member including a resilient button disposed through the opening, and a flange extending outwardly from the button to engage an inner surface of the dome; a controller including a control unit, a switch on the control unit and engaging the button, and a transmitter within the control unit; a battery engaging the control unit; and a bracket including a clamp and a seat at one end of the clamp, the seat releasably secured to the dome together to receive the actuation member, the controller, and the battery. The bracket is mounted on a handlebar by threadedly securing the clamp to a brake lever. A pressing of the button electrically connects the battery to the control unit so as to activate the transmitter to send out an IR light pulse.
摘要翻译：一种用于自行车头灯和后灯的遥控器设置有包括开口的圆顶; 致动构件，包括通过所述开口设置的弹性按钮，以及从所述按钮向外延伸以接合所述圆顶的内表面的凸缘; 控制器，包括控制单元，控制单元上的开关和接合按钮;以及控制单元内的发射器; 与控制单元接合的电池; 以及支架，其包括在所述夹具的一端处的夹具和座椅，所述座椅可释放地固定到所述穹顶在一起以接收所述致动构件，所述控制器和所述电池。支架通过将夹具螺纹固定到制动杆上而安装在手把上。按下按钮将电池电连接到控制单元，以激活发射器发出IR光脉冲。

86. 发明申请

US20130241041A1 SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS 有权
标题翻译：具有引线延伸的半导体封装及相关方法
公开(公告)号：US20130241041A1
公开(公告)日：2013-09-19
申请号：US13421570
申请日：2012-03-15
申请人： Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai
发明人： Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49541 , H01L23/49548 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/78251 , H01L2224/83447 , H01L2224/8346 , H01L2224/8385 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2224/85805 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/83 , H01L2224/45099
摘要： A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.
摘要翻译：具有管芯焊盘的半导体封装，设置在管芯焊盘上的管芯和围绕管芯焊盘设置的第一引线。第一引线包括接触元件，基本上沿芯片焊盘的方向延伸的延伸元件，以及设置在接触元件和延伸元件之间的凹表面。具有凹面的第二引线也围绕芯片焊盘设置。第一引线凹面与第二引线凹面的方向相反。

87. 发明授权

US08502363B2 Semiconductor device packages with solder joint enhancement element and related methods 有权
标题翻译：具有焊点增强元件的半导体器件封装及相关方法
公开(公告)号：US08502363B2
公开(公告)日：2013-08-06
申请号：US13433061
申请日：2012-03-28
申请人： Po-Shing Chiang , Ping-Cheng Hu , Yu-Fang Tsai
发明人： Po-Shing Chiang , Ping-Cheng Hu , Yu-Fang Tsai
IPC分类号： H01L23/495 , H01L21/00 , H01R9/00
CPC分类号： H01L23/488 , H01L21/4832 , H01L21/56 , H01L23/49541 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor device package including a substrate, first and second solder joints, a die pad, leads and enhancement elements surrounding the die pad, a chip electrically connected to the leads, and a package body encapsulating the chip, portions of the leads, and portions of the enhancement elements, but leaving exposed at least a side surface of each enhancement element. Side surfaces of the enhancement elements and the package body are coplanar. The substrate includes first pads corresponding to the leads and second pads corresponding to the enhancement elements. The first solder joints are disposed between the first pads and the leads. The second solder joints are disposed between the second pads and the enhancement elements. The second solder joints contact side surfaces of the enhancement elements. The surface area of the second pads is greater than the surface area of the corresponding enhancement elements.
摘要翻译：一种半导体器件封装，包括基板，第一和第二焊点，芯片焊盘，引线和围绕芯片焊盘的增强元件，与引线电连接的芯片以及封装芯片，引线部分和部分的增强元件，但是留下每个增强元件的至少一个侧表面。增强元件和封装主体的侧表面是共面的。衬底包括对应于引线的第一焊盘和对应于增强元件的第二焊盘。第一焊点设置在第一焊盘和引线之间。第二焊点设置在第二焊盘和增强元件之间。第二焊点接触增强元件的侧表面。第二焊盘的表面积大于相应增强元件的表面积。

88. 发明申请

US20120245632A1 BONE ANCHOR 审中-公开
标题翻译：骨锚
公开(公告)号：US20120245632A1
公开(公告)日：2012-09-27
申请号：US13225423
申请日：2011-09-03
申请人： Yung-Fang Tsai , Wei-Kai Wang , Yang-Hwei Tsuang , Yi-Jie Kuo
发明人： Yung-Fang Tsai , Wei-Kai Wang , Yang-Hwei Tsuang , Yi-Jie Kuo
IPC分类号： A61B17/04
CPC分类号： A61B17/0401 , A61B2017/0404 , A61B2017/0414 , A61B2017/044 , A61B2017/0445
摘要： A bone anchor comprises a screw body and a flange, which are joined together in a way to keep their rotation independent from each other. In implanting the screw body into a bone, the flange does not rotate to prevent twisting and/or snarling of the suture in wounded bone from occurring.
摘要翻译：骨锚包括螺钉体和凸缘，它们以保持其旋转彼此独立的方式连接在一起。在将螺钉体植入骨中时，凸缘不旋转以防止受伤骨中的缝合线发生扭曲和/或咆哮。

89. 发明申请

US20120075218A1 TOUCH PANEL AND TOUCH DISPLAY DEVICE USING THE SAME 审中-公开
标题翻译：触摸面板和触摸显示设备使用它
公开(公告)号：US20120075218A1
公开(公告)日：2012-03-29
申请号：US13238255
申请日：2011-09-21
申请人： MING-CHUAN LIN , Tien-Nan Wang , Ying-Chi Wang , Yung-Chang Lin , Lin Lin , Wen-Hung Wang , Pei-Fang Tsai , Shyh-Jeng Chen
发明人： MING-CHUAN LIN , Tien-Nan Wang , Ying-Chi Wang , Yung-Chang Lin , Lin Lin , Wen-Hung Wang , Pei-Fang Tsai , Shyh-Jeng Chen
IPC分类号： G06F3/041
CPC分类号： G06F3/044 , G06F3/0418 , G06F2203/04107
摘要： A touch panel comprising a substrate, a touch element, a first grounding electrode, an insulation layer and a second grounding electrode is disclosed. The touch element is disposed on a first surface of the substrate. The first grounding electrode is disposed on the first surface to surround the touch element. The insulation layer is disposed on the first surface to cover the touch element and the first grounding electrode. The second grounding electrode is disposed on the first insulation layer or on a second surface of the substrate opposite to the first surface. Therefore, the ESD can be conducted to the grounding end G of the circuit component through the enclosed first grounding electrode, and the signal interference between the touch panel and display can be shielded by the second grounding electrode to enhance anti-ESD and anti-noise abilities of the touch panel.
摘要翻译：公开了一种包括基板，触摸元件，第一接地电极，绝缘层和第二接地电极的触摸面板。触摸元件设置在基板的第一表面上。第一接地电极设置在第一表面上以围绕触摸元件。绝缘层设置在第一表面上以覆盖触摸元件和第一接地电极。第二接地电极设置在与第一表面相对的第一绝缘层或第二表面上。因此，ESD可以通过封闭的第一接地电极传导到电路部件的接地端G，并且可以通过第二接地电极屏蔽触摸面板和显示器之间的信号干扰，以增强抗ESD和抗噪声触摸屏的能力。

90. 发明申请

US20110292625A1 BONDING PAD STRUCTURE 有权
标题翻译：粘结垫结构
公开(公告)号：US20110292625A1
公开(公告)日：2011-12-01
申请号：US13117614
申请日：2011-05-27
申请人： HAN-CHUNG CHEN , Chun-Yi Wu , Shih-Cheng Wang , Chin-Mei Huang , Tsui-Chuan Wang , Pei-Fang Tsai
发明人： HAN-CHUNG CHEN , Chun-Yi Wu , Shih-Cheng Wang , Chin-Mei Huang , Tsui-Chuan Wang , Pei-Fang Tsai
IPC分类号： H05K7/06
CPC分类号： H05K1/111 , H01L24/83 , H01L33/62 , H01L2224/8338 , H01L2224/83385 , H01L2224/83801 , H01L2924/12041 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H05K1/0295 , H05K3/3442 , H05K2201/09381 , H05K2201/09663 , H05K2201/09954 , H05K2201/10106 , H05K2201/10636 , H05K2203/048 , Y02P70/611
摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.
摘要翻译：公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是通过第一颈部部彼此互连。因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

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