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81. 发明申请

US20100047937A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20100047937A1
公开(公告)日：2010-02-25
申请号：US12612334
申请日：2009-11-04
申请人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
发明人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
IPC分类号： H01L21/50
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

82. 发明授权

US07663199B2 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US07663199B2
公开(公告)日：2010-02-16
申请号：US11442414
申请日：2006-05-30
申请人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim , Young Jae Song , Young Sam Park , Chang Ho Song
发明人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim , Young Jae Song , Young Sam Park , Chang Ho Song
IPC分类号： H01L29/78
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

83. 发明申请

US20090238271A1 APPARATUS AND METHOD FOR ENCODING AND DECODING USING ALTERNATIVE CONVERTER ACCODING TO THE CORRELATION OF RESIDUAL SIGNAL 审中-公开
标题翻译：使用替代转换器对残留信号的相关性进行编码和解码的装置和方法
公开(公告)号：US20090238271A1
公开(公告)日：2009-09-24
申请号：US12441940
申请日：2007-04-13
申请人： Dae-Yeon Kim , Jeong-Il Seo , Seung-Kwon Beack , In-Seon Jang , Dae-Young Jang , Jae-Gon Kim , Kyung-Ae Moon , Jin-Woo Hong , Jin-Woong Kim , Seoung-Jun Oh , Chang-Beom Ahn , Se-Yoon Jeong , Hae-Chul Choi , Yung-Lyul Lee , Dong-Gyu Sim , Sung-Chang Lim
发明人： Dae-Yeon Kim , Jeong-Il Seo , Seung-Kwon Beack , In-Seon Jang , Dae-Young Jang , Jae-Gon Kim , Kyung-Ae Moon , Jin-Woo Hong , Jin-Woong Kim , Seoung-Jun Oh , Chang-Beom Ahn , Se-Yoon Jeong , Hae-Chul Choi , Yung-Lyul Lee , Dong-Gyu Sim , Sung-Chang Lim
IPC分类号： H04N7/26 , H04N7/32
CPC分类号： H04N19/103 , H04N19/122 , H04N19/147 , H04N19/176 , H04N19/46 , H04N19/61
摘要： Provided is an apparatus and method for encoding and decoding using alternative transform units according to the correlation of residual signals. The video encoding apparatus includes a first transforming unit for performing discrete cosine transform (DCT), first quantization, first inverse quantization, and inverse DCT on a block basis onto residual coefficients generated after intra frame prediction or inter frame prediction; a second transforming unit for performing discrete sine transform (DST), second quantization, second inverse quantization, and inverse DST on a block basis onto the residual coefficients; a selecting unit for selecting one having a high compression rate between the first and second transforming units for each block through performing rate-distortion optimization; and a flag marking unit for recording information about the selected transforming unit at a flag bit provided on a macroblock basis.
摘要翻译：提供了根据残差信号的相关性使用替代变换单元进行编码和解码的装置和方法。视频编码装置包括：第一变换单元，用于以块为基础，对帧内预测或帧间预测后生成的残差系数进行离散余弦变换（DCT），第一量化，第一逆量化和逆DCT; 第二变换单元，用于以块为基础对剩余系数执行离散正弦变换（DST），第二量化，第二逆量化和反向DST; 选择单元，用于通过执行速率失真优化来为每个块选择具有高压缩率的第一和第二变换单元之间的压缩率; 以及标志标记单元，用于在以宏块为基础提供的标志位处记录关于所选择的变换单元的信息。

84. 发明授权

US07581853B2 LED package and backlight unit using the same 有权
标题翻译： LED封装和背光单元使用相同
公开(公告)号：US07581853B2
公开(公告)日：2009-09-01
申请号：US11594756
申请日：2006-11-09
申请人： Dae Yeon Kim , Young Sam Park
发明人： Dae Yeon Kim , Young Sam Park
IPC分类号： F21V5/04
CPC分类号： H01L33/58 , H01L33/46
摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.
摘要翻译：本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

85. 发明申请

US20090168399A1 BACKLIGHT UNIT 有权
标题翻译：背光单元
公开(公告)号：US20090168399A1
公开(公告)日：2009-07-02
申请号：US12400317
申请日：2009-03-09
申请人： Dae Yeon KIM , Young June Jeong , Hun Joo Hahm , Jae Hong Shin , Chang Ho Shin
发明人： Dae Yeon KIM , Young June Jeong , Hun Joo Hahm , Jae Hong Shin , Chang Ho Shin
IPC分类号： F21V9/16 , G09F13/04
CPC分类号： G02F1/133603 , F21K9/00 , F21K9/60 , G02F2001/133614 , G02F2001/133628 , H05K1/142
摘要： Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.
摘要翻译：提供了包括发光的多个发光二极管（LED）的背光单元; 多个LED模块，具有支撑并驱动多个LED的印刷电路板（PCB）; 多个光学片，其附接到各个LED模块的顶表面; 以及附接到各个LED模块的后表面的多个散热垫。

86. 外观设计

USD595246S1 Light-emitting diode 有权
公开(公告)号：USD595246S1
公开(公告)日：2009-06-30
申请号：US29325557
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han

87. 发明申请

US20090059579A1 Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same 有权
标题翻译：使用白色发光二极管的表面光源和具有相同的液晶显示器背光单元
公开(公告)号：US20090059579A1
公开(公告)日：2009-03-05
申请号：US12078717
申请日：2008-04-03
申请人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
发明人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
IPC分类号： F21V9/00 , H01J1/62
CPC分类号： G02F1/133603 , G02F1/133606 , G02F1/133611 , G09G3/3413 , G09G3/3426 , G09G2320/0233
摘要： There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.
摘要翻译：提供了一种使用白色发光二极管的表面光源，包括：布置成彼此预定距离的多个白色发光二极管，其中白色发光二极管被布置成使得由每个布置在与白色发光二极管最近距离的白色发光二极管和白色发光二极管中的相应的白色发光二极管的中心光量相对于白色发光二极管的平均光量为80％〜120％。

88. 发明申请

US20080310503A1 Method and apparatus for entropy-coding/entropy-decoding video data 有权
标题翻译：用于熵编码/熵解码视频数据的方法和装置
公开(公告)号：US20080310503A1
公开(公告)日：2008-12-18
申请号：US12108697
申请日：2008-04-24
申请人： Yung-Lyul LEE , Dae-yeon KIM
发明人： Yung-Lyul LEE , Dae-yeon KIM
IPC分类号： H04N11/04
CPC分类号： H04N19/91 , H04N19/61
摘要： Provided are a method and apparatus for entropy-encoding/entropy-decoding video data. The method of entropy-encoding video data includes binarizing coefficients of the frequency domain, which are generated by transforming a residual block of a current block into the frequency domain, using different binarization methods and performing binary arithmetic coding on the binarized coefficients. In this way, the coefficients are binarized adaptively according to whether the frequencies of the coefficients are high or low, thereby improving the compression efficiency of the video data.
摘要翻译：提供了一种用于熵编码/熵解码视频数据的方法和装置。熵编码视频数据的方法包括通过使用不同的二值化方法将当前块的残余块变换为频域而生成的频域二进制化系数，并对二值化系数进行二进制算术编码。以这种方式，根据系数的频率是高还是低来自适应地对系数进行二值化，从而提高视频数据的压缩效率。

89. 发明申请

US20080128736A1 Side-emitting LED package and manufacturing method of the same 审中-公开
公开(公告)号：US20080128736A1
公开(公告)日：2008-06-05
申请号：US12007297
申请日：2008-01-09
申请人： Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
发明人： Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

90. 发明授权

US07338823B2 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US07338823B2
公开(公告)日：2008-03-04
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
发明人： Kyung Taeg Han , Hun Joo Hahm , Dae Yeon Kim , Ho Sik Ahn , Seong Yeon Han , Young Sam Park , Seon Goo Lee
IPC分类号： H01L21/00 , H01L21/48
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

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