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    • 79. 发明授权
    • Semiconductor device and method for producing the same
    • 半导体装置及其制造方法
    • US5837569A
    • 1998-11-17
    • US777029
    • 1996-12-30
    • Naoki MakitaYoshitaka Yamamoto
    • Naoki MakitaYoshitaka Yamamoto
    • G02F1/136G02F1/1362G02F1/1368H01L21/20H01L21/336H01L21/77H01L21/84H01L27/12H01L29/49H01L29/78H01L29/786
    • H01L29/78654H01L21/2022H01L27/1277G02F1/13454H01L29/4908
    • According to the present invention, a method for producing a semiconductor device in which an active region made of a crystalline silicon film is formed on an insulating surface of a substrate is provided. The method includes the steps of: forming a first amorphous silicon film on the substrate; selectively introducing at least one kind of catalyst elements for promoting the crystallization of the first amorphous silicon film into a part of the first amorphous silicon film before or after forming the first amorphous silicon film; heating the first amorphous silicon film so as to crystallize the first amorphous silicon film in a direction substantially parallel to a surface of the substrate with respect to a region surrounding a region into which the catalyst elements are selectively introduced; forming an insulating thin film in a region on the crystalline silicon film in which crystals are grown in a direction substantially parallel to the surface of the substrate so as to partially remove the insulating thin film and the crystalline silicon film so that a linear boundary is formed along a crystal-growing direction of the crystalline silicon film; forming a second amorphous silicon film on the crystalline silicon film; and crystallizing the second amorphous silicon film by heating or by irradiating a laser beam or an intense light.
    • 根据本发明,提供一种半导体器件的制造方法,其中在基板的绝缘表面上形成由结晶硅膜制成的有源区。 该方法包括以下步骤:在衬底上形成第一非晶硅膜; 在形成第一非晶硅膜之前或之后,选择性地引入至少一种用于促进第一非晶硅膜在第一非晶硅膜的一部分中的结晶的催化剂元件; 加热所述第一非晶硅膜以使所述第一非晶硅膜相对于选择性地引入所述催化剂元件的区域的区域在基本上平行于所述基板的表面的方向上结晶; 在结晶硅膜上形成绝缘薄膜,其中晶体沿基本上平行于衬底表面的方向生长,从而部分去除绝缘薄膜和晶体硅膜,从而形成线性边界 沿着结晶硅膜的晶体生长方向; 在所述晶体硅膜上形成第二非晶硅膜; 并通过加热或照射激光束或强光使第二非晶硅膜结晶。