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    • 74. 发明申请
    • HEATING APPARATUS, VACUUM-HEATING METHOD AND METHOD FOR MANUFACTURING THIN FILM
    • 加热装置,真空加热方法和制造薄膜的方法
    • US20130189424A1
    • 2013-07-25
    • US13820141
    • 2012-06-28
    • Sadayuki OkazakiKazuyoshi Honda
    • Sadayuki OkazakiKazuyoshi Honda
    • H01M10/04
    • H01M10/04C23C14/24C23C14/243C23C14/562
    • Provided is a heating apparatus including: an object to be heated under vacuum; a heating body separable from the object to be heated, the heating body being configured so that a gap is formed between the heating body itself and the object to be heated; and a gas introduction channel for introducing a heat transfer gas into the gap. The object to be heated is heated by the heating body via the heat transfer gas. An example of the heating apparatus is a deposition apparatus 30. An example of the object to be heated is a storage container 9 that holds a deposition material and that has an opening for allowing the deposition material that has been vaporized to pass therethrough. An example of the heating body is a heating container 10 that detachably accommodates the storage container 9 and that has a heater 20 for heating the deposition material in the storage container 9. An example of the gas introduction channel is the gas introduction tube 11.
    • 本发明提供一种加热装置,包括:真空加热对象物; 加热体,其与被加热物体分离,所述加热体构造成在所述加热体本体与被加热体之间形成间隙, 以及用于将传热气体引入到间隙中的气体导入通道。 待加热物体由加热体通过传热气体加热。 加热装置的一个实例是沉积装置30.被加热物体的一个实例是保持沉积材料的储存容器9,并且具有允许已被蒸发的沉积材料通过的开口。 加热体的一个实例是可拆卸地容纳储存容器9的加热容器10,并且具有用于加热储存容器9中的沉积材料的加热器20.气体导入通道的一个例子是气体导入管11。
    • 75. 发明授权
    • Deposition apparatus and method for manufacturing film by using deposition apparatus
    • 沉积装置及其制造方法
    • US08241699B2
    • 2012-08-14
    • US12516328
    • 2008-03-10
    • Sadayuki OkazakiKazuyoshi HondaTomofumi YanagiShoichi Imashiku
    • Sadayuki OkazakiKazuyoshi HondaTomofumi YanagiShoichi Imashiku
    • C23C16/52
    • C23C14/562C23C14/02C23C14/226H01M4/0421H01M4/1395H01M10/052
    • A vapor deposition device 100 for moving a sheet-like substrate 4 in a roll-to-roll system in a chamber 2 to continuously form a vapor deposition film on the substrate 4. The vapor deposition device 100 comprises an evaporation source 9 for evaporating a vapor-depositing material; a transportation section including first and second rolls 3 and 8 for holding the substrate 4 in the state of being wound therearound and a guide section for guiding the substrate 4; and a shielding section, located in a vapor deposition possible zone, for forming a shielded zone which is not reachable by the vapor-depositing material from the evaporation source 9. Vapor deposition zones 60a through 60d include a planar transportation zone for transporting the substrate 4 such that the surface of the substrate 4 to be subjected to the vapor-depositing material is planar; and the transportation section is located with respect to the evaporation source 9 such that the vapor-depositing material is not incident on the substrate 4 in a direction of the normal to the substrate in the vapor deposition possible zone excluding the shielded zone.
    • 一种气相沉积装置100,用于在室2中的辊对辊系统中移动片状基底4,以在基底4上连续地形成气相沉积膜。气相沉积装置100包括蒸发源9 气相沉积材料; 一个传送部分,包括用于将基片4保持在其周围的状态的第一和第二辊子3和8;以及用于引导衬底4的引导部分; 以及位于气相沉积可能区域中的屏蔽部分,用于形成从蒸发源9不能通过气相沉积材料到达的屏蔽区域。蒸镀区域60a至60d包括用于输送基板4的平面输送区域 使得要经历气相沉积材料的基板4的表面是平面的; 并且运送部分相对于蒸发源9定位,使得气相沉积材料在除了屏蔽区域之外的气相沉积可能区域中不与基板的法线方向入射到基板4上。
    • 76. 发明申请
    • THIN FILM MANUFACTURING METHOD AND SILICON MATERIAL WHICH CAN BE USED IN THE METHOD
    • 薄膜制造方法和可用于该方法的硅材料
    • US20120100306A1
    • 2012-04-26
    • US13379282
    • 2010-07-01
    • Yuma KamiyamaKazuyoshi HondaYasuharu Shinokawa
    • Yuma KamiyamaKazuyoshi HondaYasuharu Shinokawa
    • B05D3/06C01B33/02B05D3/02
    • C23C14/246C01B33/02C23C14/14
    • Particles coming from an evaporation source 9 are deposited on a substrate 21 at a specified film forming position 33 in a vacuum so as to form a thin film on the substrate 21. A rod-shaped material 32 containing a source material of the thin film is melted above the evaporation source 9 and the melted material is supplied to the evaporation source 9 in the form of droplets 14. As the rod-shaped material 32, a rod-shaped silicon material in which a plurality of first regions each surrounded by a grain boundary are present at positions of 90% length from a center toward an outer peripheral part on a cross section perpendicular to a longitudinal direction of the material, and an area-weighted average value of major diameters of the first regions is 200 μm or less, and a plurality of second regions each surrounded by a grain boundary are present at positions of 50% length from the center toward the outer peripheral part, and an area-weighted average value of major diameters of the second regions is 1000 μm or more is used.
    • 来自蒸发源9的颗粒在真空中在指定的膜形成位置33处沉积在基板21上,以在基板21上形成薄膜。包含薄膜源材料的棒状材料32是 熔化在蒸发源9上方,并且熔融的材料以液滴14的形式供应到蒸发源9.作为棒状材料32,其中多个第一区域被颗粒包围的棒状材料 边界存在于与材料的纵向方向垂直的截面上从中心朝向外周部的长度为90%的位置,第一区域的长径的面积加权平均值为200μm以下, 并且由晶界包围的多个第二区域存在于从中心向外周部分的长度为50%的位置处,并且第二区域的主要直径的面积加权平均值 区域为1000μm以上。