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    • 77. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US06726802B2
    • 2004-04-27
    • US10211498
    • 2002-08-02
    • Takamitsu TaderaTatsushi YamamotoMasaki HirayamaTadahiro Ohmi
    • Takamitsu TaderaTatsushi YamamotoMasaki HirayamaTadahiro Ohmi
    • H05H100
    • H01J37/32211H01J37/32192H01J37/32266
    • A plasma processing apparatus includes a slot plate having a slot-formed region for passing microwave from a waveguide to a microwave entrance window, and a slot plate drive unit driving the slot plate to change the position of the slot plate with respect to the microwave entrance window. The slot plate is thus moved with respect to the microwave entrance window to change at least one of the position, number and area of slot openings where the microwave is passed. The plasma processing apparatus accordingly ensures uniform plasma processing even if the process condition significantly changes when films on a large-area substrate or wafer to be processed are made of different materials or a stacked-layer film composed of layers of different materials is to be processed.
    • 等离子体处理装置包括:槽板,其具有用于将微波从波导传递到微波入口窗口的槽形区域;以及槽板驱动单元,其驱动槽板以改变槽板相对于微波入口的位置 窗口。 狭缝板因此相对于微波入口窗移动,以改变微波通过的槽口的位置,数量和面积中的至少一个。 因此,等离子体处理装置即使在待处理的大面积基板或晶片上的膜由不同的材料制成或由不同材料的层构成的叠层膜将被处理时,即使处理条件显着变化,也能确保均匀的等离子体处理 。